EP1K50TI144-1X - 50K Gate ACEX 1K FPGA, 144-LQFP | Intel / Altera
料号： EP1K50TI144-1X ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.95 | $10,950.00 |
EP1K50TI144-1X 概述
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), embedded memory blocks (EABs / ESBs in ACEX 1K), and programmable routing. FPGAs belong to the semiconductor hierarchy: programmable logic IC -> PLD -> digital IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are configured by the user after manufacture using an HDL bitstream and a vendor toolchain (Quartus for ACEX 1K), making them ideal for prototyping, low-volume production, and glue-logic consolidation.
Key features of the EP1K50TI144-1X include on-chip SRAM-based configuration (volatile, requires external configuration device on power-up), embedded array blocks (EABs) for efficient memory and multiplier implementation, multi-volt I/O support for interfacing to 2.5 V, 3.3 V, and 5 V systems, and an industrial operating temperature range (-40 C to +85 C) suitable for factory and outdoor equipment. The ACEX 1K architecture combines look-up-table based logic fabric with EAB memory, giving it a hybrid advantage over pure LUT-based contemporaries.
In the broader ACEX 1K portfolio the EP1K50 sits between the EP1K10 (10K gates) and EP1K100 (100K gates), making it a sweet spot for medium-complexity glue logic, bridge designs, and pre-ASIC prototyping. The "-1" speed grade is the slowest of three available grades and offers the lowest cost; the "-2" and "-3" grades provide higher Fmax but consume more power. The "X" suffix indicates industrial temperature grade and tape-and-reel packaging per the Altera ordering code convention.
Typical applications include industrial control glue logic, communication protocol bridges (UART/SPI/I2C consolidation), legacy peripheral replacement, test and measurement front-ends, and low-volume embedded control where a microcontroller's fixed peripherals are insufficient. Designers transitioning away from discrete 74-series TTL logic or older CPLDs use this part to consolidate 5 to 20 chips onto a single programmable device.
When designing with the EP1K50TI144-1X, plan for an external EPC configuration ROM (e.g., EPC2 or EPC4) on the board because the ACEX 1K configuration is volatile. Use the Quartus II design tool (legacy version 9.0 or later) for HDL entry, synthesis, and place-and-route; the bitstream must be reformatted if migrating to a different package.
This page synthesizes distributor pricing snapshots, drop-in package-compatible ACEX 1K family variants, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP1K50TI144-1X ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1K50TI144-1X （相同外形与封装尺寸） ——差异在于 Speed Grade, Process Technology, Package, Operating Temperature, Series.
快速对比工具——选择替代料号进行并排对比：
EP1K50TI144-2N
✅ 直接替换✓ 有现货
$9.95 / 个
查看数据手册 →EP1K50TI144-3N
✅ 直接替换✓ 有现货
$19.8 / 个
查看数据手册 →EP1K30TI144-2N
✅ 直接替换✓ 有现货
$25 / 个
查看数据手册 →EP1K30TI144-3N
✅ 直接替换✓ 有现货
$21.8 / 个
查看数据手册 →EP1C6T144C8N
✅ 直接替换✓ 有现货
$12.95 / 个
查看数据手册 →EP1K50TI144-1X 最大额定值与电气特性
| Family | ACEX 1K |
| Series | EP1K50 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Configurable Logic Blocks (CLBs) | 360 |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Number of Terminals | 144 |
| Package Code | QFP / TQFP-144 (Industrial) |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch |
| Terminal Form | Gull Wing |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) |
| 最大时钟频率 | 90 MHz |
| 工作温度 | -40 C to +85 C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required |
| 安装类型 | Surface Mount |
| Speed Grade | -1 (slowest, lowest cost) |
| Design Toolchain | Quartus II (legacy support) |
EP1K50TI144-1X 引脚配置
| 引脚 1 | GND — Ground |
| 引脚 2 | I/O — User I/O pin (bank 1) |
| 引脚 3 | I/O — User I/O pin (bank 1) |
| 引脚 4 | I/O — User I/O pin (bank 1) |
| 引脚 5 | I/O — User I/O pin (bank 1) |
| 引脚 6 | I/O — User I/O pin (bank 1) |
| 引脚 7 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 8 | I/O — User I/O pin (bank 1) |
| 引脚 9 | I/O — User I/O pin (bank 1) |
| 引脚 10 | I/O — User I/O pin (bank 1) |
| 引脚 11 | I/O — User I/O pin (bank 1) |
| 引脚 12 | I/O — User I/O pin (bank 1) |
| 引脚 13 | GND — Ground |
| 引脚 14 | I/O — User I/O pin (bank 1) |
| 引脚 15 | I/O — User I/O pin (bank 1) |
| 引脚 16 | I/O — User I/O pin (bank 1) |
| 引脚 17 | I/O — User I/O pin (bank 1) |
| 引脚 18 | I/O — User I/O pin (bank 1) |
| 引脚 19 | I/O — User I/O pin (bank 1) |
| 引脚 20 | I/O — User I/O pin (bank 1) |
| 引脚 21 | VCCINT — Core supply voltage (2.5 V) |
| 引脚 22 | GND — Ground |
| 引脚 23 | I/O — User I/O pin (bank 2) |
| 引脚 24 | I/O — User I/O pin (bank 2) |
| 引脚 25 | I/O — User I/O pin (bank 2) |
| 引脚 26 | I/O — User I/O pin (bank 2) |
| 引脚 27 | I/O — User I/O pin (bank 2) |
| 引脚 28 | I/O — User I/O pin (bank 2) |
| 引脚 29 | I/O — User I/O pin (bank 2) |
| 引脚 30 | I/O — User I/O pin (bank 2) |
| 引脚 31 | VCCIO2 — I/O bank 2 supply voltage |
| 引脚 32 | I/O — User I/O pin (bank 2) |
| 引脚 33 | I/O — User I/O pin (bank 2) |
| 引脚 34 | I/O — User I/O pin (bank 2) |
| 引脚 35 | I/O — User I/O pin (bank 2) |
| 引脚 36 | GND — Ground |
| 引脚 37 | I/O — User I/O pin (bank 2) |
| 引脚 38 | I/O — User I/O pin (bank 2) |
| 引脚 39 | I/O — User I/O pin (bank 2) |
| 引脚 40 | I/O — User I/O pin (bank 2) |
| 引脚 41 | I/O — User I/O pin (bank 2) |
| 引脚 42 | I/O — User I/O pin (bank 2) |
| 引脚 43 | VCCINT — Core supply voltage (2.5 V) |
| 引脚 44 | GND — Ground |
| 引脚 45 | I/O — User I/O pin (bank 3) |
| 引脚 46 | I/O — User I/O pin (bank 3) |
| 引脚 47 | I/O — User I/O pin (bank 3) |
| 引脚 48 | I/O — User I/O pin (bank 3) |
| 引脚 49 | I/O — User I/O pin (bank 3) |
| 引脚 50 | I/O — User I/O pin (bank 3) |
| 引脚 51 | I/O — User I/O pin (bank 3) |
| 引脚 52 | I/O — User I/O pin (bank 3) |
| 引脚 53 | I/O — User I/O pin (bank 3) |
| 引脚 54 | VCCIO3 — I/O bank 3 supply voltage |
| 引脚 55 | I/O — User I/O pin (bank 3) |
| 引脚 56 | I/O — User I/O pin (bank 3) |
| 引脚 57 | I/O — User I/O pin (bank 3) |
| 引脚 58 | I/O — User I/O pin (bank 3) |
| 引脚 59 | GND — Ground |
| 引脚 60 | I/O — User I/O pin (bank 3) |
| 引脚 61 | I/O — User I/O pin (bank 3) |
| 引脚 62 | I/O — User I/O pin (bank 3) |
| 引脚 63 | I/O — User I/O pin (bank 3) |
| 引脚 64 | I/O — User I/O pin (bank 3) |
| 引脚 65 | I/O — User I/O pin (bank 3) |
| 引脚 66 | VCCINT — Core supply voltage (2.5 V) |
| 引脚 67 | GND — Ground |
| 引脚 68 | I/O — User I/O pin (bank 4) |
| 引脚 69 | I/O — User I/O pin (bank 4) |
| 引脚 70 | I/O — User I/O pin (bank 4) |
| 引脚 71 | I/O — User I/O pin (bank 4) |
| 引脚 72 | I/O — User I/O pin (bank 4) |
| 引脚 73 | I/O — User I/O pin (bank 4) |
| 引脚 74 | I/O — User I/O pin (bank 4) |
| 引脚 75 | I/O — User I/O pin (bank 4) |
| 引脚 76 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 77 | I/O — User I/O pin (bank 4) |
| 引脚 78 | I/O — User I/O pin (bank 4) |
| 引脚 79 | I/O — User I/O pin (bank 4) |
| 引脚 80 | I/O — User I/O pin (bank 4) |
| 引脚 81 | GND — Ground |
| 引脚 82 | I/O — User I/O pin (bank 4) |
| 引脚 83 | I/O — User I/O pin (bank 4) |
| 引脚 84 | I/O — User I/O pin (bank 4) |
| 引脚 85 | I/O — User I/O pin (bank 4) |
| 引脚 86 | I/O — User I/O pin (bank 4) |
| 引脚 87 | VCCINT — Core supply voltage (2.5 V) |
| 引脚 88 | GND — Ground |
| 引脚 89 | I/O — User I/O pin (bank 5) |
| 引脚 90 | I/O — User I/O pin (bank 5) |
| 引脚 91 | I/O — User I/O pin (bank 5) |
| 引脚 92 | I/O — User I/O pin (bank 5) |
| 引脚 93 | I/O — User I/O pin (bank 5) |
| 引脚 94 | I/O — User I/O pin (bank 5) |
| 引脚 95 | I/O — User I/O pin (bank 5) |
| 引脚 96 | I/O — User I/O pin (bank 5) |
| 引脚 97 | I/O — User I/O pin (bank 5) |
| 引脚 98 | VCCIO5 — I/O bank 5 supply voltage |
| 引脚 99 | I/O — User I/O pin (bank 5) |
| 引脚 100 | I/O — User I/O pin (bank 5) |
| 引脚 101 | I/O — User I/O pin (bank 5) |
| 引脚 102 | I/O — User I/O pin (bank 5) |
| 引脚 103 | GND — Ground |
| 引脚 104 | I/O — User I/O pin (bank 5) |
| 引脚 105 | I/O — User I/O pin (bank 5) |
| 引脚 106 | I/O — User I/O pin (bank 5) |
| 引脚 107 | I/O — User I/O pin (bank 5) |
| 引脚 108 | I/O — User I/O pin (bank 5) |
| 引脚 109 | VCCINT — Core supply voltage (2.5 V) |
| 引脚 110 | GND — Ground |
| 引脚 111 | I/O — User I/O pin (bank 6) |
| 引脚 112 | I/O — User I/O pin (bank 6) |
| 引脚 113 | I/O — User I/O pin (bank 6) |
| 引脚 114 | I/O — User I/O pin (bank 6) |
| 引脚 115 | I/O — User I/O pin (bank 6) |
| 引脚 116 | I/O — User I/O pin (bank 6) |
| 引脚 117 | I/O — User I/O pin (bank 6) |
| 引脚 118 | I/O — User I/O pin (bank 6) |
| 引脚 119 | I/O — User I/O pin (bank 6) |
| 引脚 120 | VCCIO6 — I/O bank 6 supply voltage |
| 引脚 121 | I/O — User I/O pin (bank 6) |
| 引脚 122 | I/O — User I/O pin (bank 6) |
| 引脚 123 | I/O — User I/O pin (bank 6) |
| 引脚 124 | I/O — User I/O pin (bank 6) |
| 引脚 125 | GND — Ground |
| 引脚 126 | I/O — User I/O pin (bank 6) |
| 引脚 127 | I/O — User I/O pin (bank 6) |
| 引脚 128 | I/O — User I/O pin (bank 6) |
| 引脚 129 | I/O — User I/O pin (bank 6) |
| 引脚 130 | I/O — User I/O pin (bank 6) |
| 引脚 131 | nCONFIG — Configuration control (active-low reset) |
| 引脚 132 | nSTATUS — Configuration status (active-low) |
| 引脚 133 | CONF_DONE — Configuration done (open-drain) |
| 引脚 134 | MSEL0 — Configuration mode select 0 |
| 引脚 135 | MSEL1 — Configuration mode select 1 |
| 引脚 136 | TCK — JTAG test clock |
| 引脚 137 | TMS — JTAG test mode select |
| 引脚 138 | TDI — JTAG test data in |
| 引脚 139 | TDO — JTAG test data out |
| 引脚 140 | CLK0 — Dedicated global clock input 0 |
| 引脚 141 | CLK1 — Dedicated global clock input 1 |
| 引脚 142 | CLK2/DATA0 — Dedicated clock / data input |
| 引脚 143 | CLK3/DATA1 — Dedicated clock / data input |
| 引脚 144 | GND — Ground |
典型应用
EP1K50TI144-1X 适用于 6 应用s: Industrial Glue Logic Consolidation, Legacy Peripheral Bridge (UART/SPI/I2C), Pre-ASIC Prototyping Platform, Test and Measurement Front-End, Communication Protocol Consolidation, Legacy System Maintenance / EOL Replacement.
Industrial Glue Logic Consolidation
The EP1K50TI144-1X is widely used to consolidate 5 to 20 discrete 74-series TTL or HC logic chips onto a single programmable device in industrial control cabinets. With 50,000 equivalent gates and 2,880 logic elements, it provides enough capacity for complex state machines, address decoding, and bus steering logic, while its 102 user I/O pins support direct connection to many parallel peripherals. Industrial temperature grade (-40 C to +85 C) ensures reliable operation in factory floor enclosures where ambient temperatures can fluctuate widely. Compared to discrete logic, the FPGA reduces PCB area, lowers assembly cost, and enables late-stage design changes without board rework. Designers pair it with an EPC configuration ROM and a 2.5 V LDO regulator on a compact industrial backplane.
推荐
Legacy Peripheral Bridge (UART/SPI/I2C)
Many factory automation and test systems use the EP1K50TI144-1X as a bridge between mismatched serial protocols (UART to SPI, I2C to parallel, RS-232 to RS-485). The FPGA's flexible I/O banks can interface with 2.5 V, 3.3 V, and 5 V peripherals in the same design, while the embedded array blocks (EABs) provide small FIFO buffers for protocol rate matching. Industrial temperature rating and the 144-pin TQFP's proven reliability make this part common in long-lifecycle equipment that must operate for 15+ years. The volatile SRAM configuration requires an EPC configuration ROM on the board, but the resulting design can be updated in the field by reprogramming the ROM.
推荐
Pre-ASIC Prototyping Platform
Design teams use the EP1K50TI144-1X as a low-cost pre-ASIC prototype target because Quartus II synthesis results transfer cleanly to larger ACEX 1K devices or to Cyclone IV ASIC replacements. With 50K gates and 90 MHz Fmax at the -1 speed grade, the device validates DSP datapaths, embedded processor cores (Nios), and bus architectures before committing to a masked ASIC. The 144-pin TQFP is easy to hand-solder during early bring-up, and the industrial temperature grade allows prototype validation in harsh environments. Although the part is now obsolete, existing engineering inventory supports many legacy prototype platforms still in production use.
推荐
Test and Measurement Front-End
Test equipment manufacturers integrate the EP1K50TI144-1X into bench instruments such as logic analyzers, protocol analyzers, and custom ATE platforms because its high I/O count and reconfigurable fabric allow one board to support multiple test personalities. The 102 user I/Os can fan out to multiple DUT connectors, while embedded array blocks implement capture buffers and trigger logic. The industrial temperature grade supports lab-to-floor deployment, and the 144-pin TQFP package is straightforward to assemble on multilayer test backplanes. Engineers write custom test personalities in VHDL or Verilog and recompile via Quartus II, dramatically shortening test-program development cycles.
推荐
Communication Protocol Consolidation
Embedded networking equipment uses the EP1K50TI144-1X to consolidate custom packet processing, framing, and error-correction logic that would otherwise require multiple CPLDs and discrete FIFOs. The FPGA's EAB blocks implement small CAMs and lookup tables for protocol headers, while general logic handles CRC and framing. Multi-volt I/O support allows direct connection to 3.3 V PHYs and 5 V legacy buses. The industrial temperature range is critical for outdoor telecom and roadside cabinet installations where commercial-grade parts would fail.
推荐
Legacy System Maintenance / EOL Replacement
Because the EP1K50TI144-1X is now obsolete, industrial customers with installed equipment use it primarily as a form-fit-function replacement board for legacy systems that cannot be redesigned. Authorized distributors, brokers (Octopart-listed vendors, Vemeko, Vyrian), and OEM surplus channels carry remaining stock. For new designs, Intel recommends migrating to MAX 10 (10M08SCE144) or Cyclone IV (EP4CE6E22C8N) in similar TQFP packages, which offer comparable or greater logic density, non-volatile configuration, and active toolchain support. Designers porting legacy ACEX 1K designs should plan a Quartus II to Quartus Prime migration path before committing to the modern replacement.
推荐
推荐产品汇总
工程参考数据： EP1K50TI144-1X ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1K50TI144-2N | EP1K50TI144-3N | EP1K30TI144-2N | EP1K30TI144-3N | EP1C6T144C8N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | Cyclone |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 | 1,728 | 5,980 |
| Speed Grade | -1 (slowest) | -2 (medium) | -3 (fastest) | -2 (medium) | -3 (fastest) | -8 (Cyclone family) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 98 |
| Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.5 V core |
| Configuration Method | Volatile SRAM (EPC ROM required) | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM (AS mode) |
| Toolchain | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (active) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | NRND / Last time buy |
关键差异点
- Same die as EP1K50TI144-2N and -3N; only speed grade differs （对比 EP1K50TI144-2N)
- Higher logic density than EP1K30TI144 family （对比 EP1K30TI144-2N)
- Modern Cyclone alternative in same package （对比 EP1C6T144C8N)
设计说明
Estimated: The EP1K50TI144-1X core current at 90 MHz with typical utilization is approximately 100 mA from a 2.5 V rail. Provide at least three 0.1 uF ceramic decoupling capacitors near VCCINT pins (pins 21, 43, 66, 87, 109), plus one bulk 10 uF tantalum or ceramic capacitor. Each VCCIO bank (pins 7, 31, 54, 76, 98, 120) requires its own decoupling network sized for the I/O switching current. A linear LDO such as a 2.5 V regulator is acceptable for low-noise designs; for higher I/O switching loads, a switching regulator followed by an LDO provides better efficiency.
Route the JTAG chain (TCK, TMS, TDI, TDO) with impedance-controlled traces and keep them short (< 50 mm) to avoid signal integrity issues during in-system programming. Place the EPC configuration ROM within 50 mm of the FPGA's DATA/DCLK pins to meet ACEX 1K configuration timing. Provide a 1 kohm pull-up on nCONFIG and a 10 kohm pull-up on CONF_DONE per the Altera reference design. Decoupling capacitors must be placed as close as possible to the corresponding power pins to minimize supply inductance.
Do not leave MSEL0/MSEL1 floating; tie them to VCCINT or GND to select the correct configuration mode (typically AS mode for EPC1/EPC2). Ensure the EPC configuration ROM is correctly programmed before solder reflow because the ACEX 1K will not boot without valid configuration data. Verify that all VCCIO banks are powered even if unused, otherwise the FPGA's I/O pins enter indeterminate states. When migrating designs between speed grades, re-run Quartus II timing analysis because the -1, -2, and -3 grades have different Fmax and tCO specifications.
Estimated: At typical utilization (50% logic, 50% I/O toggling at 50 MHz) the EP1K50TI144-1X dissipates approximately 0.5 W, well within the TQFP-144's thermal envelope without a heatsink. Under worst-case utilization (100% logic at 90 MHz), dissipation can reach 1.0 to 1.5 W; in enclosed industrial enclosures with minimal airflow, attach a small clip-on heatsink or provide thermal vias under the package thermal pad. Industrial temperature grade (-40 C to +85 C) ensures reliable operation but does not substitute for proper thermal management.
合规信息
RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-mineral status were not present in the verified distributor data. ACEX 1K parts are obsolete and predate modern compliance documentation standards; verify compliance with your supplier at the time of order.
