K4A4G085WG-BCWE vs K4A4G085WE-BCRC 对比

详细并排对比 K4A4G085WG-BCWE 出自 Samsung Electronics 和 K4A4G085WE-BCRC 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A4G085WG-BCWE K4A4G085WG-BCWE - 4Gb DDR4 3200Mbps SDRAM | Samsung

K4A4G085WG-BCWE - 4Gb DDR4 3200Mbps SDRAM | Samsung

K4A4G085WG-BCWE ✓ 量产中
Samsung Electronics
K4A4G085WE-BCRC K4A4G085WE-BCRC - 4Gb DDR4-2400 x8 SDRAM | Samsung

K4A4G085WE-BCRC - 4Gb DDR4-2400 x8 SDRAM | Samsung

K4A4G085WE-BCRC ✓ 量产中

规格对比

参数 K4A4G085WG-BCWE K4A4G085WE-BCRC
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.68 $1.36
存储器类型 DDR4 SDRAM (Volatile) DDR4 SDRAM
存储容量 4 Gb —
Memory Organization 512M x 8 —
数据速率 3200 Mbps/pin 2400 Mbps
Speed Class DDR4-3200 —
Supply Voltage (VDD) 1.2 V 1.2 V
Technology D-die DDR4 —
封装 FBGA-78 (BCW) FBGA-78
安装类型 Surface Mount Surface Mount
接口 Parallel (DDR4) Parallel
Burst Length BL8 —
DLL Mode DLL Enabled (per datasheet timing) —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating Temperature Range]
Refresh [DATA_NEEDED: refresh rate specification] 8n / 1X refresh (per JEDEC DDR4)
RoHS 状态 Compliant Compliant (per LCSC listing)
Packaging Tray —
Density — 4 Gbit
存储组织 — 512M x 8
Clock Cycle Time (tCK) — 0.833 ns
I/O Voltage (VDDQ) — 1.2 V
Core Voltage (VPP) — 2.5 V
Process Node Family — Samsung E-die
Bank Groups — 4n prefetch DDR4 architecture
MSL 等级 — [DATA_NEEDED: Moisture Sensitivity Level]

数据手册与资源

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