H5AN8G8NCJR-RDC vs H5AN8G8NCJR-PBC 对比

详细并排对比 H5AN8G8NCJR-RDC 出自 SK hynix 和 H5AN8G8NCJR-PBC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G8NCJR-RDC H5AN8G8NCJR-RDC - 8Gb DDR4 SDRAM x8 2666Mbps | SK Hynix

H5AN8G8NCJR-RDC - 8Gb DDR4 SDRAM x8 2666Mbps | SK Hynix

H5AN8G8NCJR-RDC ✓ 量产中
SK hynix
H5AN8G8NCJR-PBC H5AN8G8NCJR-PBC - 8Gb DDR4 SDRAM, 1.2V | SK Hynix

H5AN8G8NCJR-PBC - 8Gb DDR4 SDRAM, 1.2V | SK Hynix

H5AN8G8NCJR-PBC ✓ 量产中

规格对比

参数 H5AN8G8NCJR-RDC H5AN8G8NCJR-PBC
品牌 SK hynix SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.70 $2.40
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb (1 GB) —
存储组织 x8 1G x 8 (x8)
数据速率 up to 2666 Mbps [DATA_NEEDED: data rate for -PBC speed grade (Mbps/MT/s)]
电源电压 1.2 V (VDD) —
接口 DDR4 (JEDEC standard) —
Bank Architecture 4 bank groups x 4 banks —
Burst Length BL8 BL8
封装 78-ball FBGA 78-ball FBGA
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range for -RDC suffix] [DATA_NEEDED: operating temperature range]
CAS 延迟 [DATA_NEEDED: CAS latency for -RDC speed grade] —
Generation C-die family (NCJR) —
Lead Free Yes —
无卤 Yes —
RoHS 状态 Compliant Lead-Free & Halogen-Free
存储容量 — 8 Gb (1 GB)
Supply Voltage (VDD) — 1.2 V
Interface Voltage (VDDQ) — 1.2 V (SSTL12)
Architecture — CMOS, fully synchronous, dual-edge clocked
Bank Structure — 8 internal banks, bank-group architecture
特性 — ODT, DM, DQS strobes, programmable CAS latency, self-refresh
Die Revision Family — CJR (H5AN8G8NCJR-xxC)
Refresh — Auto-refresh and self-refresh
Typical Applications — PC/server main memory, embedded solder-down memory

数据手册与资源

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