K4RCH046VM-2CCM vs K4RBH046VM-BCCP Comparison
Detailed side-by-side comparison of K4RCH046VM-2CCM by Samsung Electronics and K4RBH046VM-BCCP by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4RCH046VM-2CCM | K4RBH046VM-BCCP |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $9.60 |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM |
| Density | 32 Gb | — |
| Organization | 4G x 4 | — |
| Data Rate | 5600 Mbps | 6400 Mbps |
| Supply Voltage | 1.1 V | 1.1 V |
| Operating Temperature | 0 to 85 C | 0 C to +85 C |
| Package | 78-ball FBGA | 78-FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Product Status | Sample | Sample / Active |
| Access Latency (CL) | [DATA_NEEDED: CAS latency] | [DATA_NEEDED: CAS Latency] |
| Refresh Rate | [DATA_NEEDED: refresh rate] | — |
| Interface Type | [DATA_NEEDED: interface type] | — |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL Level] |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | — |
| Memory Size | — | 32 Gb |
| Memory Organization | — | 2G x 4 |
| Interface | — | Parallel |
| Memory Format | — | DRAM |
| Technology | — | DDR5 |
| Packaging | — | Tray |