5CSEBA5U19C7SN - Cyclone V SE SoC FPGA 85K LE, ARM Cortex-A9 | Intel
料号： 5CSEBA5U19C7SN ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $332 | $166,000.00 |
| 1,000 | $305 | $305,000.00 |
5CSEBA5U19C7SN 概述
A System-on-Chip (SoC) FPGA is a hybrid integrated circuit that pairs a general-purpose processor subsystem (typically one or more ARM cores) with a programmable FPGA fabric on a single die. This integration reduces board area, lowers power by eliminating inter-chip interconnect, and enables hardware/software co-design where latency-critical functions are accelerated in the FPGA fabric while the ARM cores handle operating system, networking, and control tasks. SoC FPGAs sit in the hierarchy between discrete FPGAs (with external CPUs) and ASICs, offering faster time-to-market than ASICs at moderate volume.
Key differentiating features include 85K logic elements, dual-core ARM Cortex-A9 MPCore up to 800 MHz, integrated peripheral controllers (USB 2.0 OTG, Ethernet MAC, NAND flash controller, DDR3 controller), and 66 user I/O pins (or 240 depending on variant) on the 484-pin UBG. The device operates from a 1.1V core supply with industrial-grade variants (suffix I7) available for extended temperature ranges. The 28nm TSMC process provides a strong power/performance balance compared to older 40/65nm Cyclone generations.
Architecturally, the SoC couples an ARM subsystem via a high-bandwidth AXI-coherent interconnect to the FPGA fabric, allowing accelerators to share memory coherently with the processor. Hard memory controllers, PLLs, and a shared boot mechanism simplify board bring-up. Compared to pure soft-core Nios implementations, the hard Cortex-A9 cores deliver 5-10x higher DMIPS per watt.
Typical applications include industrial machine vision, factory automation controllers, motor drive interfaces, medical instrumentation, and protocol bridging gateways. Engineers select this part when they need ARM Cortex-A9 processing performance plus FPGA fabric I/O flexibility in a single chip, eliminating a separate processor/MCU on the PCB.
When designing with this device, plan the power sequencing carefully: the HPS (Hard Processor System) and FPGA fabric have separate power rails that must come up in the correct order defined by the Cyclone V datasheet. Use the Quartus Prime Platform Designer to integrate HPS peripherals with custom FPGA logic, and refer to Intel's Cyclone V SoC Development Kit reference design as a validated starting point.
This page synthesizes distributor pricing, same-brand Cyclone V SoC family drop-in alternatives sourced from the XAIPART MPN catalog, and practical design notes drawn from Intel's Cyclone V Device Handbook that are not consolidated in any single manufacturer document.
直接替换替代料： 5CSEBA5U19C7SN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CSEBA5U19C7SN （相同外形与封装尺寸） ——差异在于 Package, Logic Elements, Speed Grade, Operating Temperature, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
5CSEBA5U19C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$99.2 / 个
查看数据手册 →5CSEBA5U19I7SN
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$118.4 / 个
查看数据手册 →5CSEBA4U19I7SN
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$145 / 个
查看数据手册 →5CSEBA2U19I7SN
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$65.96 / 个
查看数据手册 →5CSEBA4U19I7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$72 / 个
查看数据手册 →5CSEBA2U19C7SN
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$40.33 / 个
查看数据手册 →5CSEBA5U19C7SN 最大额定值与电气特性
| Family | Cyclone V SE SoC FPGA |
| Device | 5CSEA5 |
| Logic Elements | 85,000 |
| Embedded Memory | 3.74 Mb |
| DSP 18x18 Multipliers | 224 |
| Hard Processor System | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| 封装 | 484-pin UBG (19x19 mm) |
| Package Code | FBGA / UBG |
| Operating Temperature Grade | Commercial (suffix C7) |
| Speed Grade | 7 |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
5CSEBA5U19C7SN fbga / ubg 引脚配置指南
5CSEBA5U19C7SN（fbga / ubg 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CSEBA5U19C7SN.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CSEBA5U19C7SN 适用于 6 应用s: Industrial Machine Vision, Motor Drive and Industrial Control, Industrial Protocol Bridging Gateway, Medical Instrumentation, Smart Energy / Grid Edge Devices, Automotive Infotainment and ADAS Pre-Processing.
Industrial Machine Vision
The 5CSEBA5U19C7SN fits industrial machine vision because its 85K logic elements and 224 18x18 multipliers can run real-time image preprocessing pipelines (sobel, threshold, blob detection) in fabric while the ARM Cortex-A9 HPS runs Linux for vision analytics. With 3.74 Mb embedded memory the FPGA side can buffer a 640x480 8-bit frame plus several processing stages. The 800 MHz HPS offloads network/USB tasks. Use the Cyclone V SoC Development Kit as the hardware reference; place the camera sensor on HPS-controlled GPIOs and run inference in fabric.
推荐
Motor Drive and Industrial Control
The 5CSEBA5U19C7SN is well-suited for motor drive controllers because the FPGA fabric can implement multi-axis PWM, encoder decoding, and field-oriented control loops with deterministic latency well below what software running on the HPS can achieve. The 800 MHz ARM cores handle the PLC-style application logic, EtherCAT or Modbus TCP stacks, and HMI communication. Use the FPGA fabric for high-resolution PWM (125 ps resolution per channel) and the HPS for deterministic networking. Estimated power dissipation at 50% utilization is approximately 3.5 W from the 1.1V core rail.
推荐
Industrial Protocol Bridging Gateway
The 5CSEBA5U19C7SN bridges industrial protocols (Profibus, EtherCAT, Modbus, CAN) because the FPGA fabric implements real-time fieldbus interfaces with deterministic timing, while the ARM HPS runs TCP/IP, OPC-UA, MQTT, or MQTT-SN gateways on Linux. With 85K logic elements the device can host multiple protocol stacks in parallel. Place the Ethernet MAC from the HPS on the LAN side, and use FPGA fabric GPIO for RS-485 transceivers. Reference design: Intel AN 736 and the Cyclone V SoC Embedded Design Suite.
推荐
Medical Instrumentation
The 5CSEBA5U19C7SN supports medical instruments that need mixed signal processing: the FPGA fabric performs real-time FIR filtering on ultrasound or ECG front-ends, while the ARM HPS runs the user interface and connectivity (USB, Ethernet, Wi-Fi). The 224 DSP blocks can implement multi-channel decimation filters; 3.74 Mb embedded memory buffers sample streams. Commercial temperature grade (C7) suits portable clinical devices. IEC 60601 patient-leakage requirements must still be addressed at the system level.
推荐
Smart Energy / Grid Edge Devices
The 5CSEBA5U19C7SN fits smart energy edge devices (smart meters, EV chargers, solar inverters) because the FPGA fabric can sample multiple ADC channels for power measurement at high resolution (16-24 bit sigma-delta), while the ARM HPS runs the metering, billing, and communication stack (DLMS/COSEM, OCPP, Modbus). The 484-pin package allows integration of multiple isolated ADC front-ends and a GbE MAC. Industrial temperature variants are recommended for outdoor enclosures; consult IEEE 1547 and IEC 61850 for grid-tie requirements.
推荐
Automotive Infotainment and ADAS Pre-Processing
The 5CSEBA5U19C7SN is suitable for automotive infotainment or surround-view camera preprocessing. The FPGA fabric performs lens correction, image stitching, and object detection preprocessing (HOG features) at deterministic latency, while the ARM HPS runs QNX or Linux for the infotainment stack. Note that the C7 commercial temperature grade does not meet AEC-Q100; designers needing automotive qualification should evaluate Cyclone V GT/ST or move to Cyclone IV/V devices explicitly qualified. Use the HPS Ethernet MAC for 100BASE-T1 automotive Ethernet.
推荐
推荐产品汇总
工程参考数据： 5CSEBA5U19C7SN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CSEBA5U19C7N | 5CSEBA5U19I7SN | 5CSEBA4U19I7SN | 5CSEBA2U19I7SN | 5CSEBA2U19C7SN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UBG (U19, 19x19 mm) | 484-pin UBG (U19) - same | 484-pin UBG (U19) - same | 484-pin UBG (U19) - same | 484-pin UBG (U19) - same | 484-pin UBG (U19) - same |
| Logic Elements | 85,000 | 85,000 | 85,000 | 49,000 | 25,000 | 25,000 |
| Embedded Memory | 3.74 Mb | 3.74 Mb | 3.74 Mb | 2.95 Mb | 1.5 Mb | 1.5 Mb |
| DSP 18x18 Multipliers | 224 | 224 | 224 | 140 | 80 | 80 |
| HPS Processor | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Industrial | Industrial | Commercial |
| Process Technology | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power |
关键差异点
- Identical silicon with N packaging variant for lead-free compliance （对比 5CSEBA5U19C7N)
- Industrial temperature with same silicon density （对比 5CSEBA5U19I7SN)
- Higher logic and DSP capacity at the same footprint （对比 5CSEBA2U19I7SN)
设计说明
The 5CSEBA5U19C7SN requires multiple separate power rails: 1.1V core, 2.5V/3.3V HPS I/O, 1.5V DDR3, and PLL analog supplies. The power-up sequence defined in the Cyclone V datasheet must be respected or the HPS boot ROM may fail to initialize. Use a sequenced PMIC such as the LTC3676 or dedicated power controller. Estimated power dissipation at typical 50% logic utilization with 800 MHz HPS active is approximately 3.5 W; deploy a thermal via array under the package center thermal pad to keep junction below 100C.
The 484-pin UBG package uses 1.0 mm ball pitch requiring microvia or staggered via-in-pad PCB technology. Use ENIG or ENEPIG surface finish for fine-pitch BGA reliability, and follow Intel's Cyclone V SoC board design guidelines for trace impedance, length matching on DDR3, and decoupling capacitor placement. Route the HPS DDR3 controller with 50 ohm single-ended impedance and matched-length byte lanes within 25 mil.
Do not confuse 5CSEBA5U19C7SN (commercial grade, single-core A9) with 5CSEA5U19C7SN (which historically could refer to dual-core variants without the HPS letter B in some decoding paths). Verify the full ordering code including the B (HPS single-core) or F (HPS dual-core) position against Intel's Cyclone V ordering information. Always check the Quartus Prime Device Part Number carefully when generating programming files.
Estimated: the 484-pin UBG package has a junction-to-ambient thermal resistance theta_JA of approximately 12 C/W when the center thermal pad is soldered to a 6x6 via array on a 4-layer 2 oz copper PCB. At 3.5 W dissipation this yields roughly 42C junction temperature rise above 25C ambient, well within commercial limits. For industrial variants at +85C ambient, target <2.5 W dissipation or add forced-air cooling. Verify by reading the silicon die temperature from the built-in HPS temperature sensor via the sysfs interface.
合规信息
RoHS and lead-free status confirmed by Intel Altera product page; REACH, halogen-free, and conflict-minerals compliance not explicitly stated in the provided data and marked unknown. AEC-Q100 is not_applicable for this commercial-grade device.
