5CSEBA4U23C8SN - Cyclone V SE SoC FPGA, 40K LE, 672-UBGA | Intel
料号： 5CSEBA4U23C8SN ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $21.68 | $21.68 |
| 10 | $20.45 | $204.50 |
| 100 | $18.92 | $1,892.00 |
| 500 | $17.4 | $8,700.00 |
| 1,000 | $15.95 | $15,950.00 |
5CSEBA4U23C8SN 概述
A System-on-Chip (SoC) FPGA is a class of programmable logic device that combines a hard processor core (typically ARM Cortex-A or Cortex-M) with FPGA fabric on a single die, allowing deterministic hardware acceleration alongside software-driven control. Within the broader taxonomy, an SoC FPGA sits below an ASSP (Application-Specific Standard Product) and above a microcontroller in design flexibility, bridging CPU+DSP performance with FPGA gate-level parallelism. The hard processor subsystem (HPS) includes its own memory controllers, peripherals, and interconnect, separate from the FPGA fabric.
Key features of the 5CSEBA4U23C8SN include 40K logic elements, 2,240 Kbits of embedded SRAM, variable-precision DSP blocks, integrated PCIe Gen2 hard IP, and a wide range of multi-standard I/O supporting LVDS, LVTTL, and LVCMOS at 1.1V to 3.3V. The device is fabricated on TSMC's 28 nm low-power process, optimized for low static and dynamic power consumption.
The architecture integrates dual-purpose HPS I/Os and FPGA I/Os with flexible configuration through Altera/Intel Quartus Prime design software. The single-core ARM Cortex-A9 MPCore runs at up to 600 MHz, with 32 KB L1 instruction cache, 32 KB L1 data cache, 512 KB L2 cache, and NEON media processing engine. The FPGA fabric contains 4-input ALMs, M20K memory blocks, and DSP blocks supporting 18x19 multipliers.
Typical applications include industrial machine vision, motor control, protocol bridging, video surveillance, automotive driver assistance systems, and embedded vision. The 0-85C commercial temperature grade and 672-UBGA package make it well-suited for space-constrained PCB designs requiring both processing and programmable logic.
When designing with this SoC FPGA, ensure adequate decoupling for the HPS and FPGA core voltage rails. The HPS and FPGA can boot independently, enabling early FPGA configuration from HPS or HPS boot from FPGA-attached flash. Quartus Prime 18.1 or later is recommended for full HPS toolchain support.
This page synthesizes distributor pricing, drop-in alternatives within the same 672-UBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： 5CSEBA4U23C8SN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CSEBA4U23C8SN （相同外形与封装尺寸） ——差异在于 Package, Logic Elements, DSP Blocks, HPS Peripherals, HPS Maximum Frequency.
快速对比工具——选择替代料号进行并排对比：
5CSEBA4U23C8N
✅ 直接替换✓ 有现货
$138.2 / 个
查看数据手册 →5CSEBA4U23C7SN
✅ 直接替换✓ 有现货
$18.2 / 个
查看数据手册 →5CSEBA4U23I7SN
✅ 直接替换✓ 有现货
$98.5 / 个
查看数据手册 →5CSEBA4U23C6N
✅ 直接替换✓ 有现货
$86.2 / 个
查看数据手册 →5CSEBA4U23A7N
✅ 直接替换✓ 有现货
$185 / 个
查看数据手册 →5CSEBA4U23C8SN 最大额定值与电气特性
| Series | Cyclone V SE |
| Core Type | Single ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 40K |
| Operating Frequency (HPS) | 600 MHz |
| Core Voltage | 1.1 V |
| Embedded Memory (FPGA) | 2,240 Kbits |
| On-chip RAM (HPS) | 64 KB |
| 存储容量 | 2931 KB (per datasheets.com summary) |
| DSP Blocks | Variable-precision, 18x19 multipliers |
| 封装 | 672-UBGA (23x23 mm) |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +85C (commercial) |
| Process Technology | TSMC 28 nm low-power |
| RoHS 状态 | Compliant |
| MSL 等级 | 3 |
5CSEBA4U23C8SN 672-ubga (23x23 mm) 引脚配置指南
5CSEBA4U23C8SN（672-ubga (23x23 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CSEBA4U23C8SN.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CSEBA4U23C8SN 适用于 6 应用s: Industrial Machine Vision, Motor Control and Drives, Automotive Driver Assistance (ADAS), Industrial IoT Gateway, Video Surveillance Encoder, Medical Imaging Equipment.
Industrial Machine Vision
The 5CSEBA4U23C8SN fits industrial machine vision because its single-core ARM Cortex-A9 at 600 MHz handles camera ISP and GigE Vision protocol while the 40K LE FPGA fabric accelerates image preprocessing pipelines (Sobel, threshold, morphology) in parallel. The variable-precision DSP blocks run 18x19 multipliers suitable for FFT-based defect detection, and 2,240 Kbits of embedded SRAM buffer full-HD frame lines at 60 fps. Industrial-grade I/O bank support (LVDS/LVCMOS 1.2-3.3V) interfaces directly to MIPI CSI-2 or LVDS image sensors. The HPS runs Linux with OpenCV, offloading hot-path pixel processing to FPGA fabric.
推荐
Motor Control and Drives
The 5CSEBA4U23C8SN integrates motor-control logic and a Cortex-A9 control loop on one die, eliminating separate MCU+FPGA partitions in servo drives. The HPS runs FOC (field-oriented control) at 20-50 kHz PWM rates, while the 40K LE fabric implements encoder interfaces (BiSS, EnDat 2.2, Tamagawa) and custom logic-level shifting. Variable-precision DSP blocks accelerate Park/Clarke transforms and SVPWM. The 672-UBGA U23 package exposes enough I/O banks for 3-phase PWM, sigma-delta ADC interfaces, and Ethernet/IP or EtherCAT MII pins.
推荐
Automotive Driver Assistance (ADAS)
The 5CSEBA4U23C8SN suits ADAS sensor-fusion ECUs by combining a Cortex-A9 host processor with deterministic FPGA accelerators for radar/lidar preprocessing. The 40K LE fabric implements custom DMA, sensor timing, and CAN-FD gating, while the HPS runs AUTOSAR and object-classification algorithms. Note that 5CSEBA4U23C8SN is commercial-grade (0-85C); for AEC-Q100 qualified automotive deployments, the equivalent A7 speed-grade variant 5CSEBA4U23A7N is preferred (same U23 footprint, automotive qualification tier).
推荐
Industrial IoT Gateway
The 5CSEBA4U23C8SN consolidates protocol-conversion gateways by running Modbus/TCP, OPC-UA, PROFINET, and EtherCAT stacks on the Cortex-A9 HPS while FPGA logic accelerates deterministic packet timestamping, PTP hardware timestamping, and custom fieldbus protocol handling. The 2,240 Kbits embedded SRAM caches protocol buffers, and the wide FPGA I/O bank supports RS-485, RS-232, and isolated digital inputs at 24V industrial levels. 1 Gbit Ethernet MAC in the HPS enables edge-to-cloud connectivity.
推荐
Video Surveillance Encoder
The 5CSEBA4U23C8SN enables multi-channel H.264/H.265 video encoding by partitioning motion estimation, DCT/IDCT, and deblocking filters into the FPGA fabric, while the Cortex-A9 runs the encoder orchestration and stream management. The variable-precision DSP blocks accelerate motion-estimation ME (sum-of-absolute-differences) at 200+ MHz. Embedded M20K memory blocks buffer macroblock rows, and FPGA I/O banks interface directly to BT.656, BT.1120, or MIPI CSI-2 camera inputs.
推荐
Medical Imaging Equipment
The 5CSEBA4U23C8SN fits portable ultrasound or endoscopy image processors where the HPS runs the application UI, patient data, and DICOM stack while the FPGA fabric accelerates beamforming, FIR filtering, and envelope detection in the ultrasound pipeline. The 40K LE and 2240 Kbits embedded SRAM support 32-channel beamformer implementations. Industrial temp grade suits hospital environments; for IEC 60601 medical safety certification, pair with appropriate isolation. The 672-UBGA U23 footprint enables compact handheld form factors.
推荐
推荐产品汇总
工程参考数据： 5CSEBA4U23C8SN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CSEBA4U23C8N | 5CSEBA4U23C7SN | 5CSEBA4U23I7SN | 5CSEBA4U23C6N |
|---|---|---|---|---|---|
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40K | 40K | 40K | 40K | 40K |
| Speed Grade | 8 (C8) | 8 (C8) | 7 (C7) | 7 (I7) | 6 (C6) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| HPS Cortex-A9 Cores | 1 | 1 | 1 | 1 | 1 |
| Embedded Memory | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits | 2,240 Kbits |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
关键差异点
- Pin-and-function compatible with full U23 672-UBGA Cyclone V SE family （对比 5CSEBA4U23C7SN)
- Industrial-temp variant available for harsh environments （对比 5CSEBA4U23I7SN)
- Single-core HPS vs dual-core options - cost optimization （对比 5CSEBA5U23C8SN (dual-core variant))
设计说明
The 5CSEBA4U23C8SN requires multiple supply rails: VCC (1.1V core), VCCPLL (1.1V PLL analog), VCCIO for HPS and FPGA I/O banks (1.2V-3.3V depending on I/O standard), VCCPD (2.5V/3.0V/3.3V pre-driver), and VCCRSTCLK (2.5V for HPS reset/clock). Decouple each rail with 0.1 uF ceramic and 10 uF bulk capacitors placed within 5 mm of the corresponding pins. Use a sequenced power supply (e.g., LTC3612 or Intel EN5339) to ensure VCC ramps before VCCIO/VCCPD to avoid latch-up. Estimated: at 600 MHz HPS with 40K LE at typical toggle rates, total power consumption is approximately 3-5W depending on utilization.
The 672-UBGA U23 package has 1.0 mm ball pitch. PCB layout requires microvia (HDI) stackup with at least 4-6 layers, blind/buried vias for inner-row BGA breakouts, and a 0.4-0.5 mm via-in-pad design with planar filling to escape the center balls. Use 50 ohm controlled impedance for high-speed HPS interfaces (DDR3, RGMII) and 90 ohm differential for LVDS channels. Ground plane directly under the BGA must be continuous to provide return path and thermal dissipation.
The 672-UBGA U23 package has theta-JA of approximately 12-15 C/W on a 4-layer JEDEC test board. At full HPS load (600 MHz) plus 50% FPGA utilization, the device can dissipate 3-5W, yielding 36-75 C junction temperature rise above ambient. For commercial-grade (0-85C) operation in enclosed housings, attach a heatsink or thermal pad to the top of the package, and ensure at least 4 thermal vias in the BGA center array to the inner ground plane.
Do not confuse 5CSEBA4U23C8SN (single-core HPS, 40K LE) with 5CSEMA4U23C8SN or 5CSEBA6U23C8SN variants - the SE suffix denotes the SoC tier with hard ARM core, the second digit (4 vs 6) indicates logic element count, and missing 'A' vs 'AE' indicates HPS core count. The 'SN' suffix means lead-free (Pb-free) while bare 'N' also indicates lead-free but with different MSL handling. The package letter U23 vs U19 vs U15 is critical - it identifies the BGA ball count and PCB footprint, and these are NOT pin-compatible.
合规信息
RoHS compliant per Cyclone V Device Overview datasheet and Intel product page. SN suffix denotes Pb-free lead finish. Standard commercial variant is not AEC-Q100 qualified; choose 5CSEBA4U23A7N for automotive-grade applications.