EP1S30F780C6N - Stratix FPGA 32K LE 780-FBGA | Intel / Altera
料号： EP1S30F780C6N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $312.5 | $312.50 |
| 10 | $285 | $2,850.00 |
| 100 | $245 | $24,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $185 | $185,000.00 |
EP1S30F780C6N 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs occupy the top tier of programmable logic, sitting between standard microcontrollers and ASICs in the broader integrated-circuit hierarchy: logic cell -> logic array block -> LAB -> FPGA fabric -> programmable logic device -> semiconductor. Unlike an ASIC, an FPGA's function is defined post-manufacture via SRAM or flash configuration, allowing rapid design iteration and field upgrades.
Key features of the EP1S30F780C6N include 3,819 Configurable Logic Blocks (CLBs), 252 (18x18) embedded multiplier blocks, 12 phase-locked loops, six clock networks, JTAG IEEE 1149.1 boundary-scan support, and a dedicated configuration interface supporting serial, parallel, and passive/active modes. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with per-pin dynamic impedance control. Stratix devices also include TriMatrix memory architecture (M512, M4K, M-RAM blocks) that delivers high-bandwidth on-chip storage for buffering and packet processing.
Architecturally, the Stratix family pioneered the embedded DSP block concept that subsequent Altera/Intel families (Stratix II/III/IV/V, Cyclone, Arria, Agilex) have refined. The 130 nm process places the EP1S30 in the legacy tier, but it remains supported in Intel Quartus design tools for several development flows, which is critical for industrial and defense programs with long product life cycles.
Typical applications include telecom line-card aggregation, industrial motor control, military/aerospace signal processing, test and measurement instrumentation backplanes, and ASIC prototyping. The combination of high logic density, large memory, and 597 I/O makes the EP1S30 well-suited for parallel data-path designs such as multi-channel DSP, video processing, and protocol bridging.
When designing with this device, allocate adequate power decoupling and thermal dissipation for the 29 mm x 29 mm FC-FBGA; the 780 balls at 1 mm pitch require standard BGA assembly processes. Configuration storage should use a compatible PROM (EPC16 or EPC8) or system-controller-based in-system programming. Signal integrity on the 597 user I/Os requires controlled-impedance PCB stack-up; SSTL/HSTL interfaces in particular need matched-length routing and proper VREF termination.
This page synthesizes distributor pricing, FPGA fabric specifications, Stratix-family drop-in alternatives, and practical design notes not consolidated in any single manufacturer document, helping engineers compare options and accelerate design-in.
直接替换替代料： EP1S30F780C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S30F780C6N （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, Speed Grade, DSP Blocks.
快速对比工具——选择替代料号进行并排对比：
EP1S30F780C6
✅ 直接替换✓ 有现货
$1125 / 个
查看数据手册 →EP1S30F780C6GA
✅ 直接替换✓ 有现货
$1100 / 个
查看数据手册 →EP1S30F780C7N
✅ 直接替换✓ 有现货
$620 / 个
查看数据手册 →EP1S30F780C5N
✅ 直接替换📋 参考替代料（不在目录中）
EP1S30F780I6N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$225 / 个
查看数据手册 →EP1S25F780C6N
✅ 直接替换✓ 有现货
$780 / 个
查看数据手册 →EP1S30F780C6N 最大额定值与电气特性
| Family | Stratix |
| Logic Elements | 32,470 |
| Configurable Logic Blocks (CLBs) | 3,819 |
| Total RAM Bits | 3,317,184 bits |
| Embedded Multipliers (18x18) | 252 |
| User I/O Pins | 597 |
| Logic Array Blocks (LABs) | 3,247 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | C6 |
| 工作温度 | 0 C to 85 C (Commercial) |
| 封装 | 780-ball FC-FBGA (29 mm x 29 mm, 1 mm pitch) |
| 安装类型 | Surface Mount (BGA) |
| Lead-Free | Yes |
| RoHS 状态 | Compliant |
EP1S30F780C6N 780-ball fc-fbga (29 mm x 29 mm, 1 mm pitch) 引脚配置指南
EP1S30F780C6N（780-ball fc-fbga (29 mm x 29 mm, 1 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S30F780C6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S30F780C6N 适用于 6 应用s: Telecom Line-Card Aggregation, Industrial Motor Control, ASIC Prototyping, Test and Measurement Instrumentation, Video Processing and Imaging, Military and Aerospace Signal Processing.
Telecom Line-Card Aggregation
The EP1S30F780C6N's 32,470 logic elements, 3,317,184 bits of TriMatrix memory, and 597 user I/O pins make it a strong fit for telecom line-card aggregation, where multiple low-speed serial links (T1/E1, OC-3) must be multiplexed into a higher-speed backplane fabric. Its 252 embedded 18x18 multipliers handle channelized packet processing and traffic shaping, while the M-RAM blocks absorb bursty packet buffers without external SRAM. Engineers typically instantiate POS-PHY Level-3 or SPI-4.2 interfaces using the dedicated high-speed I/O banks, achieving 800 Mbps per LVDS pair. The C6 speed grade provides enough timing margin for 125 MHz system buses and 77 MHz DDR memory interfaces common in legacy ATM/SONET designs.
推荐
Industrial Motor Control
The EP1S30F780C6N is widely deployed in industrial motor-control inverters where multi-axis field-oriented control (FOC), space-vector PWM, and encoder feedback must execute in a single device. Its 252 DSP blocks deliver the multiply-accumulate throughput needed for Park/Clarke transforms and current-loop compensation running at 10-20 kHz PWM rates. The 12 PLLs and six clock networks allow deterministic phase-aligned sampling across multiple IGBT or SiC gate-driver signals. The 597 I/Os accept quadrature encoders, Hall sensors, resolver feedback, and CAN/RS-485 comms simultaneously, eliminating external glue logic. Industrial-grade temperature variants like EP1S30F780I6N extend operation to -40 C to 100 C for factory-floor deployment.
推荐
ASIC Prototyping
With 32,470 logic elements and 3.3 Mbits of distributed + block RAM, the EP1S30F780C6N offers enough capacity to validate mid-complexity ASIC designs before tape-out. Engineers partition the ASIC RTL into Stratix logic and use the dedicated M512/M4K RAM blocks to emulate SRAM/ROM macros, then validate system-level functionality with real-world I/O at FPGA pin-out speed. The 780-ball FBGA exposes 597 user I/Os for ASIC pin reuse, and LVDS/LVCMOS/SSTL I/O standards cover most ASIC IO requirements. Quartus II synthesis with DesignPartitions lets teams swap prototype blocks incrementally, accelerating hardware/software co-design.
推荐
Test and Measurement Instrumentation
Test-and-measurement instruments such as logic analyzers, protocol analyzers, and high-speed digitizers leverage the EP1S30F780C6N's parallel DSP fabric for real-time signal processing. The 252 18x18 multipliers accelerate FFT-based spectrum analysis, FIR filtering for signal conditioning, and correlation engines. Each M-RAM block holds 512 Kbits of capture buffer, allowing multi-million-sample acquisition windows without off-chip memory. The 12 PLLs derive multiple precise sampling clocks from a single reference, while the 597 I/Os interface to ADCs/DACs and front-panel connectors. Engineers value the C6 speed grade for deterministic timing closure on 200 MHz LVDS sampling paths typical of 1-2 GSPS digitizers.
推荐
Video Processing and Imaging
The EP1S30F780C6N's logic density, memory bandwidth, and LVDS I/O count make it suitable for real-time video processing and broadcast imaging equipment. Engineers implement multi-channel SDI/HD-SDI receive and transmit paths, color-space converters, scalers, and frame-rate converters using the dedicated LVDS-capable banks at up to 840 Mbps per pair. The M-RAM blocks act as line buffers and frame stores, eliminating external SDRAM for moderate-resolution pipelines. The 252 embedded multipliers handle chroma resampling and DCT-like transforms needed for compression and de-interlacing. The 597 user I/Os accommodate multiple parallel camera interfaces (LVDS-based Camera Link) simultaneously, supporting machine-vision inspection systems.
推荐
Military and Aerospace Signal Processing
For defense and aerospace programs with decades-long product life cycles, the EP1S30F780C6N remains a viable platform because Altera/Intel continues to support legacy Stratix designs with security updates and Quartus tool flows. The device supports secure configuration bitstream loading via the dedicated AES-encrypted passive serial interface and offers JTAG 1149.1 boundary scan for board-level testing. The 252 DSP blocks handle radar pulse compression, beamforming weight calculation, and electronic-counter-countermeasure (ECCM) algorithms. The 597 I/Os interface to ADC/DAC mezzanines (VITA 57 FMC) and MIL-STD-1553 databuses. The 780-ball FC-FBGA package meets shock and vibration requirements for airborne systems when properly underfilled.
推荐
推荐产品汇总
工程参考数据： EP1S30F780C6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S30F780C6 | EP1S30F780C6GA | EP1S30F780C7N | EP1S30F780C5N | EP1S30F780I6N | EP1S25F780C6N |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 | 25,660 |
| Speed Grade | C6 | C6 | C6 | C7 (faster) | C5 (slower) | I6 (industrial) | C6 |
| Total RAM Bits | 3,317,184 | 3,317,184 | 3,317,184 | 3,317,184 | 3,317,184 | 3,317,184 | 1,922,048 |
| Embedded Multipliers (18x18) | 252 | 252 | 252 | 252 | 252 | 252 | 200 |
| User I/O Pins | 597 | 597 | 597 | 597 | 597 | 597 | 597 |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C (Industrial) | 0 C to 85 C |
关键差异点
- 32,470 logic elements with 597 user I/Os in a 780-ball FBGA （对比 EP1S25F780C6N)
- C6 speed grade balanced for power and performance （对比 EP1S30F780C7N)
- Commercial 0 C to 85 C temperature range （对比 EP1S30F780I6N)
设计说明
Estimated: The 780-ball FC-FBGA package and 1.5 V core at full utilization can dissipate 8-12 W. Without forced airflow or a heat spreader, junction temperature can rise 30-40 C above ambient. For reliable operation in commercial temperature range, ensure at least 200 LFM airflow or attach a thermally-conductive PCB pad array connected to an internal copper plane. Industrial variants (EP1S30F780I6N) require careful thermal modeling for closed enclosures.
The 1.0 mm ball pitch on the 780-ball FC-FBGA requires 0.4-0.5 mm PCB land pads with non-solder-mask-defined (NSMD) finish for reliable BGA assembly. Use a 1 oz copper inner power plane and 12+ layer stack-up to fan out the 597 user I/Os without violating signal-integrity rules. Matched-length routing with +/- 25 mil tolerance is essential for LVDS pairs used in external memory interfaces.
Estimated: Decouple each VCCINT/VCCIO pair with 0.1 uF + 10 uF capacitors placed within 100 mil of the corresponding BGA balls. Provide at least 4 low-ESR bulk capacitors on the 1.5 V core rail to handle switching transients. Reference the Stratix Device Family Data Sheet section on decoupling for the full recommendation table.
Do not confuse the EP1S30F780C6N (780-ball FBGA) with the EP1S30B956C6 (956-ball BGA) - they share the same die but have different pin counts and are NOT drop-in compatible. Always verify the user's design against the specific 780-ball FBGA pinout table in the Stratix handbook, especially when migrating between F780 and F1020 package variants which differ in I/O count.
合规信息
Trailing 'N' in the part number denotes lead-free termination per Altera/Intel convention. RoHS compliance per Altera/Intel product declaration. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC.
