K4B4G1646E-BYK0 vs H5TC4G63CFR-H9A 对比

详细并排对比 K4B4G1646E-BYK0 出自 Samsung Electronics 和 H5TC4G63CFR-H9A 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4B4G1646E-BYK0 K4B4G1646E-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK0 ✓ 量产中
SK hynix
H5TC4G63CFR-H9A H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix

H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix

H5TC4G63CFR-H9A ✓ 量产中

规格对比

参数 K4B4G1646E-BYK0 H5TC4G63CFR-H9A
品牌 Samsung Electronics SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1.80 $6.50
存储器类型 DDR3L SDRAM DDR3L SDRAM
Density 4 Gb —
存储组织 256M x 16 256M x 16
电源电压 1.35 V (1.283 V to 1.45 V) —
数据速率 DDR3-1600 (800 MHz) [DATA_NEEDED: Data rate (e.g., 1866 Mbps)]
封装 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) 96-ball TFBGA
工作温度 0°C to +95°C (TC) —
CAS 延迟 11 (CL-tRCD-tRP) [DATA_NEEDED: CAS latency]
Burst Length 8 (fixed), 4 (burst chop) 8, 4 (with burst chop)
On-Die Termination Yes (dynamic ODT) —
ZQ Calibration Yes —
Auto Precharge Yes —
Self-Refresh Yes —
Asynchronous Reset Yes —
Data Mask Yes —
RoHS Compliant —
Memory Density — 4Gb (4294967296 bit)
Supply Voltage (VDD) — 1.35V + 0.100 / - 0.067V
Supply Voltage (VDDQ) — 1.35V + 0.100 / - 0.067V
Number of Terminals — 96
Package Shape — RECTANGULAR
工作温度范围 — [DATA_NEEDED: Operating temperature range]
RoHS 状态 — Compliant
Lead-Free — Yes
无卤 — Yes
Differential Clock Inputs — Yes (CK, CK)
Differential Data Strobe — Yes (DQS, DQS)
On-Chip DLL — Yes
DM (Data Mask) — Yes

数据手册与资源

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