EP1M120B484C7 - 49,152 Logic Elements, 4800 Kbit, BGA-484 FPGA | Intel
MPN: EP1M120B484C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148.5 | $14,850.00 |
| 500 | $135 | $67,500.00 |
| 1,000 | $122 | $122,000.00 |
Drop-in alternatives for EP1M120B484C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M120B484C6
✅ Drop-In✓ In Stock
$55 / Unit
View Datasheet →EP1M120B484C5
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP1M120F484C7
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP1K100FC484-2
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →EP1K50FC484-2
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$21.8 / Unit
View Datasheet →EP1M120B484C7 Maximum Ratings & Electrical Characteristics
| Family | Mercury |
| Logic Elements | 49,152 |
| Embedded Memory (bits) | 4,800 Kbit (4,800 Kb / 600 KB) |
| User I/O Pins | 303 |
| Core Voltage | 1.5 V |
| Process Node | 0.13 µm |
| Package Type | 484-ball FineLine BGA (FCBGA) |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM / JTAG / Passive Serial |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS (multi-standard I/O) |
| Peak Reflow Temperature | 220 C |
| Configuration Device | EPC2 / EPC4 compatible |
| Design Tool | Quartus II (legacy version) |
EP1M120B484C7 484-ball fineline bga (fcbga) Pin Configuration Guide
Complete pinout information for EP1M120B484C7 (484-ball fineline bga (fcbga) package) with 303 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M120B484C7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 303 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M120B484C7 is suitable for 6 applications: Telecom Line Card / Baseband Processing, Industrial Motor Control and Machine Vision, Test and Measurement Instrumentation, Aerospace and Defense Signal Processing, High-Speed Data Acquisition Front-End, Legacy Networking / Router Fabric.
Telecom Line Card / Baseband Processing
The EP1M120B484C7 with 49,152 logic elements, 4,800 Kbits embedded SRAM and 303 user I/O is well suited for telecom line-card DSP, framer and protocol-terminator functions. Its 12 PLLs generate low-jitter clocks required by UTOPIA/POS-PHY bus interfaces and by SONET/SDH framers operating at 155-622 Mbps. The 303 I/O pins let designers terminate wide parallel buses and multiple LVDS links on a single device. Compared with a Cyclone II-class part, the Mercury device offers 6x the embedded memory for packet buffering, eliminating an external SRAM in many framer designs.
Recommended
Industrial Motor Control and Machine Vision
The EP1M120B484C7 supports multi-axis motor control and machine-vision pipelines through its 303 user I/O, which can simultaneously drive PWM outputs, encoder inputs and parallel image sensor interfaces. The 4,800 Kbits of embedded SRAM serves as line-buffer storage for image-processing kernels, allowing real-time filtering without external SDRAM. The 0.13 µm CMOS process and 1.5 V core keep dynamic power manageable in always-on industrial cabinets. Using LVDS I/O for image-sensor links reduces EMI emissions in factory-floor environments where CE/EN compliance is required.
Recommended
Test and Measurement Instrumentation
Test and measurement designs use the EP1M120B484C7 to implement deep trace buffers, custom trigger logic and protocol-aware pattern generators. The 4,800 Kbits embedded SRAM is ideal for circular acquisition buffers capturing microseconds of waveform data at hundreds of MSPS. The 303 user I/O accommodate high-channel-count logic analyzers and oscilloscope front-ends, while the 12 PLLs multiply low-jitter reference clocks to feed fast ADCs. Designers benefit from the device's SRAM-based re-programmability, allowing in-field firmware upgrades when new protocol decoders are introduced.
Recommended
Aerospace and Defense Signal Processing
Defense contractors historically qualified the EP1M120B484C7 for radar preprocessing, secure-comm encryption cores and avionic databus bridges. The 303 user I/O support ARINC 429 and MIL-STD-1553 line interfaces without external bus switches, while the 49,152 logic elements host cryptographic accelerators. The BGA-484 package's fine-pitch balls require controlled-impedance PCB stack-up, but allow high-density routing on multi-layer boards. Designers must validate date-code and lot traceability per MIL-PRF-38535 when sourcing from brokers for production.
Recommended
High-Speed Data Acquisition Front-End
The EP1M120B484C7 serves as the FPGA front-end in high-speed DAQ systems, capturing LVDS or parallel ADC outputs and pre-processing samples before forwarding to a host processor. The 303 user I/O let designers land multiple 12-14 bit ADC channels directly on the device, while the 12 PLLs synthesize the ADC sampling clocks with sub-ps jitter. The 4,800 Kbits embedded SRAM functions as a FIFO buffer between the ADC and downstream DMA engine. Compared with discrete logic, the FPGA approach reduces board area by 30-50% and enables late-stage design changes via re-programming.
Recommended
Legacy Networking / Router Fabric
Network OEMs built PCI-X and POS-PHY fabric cards around the EP1M120B484C7 because its 303 user I/O and 4,800 Kbits embedded SRAM allow in-line packet buffering without external TCAM. The device's multi-standard I/O banks directly interface with LVDS serializer/deserializer chips at 1-3 Gbps. Designers continue to maintain installed bases of these routers, requiring replacement parts for field repair. The Mercury family's JTAG and passive-serial configuration via EPC2 PROMs enables in-system firmware updates during scheduled maintenance windows.
Recommended
Recommended Products Summary
Engineering reference data for EP1M120B484C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M120B484C6 | EP1M120B484C5 | EP1M120F484C7 | EP1K100FC484-2 | EP1K50FC484-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FineLine BGA (FCBGA) | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball BGA - same | 484-ball BGA - same |
| Logic Elements | 49,152 | 49,152 | 49,152 | 49,152 | 100,000 (ACEX family) | 50,000 (ACEX family) |
| Embedded Memory | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 49,152 bit | 40,960 bit |
| User I/O Pins | 303 | 303 | 303 | 303 | 333 (ACEX) | 333 (ACEX) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 2.5 V (ACEX) | 2.5 V (ACEX) |
| Speed Grade | C7 | C6 (slower) | C5 (slowest) | C7 (same speed) | -2 (ACEX grade) | -2 (ACEX grade) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (ACEX) | Obsolete (ACEX) |
| Unit Price (qty 1, USD) | 185.00 | 165.00 | 145.00 | 190.00 | 120.00 | 85.00 |
Key Differentiators
- Highest-density legacy Mercury part with 49,152 logic elements and 4,800 Kbits embedded memory (vs EP1K100FC484-2)
- Same 484-ball BGA footprint as EP1M120B484C6 and EP1M120F484C7 (vs EP1M120B484C6)
- 303 user I/O exceeds most ACEX-family competitors in same BGA-484 (vs EP1K50FC484-2)
Design Notes
BGA-484 (FCBGA) requires controlled-impedance PCB stack-up with matched trace lengths for LVDS and DDR signals. Use microvia or via-in-pad construction with 0.4-0.5 mm pitch escape routing. Place 100 µF bulk decoupling within 25 mm of the package and 0.1 µF + 1 nF capacitors at every VCC pin pair. Connect all GND balls to a continuous inner ground plane for thermal and signal-return integrity.
Estimated: BGA-484 dissipates 3-5 W typical, 7-9 W worst-case at full I/O toggle. The thermal balls on the package bottom MUST be soldered to thermal vias that connect to inner copper planes. Without thermal via stitching, junction temperature can exceed 125 C in still air. For high-reliability boards, use at least 9 thermal vias per thermal ball, filled or capped per IPC-7095 Class 3.
Do not apply power to VCC before VCCIO is stable - this can latch the I/O buffers. Use EPC2 or EPC4 configuration PROMs in passive-serial mode; do not rely on JTAG alone for production because JTAG configuration is volatile after POR. Do not exceed the 220 C peak reflow temperature (Pb-free profile), or solder joint reliability degrades. When sourcing from independent distributors, always request date-code and lot traceability to detect counterfeit parts.
Route all PLL power supply pins (VCCA_PLL, VCCD_PLL) with star topology and isolate them from digital VCC with ferrite beads. Keep PLL analog ground pins on a separate quiet ground island connected to the main ground at a single point. Differential LVDS pairs must be length-matched to within 20 ps (~3 mm at 1.6 mm/ns) for 622 Mbps operation. Use 50 Ω single-ended impedance for SSTL class-II DDR interfaces.
Compliance Information
Compliance data not provided in Verified Web Data - engineer must request manufacturer's Certificate of Compliance for production builds. Mercury family parts were typically released with both Pb and Pb-free options; the C7 speed grade and BGA package strongly suggest lead-free but RoHS status must be confirmed via manufacturer product page.
