5CSEBA4U19I7SN - Cyclone V SE SoC FPGA, 40K LE, ARM Cortex-A9 | Intel
MPN: 5CSEBA4U19I7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $215 | $215.00 |
| 10 | $198 | $1,980.00 |
| 100 | $175 | $17,500.00 |
| 500 | $158 | $79,000.00 |
| 1,000 | $145 | $145,000.00 |
Drop-in alternatives for 5CSEBA4U19I7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U19I7S-N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$295.4 / Unit
View Datasheet →5CSEBA4U19I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$72 / Unit
View Datasheet →5CSEBA4U19I7LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$168 / Unit
View Datasheet →5CSEBA4U19I7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$24.95 / Unit
View Datasheet →5CSEBA4U19C8SN
✅ Drop-In✓ In Stock
$44.1 / Unit
View Datasheet →5CSEBA4U19C7SN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$218 / Unit
View Datasheet →5CSEBA5U19C8SN
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →5CSEBA6U19I7SN
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA4U19I7SN Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SE SoC FPGA |
| Device Family | Cyclone V |
| Logic Elements | 40,000 |
| Hard Processor System (HPS) | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Package | 484-pin UBG A (19x19 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Node | 28 nm low-power |
| Supply Voltage (Core) | 1.1 V (typical) |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL (Cyclone V I/O family) |
| Transceivers | Not applicable (SE family, transceiver-less) |
| PCI Express Hard IP | Gen1 capable (rootport/endpoint) |
| DDR Memory Support | DDR2/DDR3/LPDDR2 via HPS and FPGA fabric |
| RoHS Status | Compliant |
5CSEBA4U19I7SN 484-pin ubg a (19x19 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA4U19I7SN (484-pin ubg a (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U19I7SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U19I7SN is suitable for 6 applications: Industrial Machine Vision, Motor Drive and Robotics Control, Automotive Driver Assistance (ADAS), Medical Imaging and Diagnostic Equipment, Industrial HMI Panels and Operator Interfaces, Smart Energy and Grid Edge Controllers.
Industrial Machine Vision
The 5CSEBA4U19I7SN fits industrial machine vision because the single-core ARM Cortex-A9 HPS running up to 800 MHz can host a Linux image-processing stack (OpenCV, GStreamer) while the 40K-logic-element FPGA fabric delivers deterministic hardware acceleration for line-scan sensors, Bayer-to-RGB conversion, and real-time object detection. The 28 nm low-power process keeps thermal envelope suitable for sealed IP67 camera enclosures. Placed on a PoE-powered vision board, the HPS Ethernet MAC offloads packet processing; the fabric drives high-bandwidth LVDS sensor interfaces. The Cortex-A9 supports NEON SIMD for per-pixel convolution, while the FPGA fabric implements deterministic ROI pipelines - a hybrid that pure MCUs cannot match.
Recommended
Motor Drive and Robotics Control
The 5CSEBA4U19I7SN suits multi-axis motor drive and robotics by combining the ARM Cortex-A9 HPS for trajectory planning and EtherCAT master stacks with FPGA fabric running deterministic current/torque control loops at sub-microsecond latency. The HPS includes 32-bit timer blocks and DMA engines that pair with fabric-implemented SVPWM and encoder interfaces. The 484-pin package exposes enough user I/O for 6+ axis drives plus isolated GPIO. Industrial temperature range (-40C to +100C) supports servo cabinet ambient. Compared to MCU-only controllers, this SoC FPGA eliminates external FPGA coprocessors, shrinking the BOM and reducing latency between control law and power-stage PWM generation.
Recommended
Automotive Driver Assistance (ADAS)
The 5CSEBA4U19I7SN is appropriate for entry-level ADAS perception pre-processing where 40K logic elements handle radar pre-filtering, sensor fusion pre-stage, and CAN-FD message arbitration. The ARM Cortex-A9 HPS hosts an automotive-grade Linux distribution for object classification running alongside fabric-implemented deterministic front-end DSP. The HPS peripheral set (CAN, SPI, I2C, EMAC) maps directly to automotive ECU integration. Industrial temperature operation supports cabin and behind-bumper mounting. Engineers transitioning from discrete MCU + FPGA designs benefit from a single-chip reduction - eliminating FPGA-to-MCU bridges and simplifying PCB layout. Migration to functional-safety variants follows ASIL qualification paths in the Cyclone V family.
Recommended
Medical Imaging and Diagnostic Equipment
The 5CSEBA4U19I7SN serves medical imaging front-ends such as ultrasound beamformers and patient monitors, where the FPGA fabric delivers deterministic signal conditioning (filtering, decimation, envelope detection) while the ARM Cortex-A9 HPS runs the embedded display stack and network connectivity. Hardware multipliers in the fabric accelerate FIR and FFT operations, and the HPS L2 cache supports smooth 800 MHz processing for real-time waveform rendering. The single-chip integration reduces BOM cost for portable diagnostic carts. Industrial temperature operation is compatible with the regulated medical-device ambient. Compared to discrete DSP + MCU solutions, this SoC FPGA simplifies EMC compliance by removing high-speed inter-chip buses.
Recommended
Industrial HMI Panels and Operator Interfaces
The 5CSEBA4U19I7SN drives multi-touch industrial HMI panels by allocating the ARM Cortex-A9 HPS to run a Qt/Embedded or web-based HMI application with the FPGA fabric handling TFT/LVDS display timing generation, backlight PWM, and touch-controller I/O. The HPS supports HDMI and 24-bit TTL output through fabric-implemented display controllers, while DDR3 controller drives the frame buffer. Industrial temperature range tolerates factory-floor ambient. Replacing separate HMI SBC plus FPGA timing boards with this single SoC FPGA lowers unit cost and accelerates time-to-market. Engineers can prototype UI on the HPS first, then accelerate critical paths in the FPGA fabric for deterministic response.
Recommended
Smart Energy and Grid Edge Controllers
The 5CSEBA4U19I7SN is well suited to smart-energy grid edge controllers for substation automation, distributed energy resource (DER) interconnection, and power-quality monitoring. The FPGA fabric implements deterministic IEC 61850 GOOSE message handling and high-speed ADC sampling for power-quality analysis, while the ARM Cortex-A9 HPS runs the communications stack (DNP3, IEC 61850 MMS, Modbus TCP) and local HMI. The HPS EMAC and USB 2.0 OTG connect to substation networks. Industrial temperature operation withstands outdoor cabinet environments. Compared to MCU-based RTUs, this SoC FPGA handles simultaneous high-speed sampling and protocol conversion without bus bottlenecks, simplifying grid-edge hardware design.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U19I7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U19I7S-N | 5CSEBA4U19I7N | 5CSEBA4U19I7LN | 5CSEBA4U19I7 | 5CSEBA4U19C8SN | 5CSEBA4U19C7SN | 5CSEBA5U19C8SN | 5CSEBA6U19I7SN |
|---|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (19x19) | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 85,000 | 110,000 |
| HPS Core | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | I7 (industrial, fastest) | I7N | I7N | I7LN (low-power) | I7 | C8 (commercial, fast) | C7 (commercial) | C8 (commercial, fast) | I7 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C |
| HPS Max Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 925 MHz |
| Transceivers | None (SE family) | None | None | None | None | None | None | None | None |
Key Differentiators
- Highest speed grade in 40K LE Cyclone V SE family (vs 5CSEBA4U19C8SN)
- Industrial -40C to +100C temperature range (vs 5CSEBA4U19C8SN)
- Same-footprint density scaling options available (vs 5CSEBA5U19C8SN)
Design Notes
Estimated: The Cyclone V SE SoC FPGA at full HPS load (800 MHz) plus high FPGA utilization typically draws 3-5 W total board power. Decouple the HPS core rail (VCC_HPS) with 22 uF + 4.7 uF + 0.1 uF ceramic capacitors placed within 5 mm of the BGA balls, and replicate this on each FPGA core and I/O bank rail. Use a 6-layer PCB with dedicated power and ground planes to keep impedance below target ripple thresholds; refer to the Cyclone V Device Handbook Pin Connection Guidelines for the full decoupling schedule.
Estimated: The 484 UBG A package uses a 1.0 mm ball pitch on a 19x19 mm body - trace fanout requires microvia HDI PCB technology or a 6-layer stackup with buried vias. Plan escape routing before schematic freeze: HPS pins for DDR3/LPDDR2 must reach the SoC EDS reference layout exactly, since trace-length matching is enforced by Quartus Prime during memory controller calibration. Allocate HPS I/O first (DDR, boot flash, JTAG), then assign FPGA user I/O around the remaining balls.
At continuous HPS load and high FPGA utilization, the 484 UBG A package may need a thermal pad or bottom-side heatsink, especially in industrial environments approaching +100C. Estimate thermal resistance theta_JA from the Cyclone V Device Handbook U19 thermal model; if calculated junction temperature exceeds 105C, attach a 15x15 mm copper pad with thermal vias to a 10x10 mm aluminum heatsink. Use a case-to-ambient thermal sensor for thermal-foldback implementation on the HPS side via the Linux thermal subsystem.
Do not leave HPS boot configuration pins floating - tie MSEL[2:0] to the boot mode (typically 010 for NAND flash or 100 for SD/MMC) through 4.7 kohm resistors. Failing to configure MSEL correctly results in no boot or unpredictable boot path. Also confirm the HPS reset (nHPS_RST) and FPGA configuration done (nCONFIG, nSTATUS, CONF_DONE) signals are properly pulled up per the handbook. JTAG pins TCK, TMS, TDI, TDO must each have a 10 kohm pull-up to VCC_POR (3.3 V) for stable boundary-scan operation.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified at the standard part; functional-safety variants are available separately. Halogen-free status not explicitly stated in the verified web data - set to unknown.
