MT40A2G8AG-062E vs H5ANAG8NBJR-VKC 对比
详细并排对比 MT40A2G8AG-062E 出自 Micron Technology 和 H5ANAG8NBJR-VKC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MT40A2G8AG-062E | H5ANAG8NBJR-VKC |
|---|---|---|
| 品牌 | Micron Technology | SK hynix |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $9.75 | $8.60 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gbit |
| 存储组织 | 2G x 8 | 2G x 8 |
| Speed | DDR4-3200 (3200 MT/s) | — |
| Clock Frequency | 1600 MHz | 1.6 GHz (internal interface per distributor data) |
| Access Time (Clock Cycle Time) | 0.625 ns (tCK) | — |
| CAS 延迟 | CL22 (DDR4-3200) | — |
| Access Time | 19 ns | — |
| Supply Voltage VDD | 1.2 V | — |
| I/O Interface | POD12 (1.2 V pseudo-open drain) | — |
| VPP Voltage | 2.5 V | — |
| Number of Banks | 16 (4 bank groups x 4 banks) | — |
| Operating Temperature (AUT grade) | -40C to +95C (per Micron grade table) | — |
| 封装 | 78-FBGA (7.5 x 11 mm) | FBGA-78 |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | Compliant, Lead-Free and Halogen-Free |
| Die Revision | AG (current generation) | — |
| Speed Grade | — | DDR4-2666 (2666 Mbps/pin) |
| 电源电压 | — | 1.14 V to 1.26 V (VDDQ) |
| 工作温度 | — | 0C to +85C |
| Standby Current | — | 30 mA (operating, per distributor listing) |
| Auto Self-Refresh | — | Yes |
| Data Mask Function | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Asynchronous Reset | — | Yes |
| ZQ Calibration | — | Yes |
| Write Leveling | — | Yes |
| CRC Function | — | Yes |
| Auto Precharge | — | Yes |
| Refresh Interval | — | [DATA_NEEDED: tREFI refresh interval] |