K9PDG08U5M vs K9DVGB8U5M 비교

다음의 상세 나란히 비교: K9PDG08U5M 제조: Samsung Electronics 및 K9DVGB8U5M 제조: Samsung Electronics. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Samsung Electronics
K9PDG08U5M K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M ✗ 단종
Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ 활성

사양 비교

파라미터 K9PDG08U5M K9DVGB8U5M
브랜드 Samsung Electronics Samsung Electronics
카테고리 EEPROM Memory ICs
수명 주기 상태 수명 종료 활성
재고 상태 In Stock In Stock
단가 (USD) $4.20 $3.05
메모리 유형 NAND Flash (SLC) NAND Flash
Density 4 Gbit —
메모리 구성 x8 (multiplexed I/O) [DATA_NEEDED: capacity organization]
공급 전압 [DATA_NEEDED: supply voltage range] [DATA_NEEDED: VCC range]
패키지 TSOP1-48 [DATA_NEEDED: package type and dimensions]
실장 유형 Surface Mount Surface Mount
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: main page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: erase block size]
Page Read Time [DATA_NEEDED: page read time] —
Page Program Time [DATA_NEEDED: page program time] —
Block Erase Time [DATA_NEEDED: block erase time] —
Access Interface Asynchronous multiplexed address/data, CLE/ALE control —
Ready/Busy Output Yes (R/B, open-drain) —
Write Protect Pin Yes (/WP) —
동작 온도 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: temperature range]
Endurance [DATA_NEEDED: program/erase cycles] [DATA_NEEDED: program/erase cycles]
RoHS 상태 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
인터페이스 — Asynchronous x8-bit I/O
Read Time (tR) — [DATA_NEEDED: page read cycle time]
Program Time (tPROG) — [DATA_NEEDED: page program time]
Erase Time (tBERS) — [DATA_NEEDED: block erase time]
Data Retention — [DATA_NEEDED: retention specification]
Access Interface Signals — CLE, ALE, WE, RE, CE, R/B, WP
Bad Block Management — Host-managed (controller ECC and bad-block table required)

데이터시트 & 자료

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