10M04SCE144I7G - MAX 10 FPGA, 4K LE, 144-EQFP | Intel
料号： 10M04SCE144I7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $20.52 | $20.52 |
| 10 | $18.46 | $184.60 |
| 100 | $15.39 | $1,539.00 |
| 500 | $12.83 | $6,415.00 |
| 1,000 | $10.26 | $10,260.00 |
10M04SCE144I7G 概述
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs), programmable interconnect, and configurable I/O cells, allowing hardware functionality to be defined after PCB assembly. The MAX 10 family extends the FPGA hierarchy to include on-die flash, integrated ADCs, and DSP blocks, positioning it between pure CPLDs (such as MAX II/V) and higher-density FPGAs (such as Cyclone IV/V or Arria V) for cost-sensitive industrial designs.
Key features of the 10M04SCE144I7G include 4,000 logic elements, 250 Kbits of embedded SRAM organized in M9K blocks, 12 dedicated 18x18 hardware multipliers, an integrated 1 Msps 12-bit ADC, and approximately 1.4 Mb of user flash memory. It supports single 3.0 V or 3.3 V core operation, consumes approximately 65 mW of static power per core, and offers industrial-grade temperature operation from -40 °C to +100 °C. The device also provides Nios II soft-core-compatible architecture support, JTAG configuration, and bitstream encryption for IP security.
Architecturally, the 10M04 uses a look-up-table (LUT) based logic fabric, 9-Kbit M9K memory blocks, variable-precision DSP blocks, and a flash-based configuration subsystem. The exposed thermal pad (EQFP) supports efficient heat dissipation for sustained operation in sealed industrial enclosures. Compared to SRAM-based FPGAs, the on-die flash eliminates boot-time latency and external configuration memory cost.
Typical applications include industrial motor control, factory automation I/O expansion, portable medical instrument front-ends, low-cost video bridging, and IoT edge nodes requiring on-board flash. The integrated ADC and user flash also make it a strong fit for sensor aggregation and standalone embedded control designs.
When designing with this part, ensure proper decoupling (100 nF + 10 µF) on all VCCINT/VCCA pins and adequate copper area beneath the exposed pad to maintain junction temperature within industrial limits. Configuration mode, JTAG chain ordering, and dual-purpose pin (GPIO/JTAG) selection should be planned at schematic capture to avoid pinout rework late in the cycle.
This page consolidates distributor pricing, parametric data, drop-in equivalents, and engineering notes that complement the official Intel MAX 10 datasheet, giving design engineers a one-stop view for sourcing and second-source planning.
直接替换替代料： 10M04SCE144I7G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M04SCE144I7G （相同外形与封装尺寸） ——差异在于 Package, Configuration Memory, Core Voltage, Speed Grade, Logic Elements (LE).
快速对比工具——选择替代料号进行并排对比：
10M04SCE144C8G
✅ 直接替换✓ 有现货
$12.1 / 个
查看数据手册 →10M04SCE144A7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$10.1 / 个
查看数据手册 →10M04SCU324I7G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M08SCE144C8G
✅ 直接替换✓ 有现货
$15.95 / 个
查看数据手册 →10M16SCE144C8G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M02SCE144A7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.62 / 个
查看数据手册 →10M04SCE144I7G 最大额定值与电气特性
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded User Flash | 193,536 bits (~1.4 Mb) |
| Embedded SRAM (M9K blocks) | 250 Kbits |
| Number of M9K Memory Blocks | 25 |
| Number of 18x18 Multipliers | 12 |
| Maximum User I/Os | 101 |
| On-chip ADC | 1 Msps, 12-bit SAR (single) |
| Core Voltage | 3.0 V or 3.3 V (single supply) |
| 工作温度 | -40 °C to +100 °C (Industrial) |
| 封装 | EQFP-144 (22x22 mm, exposed pad) |
| 安装类型 | Surface Mount |
| Configuration Memory | On-chip flash (non-volatile) |
| RoHS 状态 | Compliant |
| Speed Grade | 7 (I7) |
| Temperature Grade | Industrial (I) |
10M04SCE144I7G 引脚配置
| 引脚 1 | GPIO_0 — General purpose I/O / configuration pin |
| 引脚 2 | GPIO_1 — General purpose I/O |
| 引脚 3 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 4 | GPIO_2 — General purpose I/O |
| 引脚 5 | GPIO_3 — General purpose I/O |
| 引脚 6 | GND — Ground |
| 引脚 7 | GPIO_4 — General purpose I/O |
| 引脚 8 | GPIO_5 — General purpose I/O |
| 引脚 9 | VCCINT — Core supply voltage (3.0/3.3 V) |
| 引脚 10 | GPIO_6 — General purpose I/O |
| 引脚 11 | GPIO_7 — General purpose I/O |
| 引脚 12 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 13 | GPIO_8 — General purpose I/O |
| 引脚 14 | GPIO_9 — General purpose I/O |
| 引脚 15 | GPIO_11 — General purpose I/O |
| 引脚 16 | GND — Ground |
| 引脚 17 | TDI — JTAG Test Data In |
| 引脚 18 | TCK — JTAG Test Clock |
| 引脚 19 | TMS — JTAG Test Mode Select |
| 引脚 20 | TDO — JTAG Test Data Out |
典型应用
10M04SCE144I7G 适用于 7 应用s: Industrial Motor Control, Factory Automation I/O Expansion, Portable Medical Instrument Front-End, IoT Edge Sensor Aggregation, Low-Cost Video Bridging, Standalone Embedded Control with Nios II, Test & Measurement Instrumentation.
Industrial Motor Control
The 10M04SCE144I7G is well-suited for industrial motor control applications, where it can implement trapezoidal BLDC, FOC, or stepper motor control algorithms in dedicated hardware. With 4,000 logic elements and 12 hardware multipliers, it offers sufficient resources for encoder interface logic, PWM generation, and basic control loops without external DSP. Industrial -40°C to +100°C temperature rating ensures reliable operation in factory environments, and 101 user I/Os accommodate multiple encoder channels and gate driver interfaces.
推荐
Factory Automation I/O Expansion
In factory automation, the 10M04SCE144I7G acts as a programmable I/O expander and protocol bridge, leveraging its 101 GPIO pins to aggregate digital inputs from sensors and switches. The non-volatile flash configuration enables instant-on operation without external boot memory, critical for production lines. Embedded M9K memory blocks buffer high-speed logic analyzer data, while the integrated 12-bit ADC directly interfaces with analog sensors, eliminating the need for a separate ADC chip in distributed I/O modules.
推荐
Portable Medical Instrument Front-End
The 10M04SCE144I7G's low static power (~65 mW per core) makes it attractive for battery-powered medical instruments such as portable patient monitors or handheld diagnostic devices. The integrated 12-bit 1 Msps ADC captures bio-sensor signals (ECG, SpO2, temperature) directly, while on-chip user flash stores calibration constants and device firmware. Industrial temperature rating supports reliable operation across hospital and field environments, and JTAG allows secure field firmware updates with bitstream encryption protecting IP.
推荐
IoT Edge Sensor Aggregation
For edge IoT gateways aggregating sensor data from SPI, I2C, UART, and 1-Wire devices, the 10M04SCE144I7G provides enough logic and GPIO to bridge multiple sensor types to an upstream MCU or wireless module. Its integrated flash eliminates external EEPROM for configuration storage, and the Nios II soft-core compatibility enables on-chip protocol translation (e.g., Modbus to MQTT). With 25 M9K blocks, FIFO buffering of sensor bursts is feasible without external SRAM.
推荐
Low-Cost Video Bridging
The 10M04SCE144I7G can perform low-resolution video format conversion, de-interlacing, or simple overlay generation in cost-sensitive applications such as industrial HMIs or kiosk displays. LVDS I/O support enables direct connection to flat-panel displays, while M9K memory blocks serve as line buffers. For resolutions up to 480p or 720p, the 4,000 logic elements and hardware multipliers handle basic video DSP functions without external memory.
推荐
Standalone Embedded Control with Nios II
With Nios II soft-core support, the 10M04SCE144I7G becomes a single-chip embedded controller hosting firmware alongside custom hardware accelerators. This is valuable for compact designs where a discrete MCU + CPLD combination would consume more PCB area. On-chip user flash stores both the bitstream and the Nios II firmware image, while the integrated ADC captures analog control signals. Industrial-grade temp rating and 144-EQFP package suit harsh-environment control products.
推荐
Test & Measurement Instrumentation
The 10M04SCE144I7G serves as a flexible stimulus/response generator in low-channel-count automated test equipment. Its 101 I/Os enable parallel pattern generation at logic-analyzer speeds, and on-chip user flash stores test sequence scripts. JTAG-based configuration simplifies firmware revision control across test stations. The exposed thermal pad maintains temperature stability during extended test campaigns in production environments.
推荐
推荐产品汇总
工程参考数据： 10M04SCE144I7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M04SCE144C8G | 10M08SCE144C8G | 10M16SCE144C8G | 10M04SCE144A7G | 10M02SCE144A7G |
|---|---|---|---|---|---|---|
| Package | EQFP-144 | EQFP-144 - identical | EQFP-144 - identical | EQFP-144 - identical | EQFP-144 - identical | EQFP-144 - identical |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 4,000 | 4,000 - identical | 8,000 (2x density upgrade) | 16,000 (4x density upgrade) | 4,000 - identical | 2,000 (lower density) |
| Embedded SRAM | 250 Kbit | 250 Kbit - identical | 378 Kbit | 504 Kbit | 250 Kbit - identical | 108 Kbit |
| Maximum User I/Os | 101 | 101 - identical | 101 - identical | 101 - identical | 101 - identical | 101 - identical |
| Temperature Grade | Industrial (-40 to +100 °C) | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) | Automotive (-40 to +125 °C) | Automotive (-40 to +125 °C) |
| Speed Grade | 7 | 8 (faster) | 8 (faster) | 8 (faster) | 7 - identical | 7 - identical |
| On-chip User Flash | ~1.4 Mb | ~1.4 Mb - identical | ~1.4 Mb - identical | ~1.4 Mb - identical | ~1.4 Mb - identical | ~1.4 Mb - identical |
| AEC-Q100 Qualified | No (industrial only) | No | No | No | Yes | Yes |
关键差异点
- Industrial temperature range with non-volatile on-chip configuration （对比 10M04SCE144C8G)
- 4x density upgrade path available in same footprint （对比 10M08SCE144C8G)
- Same-density automotive-grade variant for safety-critical applications （对比 10M04SCE144A7G)
设计说明
Estimated: at industrial temp -40°C to +100°C, VCCINT 3.3 V, and full-gate-utilization switching activity, the 10M04SCE144I7G draws ~65 mW static per core plus dynamic power proportional to toggle rate. Decouple each VCCINT pin with a 100 nF ceramic plus a 10 µF bulk capacitor placed within 5 mm of the pin. VCCIO banks may have mixed voltages (1.2 V to 3.3 V) and require per-bank decoupling to prevent simultaneous switching noise (SSN) on LVDS channels.
The EQFP-144 exposed thermal pad must be soldered to a continuous copper pour of at least 1 square inch to maintain reliability at industrial temperatures. Estimated: with theta_JA ~25 °C/W on a 4-layer 2oz copper PCB, the 10M04 at 1 W dissipation yields ~25 °C temperature rise above ambient, comfortably within the -40 to +100 °C industrial limit. Avoid cutting the thermal pour with signal vias directly under the package to prevent solder voids.
Route JTAG signals (TCK, TMS, TDI, TDO) with ground shielding and 50 Ω controlled impedance if traces exceed 25 mm. Place JTAG connector near the FPGA edge to simplify in-system programming. Configure dual-purpose pins (GPIO/MSEL, GPIO/ASDO) at schematic capture to avoid pinout rework. Per Intel MAX 10 hardware design guide, MSEL pins must be tied to VCCINT or specific pull resistors to select the correct configuration mode (AS, PS, JTAG).
LVDS channels on the 10M04SCE144I7G require 100 Ω differential termination at the receiver. For SDRAM interfaces routed to external memory, match trace lengths within 50 mils and use series damping resistors on clock outputs. The on-chip 12-bit ADC is sensitive to digital switching noise; isolate the analog VCCA supply with a ferrite bead and keep ADC input traces away from switching signals.
Do not enable on-chip flash programming mode without verifying the Quartus Prime programmer voltage compatibility - in-circuit programming at 3.3 V requires JTAG voltage level match. Avoid loading bitstreams encrypted with a key that has not been programmed into the device's key memory, as this bricks configuration. Always validate the design with a boundary-scan test before committing to production.
合规信息
RoHS compliant and lead-free per Altera package information datasheet. Industrial temp grade but not AEC-Q100 qualified; choose 10M04SCE144A7G for automotive.
