5CSEBA2U19I7SN - 25K Logic, 800MHz Cyclone V SoC | Altera
MPN: 5CSEBA2U19I7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $74.7678 | $74.77 |
| 10 | $72.96 | $729.60 |
| 100 | $70.18 | $7,018.00 |
| 500 | $68.02 | $34,010.00 |
| 1,000 | $65.96 | $65,960.00 |
Drop-in alternatives for 5CSEBA2U19I7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSEBA2U19C7SN
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View Datasheet →5CSEBA5U19I7SN
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View Datasheet →5CSEBA2U19I7SN Maximum Ratings & Electrical Characteristics
| Device Type | Cyclone V SE FPGA system-on-chip (SoC) |
| Processor Core | Single ARM Cortex-A9 MPCore |
| Debug Technology | CoreSight |
| Logic Elements | 25K logic elements |
| Device Frequency | 800 MHz |
| I/O Count | 240 I/O |
| Package | 484-UBGA |
| Package Dimensions | 19 mm x 19 mm |
| FPGA Architecture | Cyclone V SE |
| Mounting Type | Surface mount |
| Integrated Processor | Yes |
| Logic Technology | Field-programmable gate array |
| Device Category | Embedded system-on-chip FPGA |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Status | unknown |
5CSEBA2U19I7SN 19 mm x 19 mm Pin Configuration Guide
Complete pinout information for 5CSEBA2U19I7SN (19 mm x 19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U19I7SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U19I7SN is suitable for 6 applications: Industrial Automation Controller, Communications Equipment, Test and Measurement Instrument, Embedded Data-Acquisition Platform, Embedded Vision and Image Processing, Automotive and Transportation Electronics.
Industrial Automation Controller
The 5CSEBA2U19I7SN fits industrial automation controllers that need embedded software, deterministic logic, and many external connections in one device. Its single ARM Cortex-A9 MPCore can run control software, protocol stacks, and supervisory functions, while the 25K logic elements can implement state machines, sensor interfaces, motion-control timing, and safety-oriented logic partitioning. The 240-I/O listing is useful when the controller must connect to encoders, digital I/O, analog-to-digital converters, and industrial communications devices. A practical implementation should use the FPGA fabric for deterministic parallel processing and the processor for sequencing, configuration, and higher-level management. The 800 MHz listing is a device-level performance figure, not a guaranteed timing result, so clock constraints and external memory behavior must be checked in the manufacturer documentation.
Recommended
Communications Equipment
The 5CSEBA2U19I7SN is a practical candidate for communications equipment that combines packet processing, control software, and hardware datapaths. The ARM Cortex-A9 MPCore can host protocol software and management tasks, while the FPGA fabric can implement framing, buffering, clock-domain crossing, filtering, and interface adaptation. The 25K logic-element capacity provides room for moderate parallel logic without moving to a larger device, and the verified 240-I/O count supports systems with multiple external buses and control signals. The package is a 484-UBGA device measuring 19 mm by 19 mm, so signal escape, power integrity, and high-speed routing require careful planning. Designers should verify the exact transceiver and I/O-bank capabilities in the full Cyclone V documentation because the supplied verified data does not list transceiver count or electrical limits.
Recommended
Test and Measurement Instrument
In a test and measurement instrument, 5CSEBA2U19I7SN can provide both control and real-time signal-processing functions. The ARM Cortex-A9 MPCore is suited to user-interface control, data formatting, calibration workflows, and communications with a host system, while the FPGA fabric can capture samples, generate timing sequences, detect events, and process multiple channels in parallel. The verified 25K logic elements and 800 MHz performance figure support moderate logic-density designs, while 240 I/O help connect converters, sensors, triggers, and test fixtures. A careful architecture should isolate high-speed acquisition paths from slower control signals and use appropriate clock and power domains. The supplied data does not provide the number of multipliers, memory blocks, PLLs, or high-speed interfaces, so those resources must be confirmed before committing to a design.
Recommended
Embedded Data-Acquisition Platform
The 5CSEBA2U19I7SN suits embedded data-acquisition platforms that need an operating-system-capable processor and programmable acquisition logic. The Cortex-A9 MPCore can manage data storage, conversion control, network transfer, and local processing, while the FPGA fabric can interface to parallel converters, implement timing generators, and reduce incoming data before it reaches software. The verified 240-I/O specification provides substantial connection potential for multi-channel systems, and the 484-UBGA package is appropriate for dense board layouts when signal escape and power delivery are carefully designed. The design should define fixed-latency boundaries between the fabric and processor, account for DMA and memory bandwidth, and validate the actual I/O electrical standards. Operating voltage, thermal limits, memory resources, and transceiver details are not included in the supplied web data.
Recommended
Embedded Vision and Image Processing
The 5CSEBA2U19I7SN can support embedded vision systems where image capture, preprocessing, and application control share a single platform. The FPGA fabric can perform pixel formatting, filtering, region-of-interest extraction, line buffers, and parallel image operations, while the ARM Cortex-A9 MPCore can run image analysis, user interfaces, and communication services. The verified 25K logic elements may suit compact preprocessing pipelines, but available memory blocks, multipliers, and external memory interfaces are not stated in the supplied data. The 800 MHz value should be treated as a device-level specification from the distributor listing, not as a complete design guarantee. A production design should estimate pixel throughput, frame-buffer bandwidth, clock rates, and thermal conditions using the manufacturer resource and timing tables before selecting the part.
Recommended
Automotive and Transportation Electronics
5CSEBA2U19I7SN may be evaluated for transportation electronics that require embedded processing and programmable I/O, but the supplied data does not establish an automotive qualification. The device offers a single ARM Cortex-A9 MPCore, 25K logic elements, 800 MHz listed performance, and 240 I/O, which can support control, monitoring, communications, and sensor aggregation. The FPGA fabric can implement deterministic input processing and interface logic, while the processor can manage application software and diagnostics. Before using it in an automotive design, confirm AEC-Q100 status, operating temperature range, PPAP documentation, quality flow, reliability data, and long-term supply commitments from the manufacturer. The package is a 484-UBGA device measuring 19 mm by 19 mm, so PCB reliability, thermal cycling, solder joint qualification, and environmental testing are also essential.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U19I7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U19C7SN | 5CSEBA5U19I7SN | 5CSEBA2U19I7N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 484-UBGA, 19 mm x 19 mm | 484-FBGA | 484-UBGA | 484-UBGA |
| I/O Count | 240 I/O | 161 I/O | 66 I/O | [DATA_NEEDED] |
| Logic Elements | 25K logic elements | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Processor | Single ARM Cortex-A9 MPCore | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Frequency | 800 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| I/O Difference vs Target | Baseline 240 I/O | -79 I/O, -32.9% | -174 I/O, -72.5% | [DATA_NEEDED] |
| Price Tier 1 | $74.7678 per unit as of 2026-09-06 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher listed I/O count than 5CSEBA2U19C7SN (vs 5CSEBA2U19C7SN)
- Higher listed I/O count than 5CSEBA5U19I7SN (vs 5CSEBA5U19I7SN)
- Integrated processor and FPGA fabric (vs 5CSEBA2U19C7SN)
Design Notes
Verify every required rail, power-up sequence, current limit, and decoupling network against the manufacturer datasheet before schematic release. The supplied web data confirms 25K logic elements, 800 MHz, and a 484-UBGA package but does not provide voltage ranges, current consumption, or power sequencing. Use local bulk and high-frequency decoupling close to the package, define power domains in the design constraints, and simulate startup behavior. Estimated power calculations are not possible from the verified material because the device’s actual configuration, clocking, I/O utilization, and processor activity are not specified.
Treat the 484-UBGA package as a high-density BGA layout that requires a verified escape strategy rather than a generic 19 mm by 19 mm footprint. Obtain the manufacturer land pattern, complete ball map, I/O-bank tables, and recommended via and trace geometry before PCB fabrication. Separate sensitive clock and processor signals from switching power and high-current outputs where possible. The provided data does not include ball assignments or stack-up recommendations, so the package name alone is insufficient for pin-accurate implementation.
Use controlled impedance for high-speed interfaces and define clock, reset, configuration, and memory topologies in the HDL and PCB constraints. The 5CSEBA2U19I7SN is listed at 800 MHz, but the available material does not identify the exact high-speed interfaces, transceiver count, I/O standards, or timing limits. Validate every external interface with IBIS or manufacturer-provided signal-integrity models, account for simultaneous switching behavior, and keep reference-clock paths short and continuous. Do not infer fabric timing from the distributor frequency value.
Thermal design must use the final configuration, clock rates, toggle rates, output loading, processor workload, and ambient conditions. The verified data does not provide junction-to-ambient resistance, junction-to-case resistance, maximum junction temperature, or package power limits. Place thermal vias beneath exposed or internal package features only when permitted by the manufacturer land pattern, spread heat through the board stack-up, and verify temperature with a representative system test. Estimated thermal values are intentionally omitted because the required input conditions are not available.
Compliance Information
The verified web data does not provide compliance, automotive qualification, lead-free, halogen-free, or conflict-minerals statements.
