K4A4G165WG-BCWE vs MT40A256M16LY-062E 对比

详细并排对比 K4A4G165WG-BCWE 出自 Samsung Electronics 和 MT40A256M16LY-062E 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A4G165WG-BCWE K4A4G165WG-BCWE - 4Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung

K4A4G165WG-BCWE - 4Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung

K4A4G165WG-BCWE ✓ 量产中
Micron Technology
MT40A256M16LY-062E MT40A256M16LY-062E - 4Gb DDR4 SDRAM x16 | Micron

MT40A256M16LY-062E - 4Gb DDR4 SDRAM x16 | Micron

MT40A256M16LY-062E ✓ 量产中

规格对比

参数 K4A4G165WG-BCWE MT40A256M16LY-062E
品牌 Samsung Electronics Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $16.90 $5.30
存储器类型 DDR4 SDRAM (volatile DRAM) DDR4 SDRAM
存储容量 4 Gbit 4 Gbit
Memory Organization 256M x 16 —
接口 Parallel Parallel
数据速率 3200 Mbps —
Access Time 19 ns —
电源电压 1.2 V —
工作温度 0C to +85C —
封装 FBGA-96 96-FBGA (7.5 x 13.5 mm)
安装类型 Surface Mount Surface Mount
Memory Format DRAM —
Technology DDR4 —
Product Status Active —
RoHS 状态 Compliant (per JLCPCB listing) Compliant (F = RoHS/lead-free finish)
Clock Frequency [DATA_NEEDED: clock frequency / tCK range] 1.6 GHz
CAS 延迟 [DATA_NEEDED: CAS latency] —
Refresh Rate [DATA_NEEDED: refresh interval] —
存储组织 — 256M x16
Access Time (tAA) — 19 ns
Supply Voltage (VDD) — 1.2 V
Data Rate Class — DDR4-2666 (062E speed grade)
Operating Temperature (IT variant) — -40C to +95C
Auto Self-Refresh — Yes
Auto Precharge — Yes
Write Leveling — Yes
CRC (Command/Address) — Yes
Data Mask (DM) — Yes
Dynamic On-Chip Termination (ODT) — Yes
ZQ Calibration — Yes
FBGA Code — D9XSG (AUT variant)

数据手册与资源

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