K9DVGB8U5M vs K9PDG08U5M 对比

详细并排对比 K9DVGB8U5M 出自 Samsung Electronics 和 K9PDG08U5M 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ 量产中
Samsung Electronics
K9PDG08U5M K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M ✗ 停产

规格对比

参数 K9DVGB8U5M K9PDG08U5M
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs EEPROM
生命周期状态 有效 停产
库存状态 有库存 有库存
单价(USD) $3.05 $4.20
存储器类型 NAND Flash NAND Flash (SLC)
存储组织 [DATA_NEEDED: capacity organization] x8 (multiplexed I/O)
接口 Asynchronous x8-bit I/O —
电源电压 [DATA_NEEDED: VCC range] [DATA_NEEDED: supply voltage range]
封装 [DATA_NEEDED: package type and dimensions] TSOP1-48
安装类型 Surface Mount Surface Mount
Page Size [DATA_NEEDED: main page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: erase block size] [DATA_NEEDED: block size]
Read Time (tR) [DATA_NEEDED: page read cycle time] —
Program Time (tPROG) [DATA_NEEDED: page program time] —
Erase Time (tBERS) [DATA_NEEDED: block erase time] —
Endurance [DATA_NEEDED: program/erase cycles] [DATA_NEEDED: program/erase cycles]
Data Retention [DATA_NEEDED: retention specification] —
工作温度 [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
Access Interface Signals CLE, ALE, WE, RE, CE, R/B, WP —
Bad Block Management Host-managed (controller ECC and bad-block table required) —
RoHS 状态 [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Density — 4 Gbit
Page Read Time — [DATA_NEEDED: page read time]
Page Program Time — [DATA_NEEDED: page program time]
Block Erase Time — [DATA_NEEDED: block erase time]
Access Interface — Asynchronous multiplexed address/data, CLE/ALE control
Ready/Busy Output — Yes (R/B, open-drain)
Write Protect Pin — Yes (/WP)

数据手册与资源

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