K4RCH046VM-2CCM vs K4RBH046VM-BCCP 对比

详细并排对比 K4RCH046VM-2CCM 出自 Samsung Electronics 和 K4RBH046VM-BCCP 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4RCH046VM-2CCM K4RCH046VM-2CCM - DDR5 32Gb 5600Mbps DRAM | Samsung

K4RCH046VM-2CCM - DDR5 32Gb 5600Mbps DRAM | Samsung

K4RCH046VM-2CCM Nrnd
Samsung Electronics
K4RBH046VM-BCCP K4RBH046VM-BCCP - 32Gb DDR5 6400Mbps DRAM | Samsung

K4RBH046VM-BCCP - 32Gb DDR5 6400Mbps DRAM | Samsung

K4RBH046VM-BCCP ✓ 量产中

规格对比

参数 K4RCH046VM-2CCM K4RBH046VM-BCCP
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $0.00 $9.60
存储器类型 DDR5 SDRAM DDR5 SDRAM
Density 32 Gb —
存储组织 4G x 4 —
数据速率 5600 Mbps 6400 Mbps
电源电压 1.1 V 1.1 V
工作温度 0 to 85 C 0 C to +85 C
封装 78-ball FBGA 78-FBGA
安装类型 Surface Mount Surface Mount
Product Status Sample Sample / Active
Access Latency (CL) [DATA_NEEDED: CAS latency] [DATA_NEEDED: CAS Latency]
Refresh Rate [DATA_NEEDED: refresh rate] —
接口类型 [DATA_NEEDED: interface type] —
MSL 等级 [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: MSL Level]
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS Status]
On-Die ECC [DATA_NEEDED: on-die ECC support] —
存储容量 — 32 Gb
Memory Organization — 2G x 4
接口 — Parallel
Memory Format — DRAM
Technology — DDR5
Packaging — Tray

数据手册与资源

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