H5AN8G8NAFR-UHI vs H5AN8G8NAFR-VKC 对比

详细并排对比 H5AN8G8NAFR-UHI 出自 SK hynix 和 H5AN8G8NAFR-VKC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G8NAFR-UHI H5AN8G8NAFR-UHI - 8Gb DDR4-2400 x8 SDRAM | SK Hynix

H5AN8G8NAFR-UHI - 8Gb DDR4-2400 x8 SDRAM | SK Hynix

H5AN8G8NAFR-UHI ✓ 量产中
SK hynix
H5AN8G8NAFR-VKC H5AN8G8NAFR-VKC - 8Gb DDR4-2666 SDRAM 1.2V | SK hynix

H5AN8G8NAFR-VKC - 8Gb DDR4-2666 SDRAM 1.2V | SK hynix

H5AN8G8NAFR-VKC ✓ 量产中

规格对比

参数 H5AN8G8NAFR-UHI H5AN8G8NAFR-VKC
品牌 SK hynix SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $4.10 $4.15
存储器类型 DDR4 SDRAM DDR4 SDRAM
Memory Density 8 Gb —
存储组织 1G x 8 1G x 8
数据速率 DDR4-2400 (PC2400), 1200 MHz clock —
电源电压 1.2 V —
接口 DDR4 (JEDEC-class) SSTL12
封装 78-ball FBGA 78-ball FBGA
安装类型 Surface Mount Surface Mount
Lead Free Yes —
无卤 Yes —
RoHS 状态 Compliant Compliant (Lead-Free & Halogen-Free)
Technology CMOS —
Application Main memory (high density, high bandwidth) —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
CAS 延迟 [DATA_NEEDED: CAS latency for UHI speed grade] —
Refresh [DATA_NEEDED: refresh specification] —
MSL 等级 [DATA_NEEDED: moisture sensitivity level] —
Density — 8 Gb
Speed Grade — DDR4-2666 (VKC bin)
Supply Voltage (VDD) — 1.2 V
Burst Length — 8 (BL8)
Bank Group Architecture — Supported (per DDR4 JEDEC architecture)
On-Die Termination (ODT) — Yes
DLL — Yes (DLL for output skew control)
Process Technology — CMOS
Recommended Application — Main memory requiring large density and high bandwidth

数据手册与资源

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