K9PDG08U5M vs K9DVGB8U5M 对比

详细并排对比 K9PDG08U5M 出自 Samsung Electronics 和 K9DVGB8U5M 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K9PDG08U5M K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M ✗ 停产
Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ 量产中

规格对比

参数 K9PDG08U5M K9DVGB8U5M
品牌 Samsung Electronics Samsung Electronics
分类 EEPROM Memory ICs
生命周期状态 停产 有效
库存状态 有库存 有库存
单价(USD) $4.20 $3.05
存储器类型 NAND Flash (SLC) NAND Flash
Density 4 Gbit —
存储组织 x8 (multiplexed I/O) [DATA_NEEDED: capacity organization]
电源电压 [DATA_NEEDED: supply voltage range] [DATA_NEEDED: VCC range]
封装 TSOP1-48 [DATA_NEEDED: package type and dimensions]
安装类型 Surface Mount Surface Mount
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: main page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: erase block size]
Page Read Time [DATA_NEEDED: page read time] —
Page Program Time [DATA_NEEDED: page program time] —
Block Erase Time [DATA_NEEDED: block erase time] —
Access Interface Asynchronous multiplexed address/data, CLE/ALE control —
Ready/Busy Output Yes (R/B, open-drain) —
Write Protect Pin Yes (/WP) —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: temperature range]
Endurance [DATA_NEEDED: program/erase cycles] [DATA_NEEDED: program/erase cycles]
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
接口 — Asynchronous x8-bit I/O
Read Time (tR) — [DATA_NEEDED: page read cycle time]
Program Time (tPROG) — [DATA_NEEDED: page program time]
Erase Time (tBERS) — [DATA_NEEDED: block erase time]
Data Retention — [DATA_NEEDED: retention specification]
Access Interface Signals — CLE, ALE, WE, RE, CE, R/B, WP
Bad Block Management — Host-managed (controller ECC and bad-block table required)

数据手册与资源

浏览全部产品 创建 BOM 获取报价