K4A8G085WB-BIWE vs MT40A1G8SA-075:E 对比

详细并排对比 K4A8G085WB-BIWE 出自 Samsung Electronics 和 MT40A1G8SA-075:E 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A8G085WB-BIWE K4A8G085WB-BIWE - 8Gb DDR4 SDRAM 3200Mbps | Samsung

K4A8G085WB-BIWE - 8Gb DDR4 SDRAM 3200Mbps | Samsung

K4A8G085WB-BIWE ✓ 量产中
Micron Technology
MT40A1G8SA-075:E MT40A1G8SA-075:E - 8Gb DDR4 SDRAM 1.33GHz | Micron

MT40A1G8SA-075:E - 8Gb DDR4 SDRAM 1.33GHz | Micron

MT40A1G8SA-075:E ✓ 量产中

规格对比

参数 K4A8G085WB-BIWE MT40A1G8SA-075:E
品牌 Samsung Electronics Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $6.50 $6.30
存储器类型 DDR4 SDRAM SDRAM - DDR4
存储容量 8 Gb 8Gbit (1G x 8)
Memory Organization 1G x 8 —
数据速率 3200 Mbps 2666 MT/s
电源电压 1.2 V —
工作温度 0°C to +85°C —
封装 78-FBGA 78-FBGA (7.5x11 mm)
安装类型 Surface Mount Surface Mount
Memory Interface Parallel —
Access Time [DATA_NEEDED: tRCD, tRP, tRAS] —
CAS 延迟 [DATA_NEEDED: CL value] —
Refresh Auto-refresh, self-refresh —
RoHS 状态 Compliant Compliant
Lead-Free Yes —
无卤 Yes —
接口 — Parallel
Clock Frequency — 1.33 GHz
Supply Voltage (VDD/VDDQ) — 1.2V ±60mV
VPP Supply Voltage — 2.5V (-125mV, +250mV)
工作温度范围 — 0°C to +95°C
Refresh Time — 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C to 105°C
Write Leveling — Supported
Dynamic On-Chip Termination — Supported
CRC Function — Supported
Data Mask Function — Supported

数据手册与资源

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