K4A8G165WC-BCWE vs AS4C512M16D4A-62BCNTR 对比

详细并排对比 K4A8G165WC-BCWE 出自 Samsung Electronics 和 AS4C512M16D4A-62BCNTR 出自 Alliance Memory。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A8G165WC-BCWE K4A8G165WC-BCWE - 8Gb DDR4-3200 SDRAM | Samsung | 96FBGA

K4A8G165WC-BCWE - 8Gb DDR4-3200 SDRAM | Samsung | 96FBGA

K4A8G165WC-BCWE ✓ 量产中
Alliance Memory
AS4C512M16D4A-62BCNTR AS4C512M16D4A-62BCNTR - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BCNTR - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BCNTR ✓ 量产中

规格对比

参数 K4A8G165WC-BCWE AS4C512M16D4A-62BCNTR
品牌 Samsung Electronics Alliance Memory
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $38.00 $8.10
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb —
存储组织 512M x 16 —
数据速率 3200 Mbps 3200 MT/s
Supply Voltage (VDD) 1.2 V —
VPP Voltage 2.5 V —
工作温度范围 0°C to +95°C —
封装 96-FBGA 96-FBGA (7.5x13 mm)
安装类型 Surface Mount Surface Mount
CAS 延迟 [DATA_NEEDED: CAS Latency] 18 ns
Burst Length 8 (BL8) / 4 (BC4) —
Number of Banks 16 —
Row Address Bits 16 —
Column Address Bits 10 —
接口 Differential (CK, /CK) POD (Pseudo Open Drain)
RoHS 状态 Compliant —
JEDEC Standard JEDEC DDR4 —
存储容量 — 8 Gbit (512M x 16)
电源电压 — 1.14V ~ 1.26V (nominal 1.2V)
Clock Rate — 1600 MHz (DDR4-3200)
工作温度 — 0°C to +95°C (Commercial)
Refresh — Auto-refresh and self-refresh
RoHS — Compliant
Moisture Sensitivity Level — 3 (168 Hours)
Write Cycle Time - Word, Page — 15 ns
Standard Pack — 1500/reel (Tape & Reel)

数据手册与资源

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