MT40A1G8WE-075E vs K4A8G165WB-BIWE 对比
详细并排对比 MT40A1G8WE-075E 出自 Micron Technology 和 K4A8G165WB-BIWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MT40A1G8WE-075E | K4A8G165WB-BIWE |
|---|---|---|
| 品牌 | Micron Technology | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $11.90 | $14.22 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| 存储容量 | 8 Gbit (1G x 8) | — |
| 数据速率 | 2666 MT/s (1.33 GHz) | 3200 Mbps |
| Supply Voltage (VDD/VDDQ) | 1.2V ±60mV | — |
| VPP Supply | 2.5V (-125mV, +250mV) | — |
| Operating Temperature (TC) | -40°C to +105°C (industrial) | — |
| Refresh Time (8192 cycles) | 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C to 105°C | — |
| 封装 | 78-ball FBGA (8x12mm) | 96-ball FBGA |
| 安装类型 | Surface Mount | Surface Mount |
| I/O Type | 1.2V pseudo-open-drain | — |
| VREFDQ | On-die, internal, adjustable | — |
| Burst Length | 8 and 4 | 8, 16 |
| CAS 延迟 | Programmable | [DATA_NEEDED: CAS Latency] |
| RoHS 状态 | Compliant | — |
| AEC-Q100 | Optional (AIT variant) | — |
| Density | — | 8 Gb |
| 存储组织 | — | 512M x 16 |
| 电源电压 | — | 1.2 V |
| 工作温度 | — | -40°C to +95°C |
| 接口 | — | Parallel |
| Refresh | — | Auto-refresh, Self-refresh |
| On-Die Termination | — | Yes |
| RoHS | — | Compliant |
| 引脚数 | — | 96 |