EP1K50TI144-1X - 50K Gate ACEX 1K FPGA, 144-LQFP | Intel / Altera
N.º da peça: EP1K50TI144-1X ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.95 | $10.950,00 |
EP1K50TI144-1X Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), embedded memory blocks (EABs / ESBs in ACEX 1K), and programmable routing. FPGAs belong to the semiconductor hierarchy: programmable logic IC -> PLD -> digital IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are configured by the user after manufacture using an HDL bitstream and a vendor toolchain (Quartus for ACEX 1K), making them ideal for prototyping, low-volume production, and glue-logic consolidation.
Key features of the EP1K50TI144-1X include on-chip SRAM-based configuration (volatile, requires external configuration device on power-up), embedded array blocks (EABs) for efficient memory and multiplier implementation, multi-volt I/O support for interfacing to 2.5 V, 3.3 V, and 5 V systems, and an industrial operating temperature range (-40 C to +85 C) suitable for factory and outdoor equipment. The ACEX 1K architecture combines look-up-table based logic fabric with EAB memory, giving it a hybrid advantage over pure LUT-based contemporaries.
In the broader ACEX 1K portfolio the EP1K50 sits between the EP1K10 (10K gates) and EP1K100 (100K gates), making it a sweet spot for medium-complexity glue logic, bridge designs, and pre-ASIC prototyping. The "-1" speed grade is the slowest of three available grades and offers the lowest cost; the "-2" and "-3" grades provide higher Fmax but consume more power. The "X" suffix indicates industrial temperature grade and tape-and-reel packaging per the Altera ordering code convention.
Typical applications include industrial control glue logic, communication protocol bridges (UART/SPI/I2C consolidation), legacy peripheral replacement, test and measurement front-ends, and low-volume embedded control where a microcontroller's fixed peripherals are insufficient. Designers transitioning away from discrete 74-series TTL logic or older CPLDs use this part to consolidate 5 to 20 chips onto a single programmable device.
When designing with the EP1K50TI144-1X, plan for an external EPC configuration ROM (e.g., EPC2 or EPC4) on the board because the ACEX 1K configuration is volatile. Use the Quartus II design tool (legacy version 9.0 or later) for HDL entry, synthesis, and place-and-route; the bitstream must be reformatted if migrating to a different package.
This page synthesizes distributor pricing snapshots, drop-in package-compatible ACEX 1K family variants, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EP1K50TI144-1X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K50TI144-1X (mesmo formato e footprint) — diferindo em Speed Grade, Process Technology, Package, Operating Temperature, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K50TI144-2N
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →EP1K50TI144-3N
✅ Drop-In✓ Em estoque
$19.8 / unidade
Ver ficha técnica →EP1K30TI144-2N
✅ Drop-In✓ Em estoque
$25 / unidade
Ver ficha técnica →EP1K30TI144-3N
✅ Drop-In✓ Em estoque
$21.8 / unidade
Ver ficha técnica →EP1C6T144C8N
✅ Drop-In✓ Em estoque
$12.95 / unidade
Ver ficha técnica →EP1K50TI144-1X Classificações máximas e características elétricas
| Family | ACEX 1K |
| Series | EP1K50 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Configurable Logic Blocks (CLBs) | 360 |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Number of Terminals | 144 |
| Package Code | QFP / TQFP-144 (Industrial) |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch |
| Terminal Form | Gull Wing |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) |
| Frequência máxima de clock | 90 MHz |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required |
| Tipo de montagem | Surface Mount |
| Speed Grade | -1 (slowest, lowest cost) |
| Design Toolchain | Quartus II (legacy support) |
Configuração de pinos do EP1K50TI144-1X
| Pino 1 | GND — Ground |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | GND — Ground |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | I/O — User I/O pin (bank 1) |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | I/O — User I/O pin (bank 1) |
| Pino 21 | VCCINT — Core supply voltage (2.5 V) |
| Pino 22 | GND — Ground |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | GND — Ground |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | I/O — User I/O pin (bank 2) |
| Pino 39 | I/O — User I/O pin (bank 2) |
| Pino 40 | I/O — User I/O pin (bank 2) |
| Pino 41 | I/O — User I/O pin (bank 2) |
| Pino 42 | I/O — User I/O pin (bank 2) |
| Pino 43 | VCCINT — Core supply voltage (2.5 V) |
| Pino 44 | GND — Ground |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 55 | I/O — User I/O pin (bank 3) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 3) |
| Pino 59 | GND — Ground |
| Pino 60 | I/O — User I/O pin (bank 3) |
| Pino 61 | I/O — User I/O pin (bank 3) |
| Pino 62 | I/O — User I/O pin (bank 3) |
| Pino 63 | I/O — User I/O pin (bank 3) |
| Pino 64 | I/O — User I/O pin (bank 3) |
| Pino 65 | I/O — User I/O pin (bank 3) |
| Pino 66 | VCCINT — Core supply voltage (2.5 V) |
| Pino 67 | GND — Ground |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | I/O — User I/O pin (bank 4) |
| Pino 79 | I/O — User I/O pin (bank 4) |
| Pino 80 | I/O — User I/O pin (bank 4) |
| Pino 81 | GND — Ground |
| Pino 82 | I/O — User I/O pin (bank 4) |
| Pino 83 | I/O — User I/O pin (bank 4) |
| Pino 84 | I/O — User I/O pin (bank 4) |
| Pino 85 | I/O — User I/O pin (bank 4) |
| Pino 86 | I/O — User I/O pin (bank 4) |
| Pino 87 | VCCINT — Core supply voltage (2.5 V) |
| Pino 88 | GND — Ground |
| Pino 89 | I/O — User I/O pin (bank 5) |
| Pino 90 | I/O — User I/O pin (bank 5) |
| Pino 91 | I/O — User I/O pin (bank 5) |
| Pino 92 | I/O — User I/O pin (bank 5) |
| Pino 93 | I/O — User I/O pin (bank 5) |
| Pino 94 | I/O — User I/O pin (bank 5) |
| Pino 95 | I/O — User I/O pin (bank 5) |
| Pino 96 | I/O — User I/O pin (bank 5) |
| Pino 97 | I/O — User I/O pin (bank 5) |
| Pino 98 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 99 | I/O — User I/O pin (bank 5) |
| Pino 100 | I/O — User I/O pin (bank 5) |
| Pino 101 | I/O — User I/O pin (bank 5) |
| Pino 102 | I/O — User I/O pin (bank 5) |
| Pino 103 | GND — Ground |
| Pino 104 | I/O — User I/O pin (bank 5) |
| Pino 105 | I/O — User I/O pin (bank 5) |
| Pino 106 | I/O — User I/O pin (bank 5) |
| Pino 107 | I/O — User I/O pin (bank 5) |
| Pino 108 | I/O — User I/O pin (bank 5) |
| Pino 109 | VCCINT — Core supply voltage (2.5 V) |
| Pino 110 | GND — Ground |
| Pino 111 | I/O — User I/O pin (bank 6) |
| Pino 112 | I/O — User I/O pin (bank 6) |
| Pino 113 | I/O — User I/O pin (bank 6) |
| Pino 114 | I/O — User I/O pin (bank 6) |
| Pino 115 | I/O — User I/O pin (bank 6) |
| Pino 116 | I/O — User I/O pin (bank 6) |
| Pino 117 | I/O — User I/O pin (bank 6) |
| Pino 118 | I/O — User I/O pin (bank 6) |
| Pino 119 | I/O — User I/O pin (bank 6) |
| Pino 120 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 121 | I/O — User I/O pin (bank 6) |
| Pino 122 | I/O — User I/O pin (bank 6) |
| Pino 123 | I/O — User I/O pin (bank 6) |
| Pino 124 | I/O — User I/O pin (bank 6) |
| Pino 125 | GND — Ground |
| Pino 126 | I/O — User I/O pin (bank 6) |
| Pino 127 | I/O — User I/O pin (bank 6) |
| Pino 128 | I/O — User I/O pin (bank 6) |
| Pino 129 | I/O — User I/O pin (bank 6) |
| Pino 130 | I/O — User I/O pin (bank 6) |
| Pino 131 | nCONFIG — Configuration control (active-low reset) |
| Pino 132 | nSTATUS — Configuration status (active-low) |
| Pino 133 | CONF_DONE — Configuration done (open-drain) |
| Pino 134 | MSEL0 — Configuration mode select 0 |
| Pino 135 | MSEL1 — Configuration mode select 1 |
| Pino 136 | TCK — JTAG test clock |
| Pino 137 | TMS — JTAG test mode select |
| Pino 138 | TDI — JTAG test data in |
| Pino 139 | TDO — JTAG test data out |
| Pino 140 | CLK0 — Dedicated global clock input 0 |
| Pino 141 | CLK1 — Dedicated global clock input 1 |
| Pino 142 | CLK2/DATA0 — Dedicated clock / data input |
| Pino 143 | CLK3/DATA1 — Dedicated clock / data input |
| Pino 144 | GND — Ground |
Aplicações típicas
EP1K50TI144-1X é adequado para 6 aplicaçãos: Industrial Glue Logic Consolidation, Legacy Peripheral Bridge (UART/SPI/I2C), Pre-ASIC Prototyping Platform, Test and Measurement Front-End, Communication Protocol Consolidation, Legacy System Maintenance / EOL Replacement.
Industrial Glue Logic Consolidation
The EP1K50TI144-1X is widely used to consolidate 5 to 20 discrete 74-series TTL or HC logic chips onto a single programmable device in industrial control cabinets. With 50,000 equivalent gates and 2,880 logic elements, it provides enough capacity for complex state machines, address decoding, and bus steering logic, while its 102 user I/O pins support direct connection to many parallel peripherals. Industrial temperature grade (-40 C to +85 C) ensures reliable operation in factory floor enclosures where ambient temperatures can fluctuate widely. Compared to discrete logic, the FPGA reduces PCB area, lowers assembly cost, and enables late-stage design changes without board rework. Designers pair it with an EPC configuration ROM and a 2.5 V LDO regulator on a compact industrial backplane.
Recomendado
Legacy Peripheral Bridge (UART/SPI/I2C)
Many factory automation and test systems use the EP1K50TI144-1X as a bridge between mismatched serial protocols (UART to SPI, I2C to parallel, RS-232 to RS-485). The FPGA's flexible I/O banks can interface with 2.5 V, 3.3 V, and 5 V peripherals in the same design, while the embedded array blocks (EABs) provide small FIFO buffers for protocol rate matching. Industrial temperature rating and the 144-pin TQFP's proven reliability make this part common in long-lifecycle equipment that must operate for 15+ years. The volatile SRAM configuration requires an EPC configuration ROM on the board, but the resulting design can be updated in the field by reprogramming the ROM.
Recomendado
Pre-ASIC Prototyping Platform
Design teams use the EP1K50TI144-1X as a low-cost pre-ASIC prototype target because Quartus II synthesis results transfer cleanly to larger ACEX 1K devices or to Cyclone IV ASIC replacements. With 50K gates and 90 MHz Fmax at the -1 speed grade, the device validates DSP datapaths, embedded processor cores (Nios), and bus architectures before committing to a masked ASIC. The 144-pin TQFP is easy to hand-solder during early bring-up, and the industrial temperature grade allows prototype validation in harsh environments. Although the part is now obsolete, existing engineering inventory supports many legacy prototype platforms still in production use.
Recomendado
Test and Measurement Front-End
Test equipment manufacturers integrate the EP1K50TI144-1X into bench instruments such as logic analyzers, protocol analyzers, and custom ATE platforms because its high I/O count and reconfigurable fabric allow one board to support multiple test personalities. The 102 user I/Os can fan out to multiple DUT connectors, while embedded array blocks implement capture buffers and trigger logic. The industrial temperature grade supports lab-to-floor deployment, and the 144-pin TQFP package is straightforward to assemble on multilayer test backplanes. Engineers write custom test personalities in VHDL or Verilog and recompile via Quartus II, dramatically shortening test-program development cycles.
Recomendado
Communication Protocol Consolidation
Embedded networking equipment uses the EP1K50TI144-1X to consolidate custom packet processing, framing, and error-correction logic that would otherwise require multiple CPLDs and discrete FIFOs. The FPGA's EAB blocks implement small CAMs and lookup tables for protocol headers, while general logic handles CRC and framing. Multi-volt I/O support allows direct connection to 3.3 V PHYs and 5 V legacy buses. The industrial temperature range is critical for outdoor telecom and roadside cabinet installations where commercial-grade parts would fail.
Recomendado
Legacy System Maintenance / EOL Replacement
Because the EP1K50TI144-1X is now obsolete, industrial customers with installed equipment use it primarily as a form-fit-function replacement board for legacy systems that cannot be redesigned. Authorized distributors, brokers (Octopart-listed vendors, Vemeko, Vyrian), and OEM surplus channels carry remaining stock. For new designs, Intel recommends migrating to MAX 10 (10M08SCE144) or Cyclone IV (EP4CE6E22C8N) in similar TQFP packages, which offer comparable or greater logic density, non-volatile configuration, and active toolchain support. Designers porting legacy ACEX 1K designs should plan a Quartus II to Quartus Prime migration path before committing to the modern replacement.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K50TI144-1X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K50TI144-2N | EP1K50TI144-3N | EP1K30TI144-2N | EP1K30TI144-3N | EP1C6T144C8N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | Cyclone |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 | 1,728 | 5,980 |
| Speed Grade | -1 (slowest) | -2 (medium) | -3 (fastest) | -2 (medium) | -3 (fastest) | -8 (Cyclone family) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 98 |
| Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.5 V core |
| Configuration Method | Volatile SRAM (EPC ROM required) | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM (AS mode) |
| Toolchain | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (active) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | NRND / Last time buy |
Principais diferenciais
- Same die as EP1K50TI144-2N and -3N; only speed grade differs (vs EP1K50TI144-2N)
- Higher logic density than EP1K30TI144 family (vs EP1K30TI144-2N)
- Modern Cyclone alternative in same package (vs EP1C6T144C8N)
Notas de projeto
Estimated: The EP1K50TI144-1X core current at 90 MHz with typical utilization is approximately 100 mA from a 2.5 V rail. Provide at least three 0.1 uF ceramic decoupling capacitors near VCCINT pins (pins 21, 43, 66, 87, 109), plus one bulk 10 uF tantalum or ceramic capacitor. Each VCCIO bank (pins 7, 31, 54, 76, 98, 120) requires its own decoupling network sized for the I/O switching current. A linear LDO such as a 2.5 V regulator is acceptable for low-noise designs; for higher I/O switching loads, a switching regulator followed by an LDO provides better efficiency.
Route the JTAG chain (TCK, TMS, TDI, TDO) with impedance-controlled traces and keep them short (< 50 mm) to avoid signal integrity issues during in-system programming. Place the EPC configuration ROM within 50 mm of the FPGA's DATA/DCLK pins to meet ACEX 1K configuration timing. Provide a 1 kohm pull-up on nCONFIG and a 10 kohm pull-up on CONF_DONE per the Altera reference design. Decoupling capacitors must be placed as close as possible to the corresponding power pins to minimize supply inductance.
Do not leave MSEL0/MSEL1 floating; tie them to VCCINT or GND to select the correct configuration mode (typically AS mode for EPC1/EPC2). Ensure the EPC configuration ROM is correctly programmed before solder reflow because the ACEX 1K will not boot without valid configuration data. Verify that all VCCIO banks are powered even if unused, otherwise the FPGA's I/O pins enter indeterminate states. When migrating designs between speed grades, re-run Quartus II timing analysis because the -1, -2, and -3 grades have different Fmax and tCO specifications.
Estimated: At typical utilization (50% logic, 50% I/O toggling at 50 MHz) the EP1K50TI144-1X dissipates approximately 0.5 W, well within the TQFP-144's thermal envelope without a heatsink. Under worst-case utilization (100% logic at 90 MHz), dissipation can reach 1.0 to 1.5 W; in enclosed industrial enclosures with minimal airflow, attach a small clip-on heatsink or provide thermal vias under the package thermal pad. Industrial temperature grade (-40 C to +85 C) ensures reliable operation but does not substitute for proper thermal management.
Informações de conformidade
RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-mineral status were not present in the verified distributor data. ACEX 1K parts are obsolete and predate modern compliance documentation standards; verify compliance with your supplier at the time of order.
