MRF8P20160HSR3 vs MRF8P20161HSR3 对比

详细并排对比 MRF8P20160HSR3 出自 NXP Semiconductors 和 MRF8P20161HSR3 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MRF8P20160HSR3 MRF8P20160HSR3 - 37W RF Power MOSFET 1880-2025 MHz | NXP

MRF8P20160HSR3 - 37W RF Power MOSFET 1880-2025 MHz | NXP

MRF8P20160HSR3 ✓ 量产中
NXP Semiconductors
MRF8P20161HSR3 MRF8P20161HSR3 - 37W 1880-2025MHz RF Power MOSFET | NXP

MRF8P20161HSR3 - 37W 1880-2025MHz RF Power MOSFET | NXP

MRF8P20161HSR3 ✓ 量产中

规格对比

参数 MRF8P20160HSR3 MRF8P20161HSR3
品牌 NXP Semiconductors NXP Semiconductors
分类 MOSFETs MOSFETs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $64.80 $99.50
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Part Number MRF8P20160HSR3 —
晶体管类型 N-Channel Enhancement-Mode Lateral MOSFET N-Channel Lateral MOSFET (RF Power)
Technology HV8 lateral RF MOSFET —
Frequency Band 1880 MHz to 2025 MHz —
Output Power (Average) 37 W (Single-Carrier W-CDMA) —
Drain Supply Voltage (VDD) 28 Vdc —
Quiescent Drain Current (IDQA) 550 mA —
Power Gain (Typ) 16.5 dB at 1.92 GHz —
Test Frequency 1.92 GHz 1.92 GHz
封装 / 外壳 NI-780S-4 (ceramic flanged) —
安装方式 Screw-down flange (through-hole) —
Operating Class Class AB or Class C Class AB or Class C
Junction Temperature (Max) 200 C (S-prefix sample-tested) —
Application W-CDMA / LTE / TD-SCDMA base-station PA CDMA / cellular base station RF power amplifier
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Lead Finish [DATA_NEEDED: lead finish] —
Frequency Range — 1880 MHz to 2025 MHz
Drain Supply Voltage (Vdd) — 28 V
Average Output Power — 37 W (W-CDMA)
Small-Signal Gain — 16.4 dB at 1.92 GHz
Quiescent Drain Current (Idq) — 550 mA
封装 — NI-780S-4 (NI-780HS-4) ceramic air-cavity, surface mount
安装类型 — Surface mount with screw-down flange
Polarity / Channel — N-Channel enhancement-mode lateral
Modulation Support — W-CDMA, LTE, multi-carrier GSM
Operating Mode — Enhancement mode

数据手册与资源

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