H5AN8G8NCJR-VKI vs K4A8G085WC-BCTD 对比

详细并排对比 H5AN8G8NCJR-VKI 出自 SK hynix 和 K4A8G085WC-BCTD 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G8NCJR-VKI H5AN8G8NCJR-VKI - DDR4 8Gb 2666Mbps DRAM | SK hynix

H5AN8G8NCJR-VKI - DDR4 8Gb 2666Mbps DRAM | SK hynix

H5AN8G8NCJR-VKI ✓ 量产中
Samsung Electronics
K4A8G085WC-BCTD K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung

K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung

K4A8G085WC-BCTD ⚠ 最后一次采购

规格对比

参数 H5AN8G8NCJR-VKI K4A8G085WC-BCTD
品牌 SK hynix Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $4.85 $50.85
存储器类型 DDR4 SDRAM DDR4 SDRAM
存储容量 8 Gb —
Memory Organization 1G x8 —
数据速率 2666 Mbps 2666 Mbps (PC4-2133)
电源电压 1.2 V —
接口 Parallel —
Memory Format DRAM —
Volatile Yes —
封装 FBGA-78 78-ball FBGA (78FBGA)
安装类型 Surface Mount Surface Mount
Grade Industrial (I suffix) —
工作温度 [DATA_NEEDED: Operating Temperature] 0C to +95C
Technology CMOS —
Product Family H5AN8G8NCJR-xxC/xI DDR4 SDRAM —
Packaging Tray —
Product Status Active —
RoHS 状态 [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
Density — 8 Gb
存储组织 — 1G x 8
Supply Voltage (VDD/VDDQ) — 1.2 V (1.14 V to 1.26 V)
Ball Pitch — 0.8 mm
Standard Operating Temp Range — 0C to +85C
Burst Length — 8 (chop 4)
Auto Precharge — Yes
Asynchronous Reset — Yes
CRC Function — Yes
ZQ Calibration — Yes
Dynamic ODT — Yes
Data Mask — Yes
接口类型 — Synchronous, parallel

数据手册与资源

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