EP1K50FC256-1 - 50K Gates ACEX 1K FPGA 256-FBGA | Altera
料号： EP1K50FC256-1 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $24.9 | $2,490.00 |
| 250 | $21.4 | $5,350.00 |
| 500 | $18.95 | $9,475.00 |
EP1K50FC256-1 概述
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells. FPGAs occupy a position in the programmable logic hierarchy above simple PLDs and below or alongside ASICs in terms of integration density. Within Altera's portfolio, the ACEX 1K family sits between the legacy FLEX 6000/8000 families and the higher-density APEX/Stratix families, offering mid-range density in a cost-optimized architecture.
Key features of the EP1K50FC256-1 include 360 Logic Array Blocks (LABs), built-in memory for FIFOs and small buffers, support for multiple I/O standards through dedicated I/O banks, and a maximum internal operating frequency of 250 MHz. The part is offered in a commercial speed grade (-1) and uses SRAM configuration cells, requiring an external configuration device or JTAG download on every power-up.
The ACEX 1K architecture combines a low-cost, fine-grained logic fabric with embedded memory blocks (EABs) that double as RAM, ROM, or FIFO. The 0.22 µm process delivers a balance of density and static power, while the FBGA-256 package provides high signal and power-pin counts for designs that need many I/Os and high pin-to-pad ratio in compact board area.
Typical applications include bus-bridging and protocol-conversion glue logic, industrial control and instrumentation front ends, low-density communications interfaces, memory and display controllers, and legacy design replacements where ACEX 1K firmware already exists. The 186 user I/Os and 40 Kbit embedded RAM make it especially useful as a companion controller to microprocessors or DSPs.
When designing with the EP1K50FC256-1, engineers must respect the 2.5 V core supply requirement, plan for a configuration memory source (EPC or JTAG), and observe the device's commercial temperature range. The FBGA-256 package demands careful PCB layout, including escape routing and thermal vias, to maintain signal and power integrity at system level.
This page consolidates distributor pricing, parameter coverage, and same-family drop-in alternatives beyond what the manufacturer datasheet provides, helping sourcing and design engineers evaluate the EP1K50FC256-1 alongside equivalent ACEX 1K variants on the same 256-ball footprint.
直接替换替代料： EP1K50FC256-1 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1K50FC256-1 （相同外形与封装尺寸） ——差异在于 Process Technology, Package, Speed Grade, Operating Temperature, Configuration Method.
快速对比工具——选择替代料号进行并排对比：
EP1K50FC256-1N
✅ 直接替换✓ 有现货
$15.1 / 个
查看数据手册 →EP1K50FC256-3
✅ 直接替换✓ 有现货
$54.4 / 个
查看数据手册 →EP1K100FC256-1
✅ 直接替换✓ 有现货
$53.2 / 个
查看数据手册 →EP1K100FC256-1N
✅ 直接替换✓ 有现货
$22.1 / 个
查看数据手册 →EP1K30FC256-1
✅ 直接替换✓ 有现货
$17.85 / 个
查看数据手册 →EP1K50FC256-1 最大额定值与电气特性
| Family | ACEX 1K |
| Logic Elements / Cells | 2,880 |
| System Gates | 50,000 |
| Maximum System Gates | 199,000 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory (EAB) | 40 Kbit (EAB-based) |
| Total RAM Bits | 40,960 |
| User I/Os | 186 |
| Operating Supply Voltage (Core) | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 250 MHz |
| Configuration Memory Type | SRAM |
| 封装 | 256-ball FBGA (FineLine BGA) |
| 安装类型 | Surface Mount |
| Operating Temperature Grade | Commercial (0 °C to +70 °C) |
| RoHS 状态 | Non-compliant (per distributor data) |
| Part Status | Obsolete (per Arrow listing) |
EP1K50FC256-1 256-ball fbga (fineline bga) 引脚配置指南
EP1K50FC256-1（256-ball fbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1K50FC256-1.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1K50FC256-1 适用于 6 应用s: Bus-Bridging and Protocol-Conversion Glue Logic, Industrial Control and Instrumentation Front Ends, Legacy Communications Interface Controllers, Memory and Display Controllers, Design Replacement for Legacy ACEX 1K Boards, Test & Measurement Fixture Logic.
Bus-Bridging and Protocol-Conversion Glue Logic
The EP1K50FC256-1 is a strong fit for bus-bridging designs that need to translate between legacy parallel buses (PCI, ISA, VME) and modern processors, because its 2,880 logic elements and 360 LABs provide ample capacity for state machines, FIFOs, and address decoding while its 186 user I/Os leave headroom for wide data buses plus control. Per ACEX 1K datasheet, the 40 Kbit EAB memory allows on-chip FIFO buffers between mismatched clock domains. Engineers typically pair it with a host CPU where firmware upgrades require protocol-flexible bridges, accepting higher static power from the 0.22 µm process in exchange for short time-to-market.
推荐
Industrial Control and Instrumentation Front Ends
In industrial control systems, the EP1K50FC256-1 serves as a configurable front-end that aggregates sensor signals, drives display or HMI interfaces, and pre-processes data before forwarding to a controller. Its 186 I/Os accommodate many ADC/DAC channels and discrete lines, while the 2.5 V core fits behind common 3.3 V-tolerant I/O bank designs. However, per distributor records the part is commercial-grade (0 °C to 70 °C), so industrial temperature deployments should use the -1N or industrial EP1K50FI256-2 variant. The 250 MHz fabric supports real-time sampling and modest DSP-style filtering.
推荐
Legacy Communications Interface Controllers
The EP1K50FC256-1 fits well in legacy telecom or datacom interface cards implementing T1/E1, HDLC, UART, or custom serial protocols. With 2,880 logic elements and 40 Kbits of embedded RAM, the device can host multi-channel state machines, small packet buffers, and CRC engines on a single chip, eliminating external glue logic. Per ACEX 1K datasheet, the SRAM fabric enables field reconfiguration to add new protocols without hardware changes. The 256-FBGA package keeps board area compact while supporting high I/O count for multi-drop serial lines.
推荐
Memory and Display Controllers
Designers use the EP1K50FC256-1 as a custom memory controller (SRAM, DRAM, NOR flash) or display driver interface (VGA, LVDS bridges) when off-the-shelf controllers are unavailable or inflexible. The 186 user I/Os handle wide data and address buses plus timing-critical strobes, while the 40 Kbit EAB memory provides small cache/line buffers. Per ACEX 1K family datasheet, the I/O banks support multiple voltage standards, simplifying mixed-voltage interfacing. The 250 MHz internal frequency supports pixel-clock and memory-clock generation in compact SoM designs.
推荐
Design Replacement for Legacy ACEX 1K Boards
When manufacturing legacy ACEX 1K-based boards and the original FPGA is end-of-life, the EP1K50FC256-1 can be re-qualified to keep designs in production without firmware porting. Per ACEX 1K datasheet family, the part is electrically and pin-compatible with prior ACEX 1K 256-FBGA footprints, so existing Quartus II bitstreams targeting the same die revision typically load directly. Engineers should validate timing closure under the new speed-grade lot and check that lead-finish and RoHS status match the board's bill of materials. This preserves firmware investment.
推荐
Test & Measurement Fixture Logic
Test fixtures and ATE-style boards often use ACEX 1K devices like the EP1K50FC256-1 to implement reconfigurable pattern generators, scan controllers, or DUT interface adapters. Its 186 user I/Os support many parallel channels, the 250 MHz fabric enables high-rate pattern generation, and SRAM configuration lets engineers swap bitstreams for different DUT families. Per ACEX 1K datasheet, JTAG-based programming simplifies fixture firmware updates in the field. The 256-FBGA package provides compact routing, but engineers should plan thermal vias given the 0.22 µm process power profile.
推荐
推荐产品汇总
工程参考数据： EP1K50FC256-1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1K50FC256-1N | EP1K50FC256-3 | EP1K100FC256-1 | EP1K100FC256-1N | EP1K30FC256-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-FBGA | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) |
| System Gates | 50,000 | 50,000 | 50,000 | 100,000 | 100,000 | 30,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 4,992 | 4,992 | 1,728 |
| Embedded Memory | 40 Kbit | 40 Kbit | 40 Kbit | 48 Kbit | 48 Kbit | 24 Kbit |
| User I/Os | 186 | 186 | 186 | 186 | 186 | 186 |
| Speed Grade | -1 (250 MHz) | -1 (same) | -3 (faster) | -1 (same) | -1 (same) | -1 (same) |
| Temperature Grade | Commercial (0 °C to 70 °C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Same-family upgrade path within 256-FBGA footprint （对比 EP1K50FC256-1N)
- Higher logic capacity without PCB change （对比 EP1K100FC256-1)
- Lower-cost, lower-density alternative within same package （对比 EP1K30FC256-1)
设计说明
Estimated: At a typical 2.5 V core supply and 5 mA quiescent current, the EP1K50FC256-1 core draws roughly 12.5 mW idle. With 186 I/Os switching under load, supply current can rise significantly and core power may reach hundreds of milliwatts depending on toggle rate. Per the ACEX 1K datasheet, the 2.5 V rail must be regulated within ±5 % (2.375 V to 2.625 V). Decouple the core supply with 0.1 µF and 10 µF ceramic capacitors placed close to the FBGA power balls, and provide separate decoupling for each I/O bank to minimize switching noise coupling into the logic fabric.
The 256-FBGA package demands careful PCB escape routing because the ball pitch is 1.0 mm. Use 4-layer or higher stackups with continuous power and ground planes directly under the device to provide a low-impedance return path and thermal spreading. Per ACEX 1K datasheet layout guidelines, route differential pairs with matched lengths and avoid routing signals across split planes. Stitch the ground plane with sufficient vias near the BGA to reduce inductance, and add thermal vias under the central pad area (if present) to improve heat dissipation for the 0.22 µm process.
The EP1K50FC256-1 uses SRAM configuration memory and therefore requires a configuration device (e.g., EPC2LC20) or JTAG download on every power-up - it does not retain its bitstream when powered off. Per ACEX 1K datasheet, nCONFIG, nSTATUS, and CONF_DONE signals must be properly pulled and monitored for proper startup. Engineers migrating from older ACEX 1K bitstreams should revalidate timing closure under the new speed-grade lot, and verify that the lead-finish variant (with or without N suffix) matches the PCB's solderability profile.
合规信息
RoHS non-compliant per Arrow listing for EP1K50FC256-1 (EU RoHS Not Compliant). REACH SVHC Exceeds Threshold per same listing; consult manufacturer for current SVHC declaration. The -1N variant provides a lead-free drop-in option. AEC-Q100 is not applicable (FPGA is not automotive-qualified in this family).
