EP1S30F780C6 - Stratix FPGA, 32470 LEs, 597 I/O, FCBGA-780 | Altera
料号： EP1S30F780C6 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1337.09 | $1,337.09 |
| 10 | $1295 | $12,950.00 |
| 100 | $1230 | $123,000.00 |
| 500 | $1175 | $587,500.00 |
| 1,000 | $1125 | $1,125,000.00 |
EP1S30F780C6 概述
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) built on an SRAM process that lets engineers implement arbitrary digital logic, block RAM, DSP arithmetic, and high-speed serial transceivers on a single die. Stratix belongs to the hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. Within Altera's (now Intel FPGA) portfolio, the EP1S30F780C6 sits in the first-generation Stratix family, positioned between the smaller Stratix EP1S10/EP1S20 and the higher-density EP1S40/EP1S60/EP1S80 devices, and predates the Stratix II/GX/Cyclone lineages.
Key features of the EP1S30F780C6 include up to 28 DSP blocks with up to 224 (9-bit × 9-bit) embedded multipliers for DSP pipelines, TriMatrix memory architecture with up to ~3.4 Mbits of RAM, support for multiple I/O standards including LVDS, and a configuration scheme based on SRAM cells loaded at power-up via passive serial, fast passive parallel, or JTAG. The 0.13 μm process and 1.5 V core deliver a balance of performance and power for early-2000s high-end designs.
The architecture uses logic array blocks (LABs) composed of logic elements (LEs), each containing a 4-input look-up table (LUT), a programmable register, and a carry chain. Embedded memory blocks (M512, M4K, M-RAM) provide distributed and block RAM at multiple aspect ratios. PLLs provide clock conditioning and frequency synthesis for the global and regional clock networks, and dedicated high-speed I/O banks support external memory interfaces such as DDR SDRAM and QDR SRAM.
Typical applications of the EP1S30F780C6 include high-throughput DSP (software-defined radio baseband, video processing), telecom line cards implementing protocol bridging and packet processing, ASIC prototyping, and industrial imaging pipelines. The 597 I/Os make it useful for designs that aggregate many parallel buses or external memory channels.
When designing with this part, validate power sequencing of the 1.5 V core and the I/O bank supplies, and use Altera Quartus II (legacy version chain) for synthesis, place-and-route, and timing closure. Engineers should also note that this is a mature/EOL device line and plan second-source or migration paths to Cyclone/Stratix II families where possible.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list (Stratix EP1S25 / EP1S20 / EP1S10 variants), and practical FPGA design notes that are not consolidated on the manufacturer datasheet alone, giving engineers a faster starting point for sourcing and PCB redesign decisions.
直接替换替代料： EP1S30F780C6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S30F780C6 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, Speed Grade, Series.
快速对比工具——选择替代料号进行并排对比：
EP1S30F780C7
✅ 直接替换✓ 有现货
$135 / 个
查看数据手册 →EP1S30F780I6
✅ 直接替换✓ 有现货
$1320 / 个
查看数据手册 →EP1S30F780C5
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP1S25F780C6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$791.02 / 个
查看数据手册 →EP1S20F780C6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP1S30F780C6 最大额定值与电气特性
| Series | Stratix (1st Generation) |
| Family | Stratix |
| Logic Elements (LEs) | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Maximum User I/Os | 597 |
| Process Technology | 0.13 μm all-layer copper SRAM |
| Core Voltage | 1.5 V |
| DSP Blocks | Up to 28 |
| Embedded Multipliers | Up to 224 (9-bit × 9-bit) |
| On-chip Memory | TriMatrix (M512, M4K, M-RAM blocks) |
| 封装 | 780-ball FCBGA (FineLine BGA), 29 mm × 29 mm, 1 mm pitch |
| 安装类型 | Surface Mount |
| 工作温度 | 0 °C to 85 °C (commercial) |
| Configuration | SRAM-based (passive serial, fast passive parallel, JTAG) |
| Speed Grade | C6 (commercial, speed grade 6) |
EP1S30F780C6 780-ball fcbga (fineline bga), 29 mm × 29 mm, 1 mm pitch 引脚配置指南
EP1S30F780C6（780-ball fcbga (fineline bga), 29 mm × 29 mm, 1 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S30F780C6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S30F780C6 适用于 6 应用s: Software Defined Radio (SDR) Baseband, Telecom Line Card Protocol Bridging, ASIC Prototyping, Industrial Imaging and Video Processing, Test and Measurement Instrumentation, Military / Aerospace Signal Processing (legacy).
Software Defined Radio (SDR) Baseband
The EP1S30F780C6 is well suited for SDR baseband signal processing because its 28 DSP blocks and 224 embedded 9-bit × 9-bit multipliers sustain the multiply-accumulate rates needed for FFT, FIR filtering, and channelization. The 32,470 logic elements fit complex baseband datapaths including symbol mapping, scrambling, and turbo decoding on a single die. Designers pair the FPGA with high-speed ADCs/DACs and external ZBT or DDR memory to stream I/Q samples in and out. The 597 user I/Os accept multiple parallel data buses plus LVDS links to RF front ends, which is exactly the kind of mixed signal aggregation the original Stratix family was designed for.
推荐
Telecom Line Card Protocol Bridging
In telecom line cards the EP1S30F780C6 acts as a protocol bridge between framer/MAC ASICs, network processors, and backplane SERDES. The TriMatrix memory provides the packet buffers and lookup tables required for cell/packet reassembly, while the DSP blocks accelerate header parsing and checksum offload. Its 597 I/Os accommodate UTOPIA, POS-PHY, and SPI-4.2 buses without external muxing. The 1.5 V 0.13 μm process delivers low enough power to fit into dense line-card thermal budgets of the era.
推荐
ASIC Prototyping
Engineers used the EP1S30F780C6 as an ASIC prototype vehicle because the 32,470 LEs and 597 I/Os roughly mapped to mid-complexity ASIC netlists. The FPGA let design teams validate architecture, software drivers, and system timing months before mask tape-out, dramatically reducing ASIC re-spin risk. Fast Quartus II turnaround let multiple RTL iterations run in a single day. The 780-ball FCBGA exposes enough I/O to map DDR, PCI, and proprietary bus interfaces concurrently, which is critical for full-chip bring-up.
推荐
Industrial Imaging and Video Processing
The EP1S30F780C6 supports multi-channel video pipelines including image scaling, color-space conversion, and real-time edge detection at full frame rate. The 597 user I/Os accept Camera Link, LVDS, and parallel CMOS sensor interfaces, and the on-chip TriMatrix RAM holds line buffers for temporal filtering. Designers target ~150 MHz pixel clocks on a C6 speed grade and use the DSP blocks for convolution and 2D filter kernels. The 780-ball FCBGA package supplies the thermal headroom needed for sustained 1A core draw under continuous imaging workloads.
推荐
Test and Measurement Instrumentation
In ATE and bench instrumentation the EP1S30F780C6 implements pattern generation, response capture, and signal conditioning in a single programmable fabric. The 597 I/Os accept multi-lane LVDS from DUTs, while the DSP blocks compute FFTs, correlations, and statistical reductions in real time. The commercial temperature grade is sufficient for lab environments, and the 1 mm pitch FCBGA accommodates controlled-impedance PCB stack-ups used in high-speed test fixtures. Engineers also use it for protocol-aware logic analyzers where density matters more than raw clock rate.
推荐
Military / Aerospace Signal Processing (legacy)
Although the EP1S30F780C6 is commercial-grade (0 °C to 85 °C), it served in non-flight, lab-grade signal processing for defense programs where the density of original Stratix was needed for radar preprocessing and EW simulations. The industrial-grade cousin EP1S30F780I6 extends the temperature envelope to -40 °C to 100 °C for harsher environments. The high DSP block count accelerates pulse-Doppler processing, while 597 I/Os ingest parallel ADC banks from antenna arrays. Designers should note that Altera/Intel recommends newer radiation-tolerant parts for actual flight hardware.
推荐
推荐产品汇总
工程参考数据： EP1S30F780C6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S30F780C7 | EP1S30F780I6 | EP1S30F780C5 | EP1S25F780C6 | EP1S20F780C6 |
|---|---|---|---|---|---|---|
| Package | 780-ball FCBGA (29x29 mm, 1 mm pitch) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | ~25,660 | ~18,460 |
| Speed Grade | C6 | C7 (faster) | I6 (industrial temp) | C5 (slower) | C6 | C6 |
| Temperature Grade | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) | Industrial (-40°C to 100°C) | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) |
| User I/Os | 597 | 597 | 597 | 597 | ~597 (same package) | ~597 (same package) |
| DSP Blocks | Up to 28 (224 9x9 multipliers) | Up to 28 | Up to 28 | Up to 28 | Up to 22 | Up to 17 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
关键差异点
- Higher density than EP1S25F780C6 in the same footprint （对比 EP1S25F780C6)
- Higher logic capacity than EP1S20F780C6 in the same package （对比 EP1S20F780C6)
- Commercial temperature grade; industrial variant available in same package （对比 EP1S30F780I6)
设计说明
Estimated: Stratix devices in the EP1S30 family typically draw 1–2 A on the 1.5 V VCCINT rail at full logic utilization, plus several hundred mA on the VCCIO rails for the I/O banks. Decouple each VCCINT pin with a 0.1 µF X7R plus a 10 µF bulk capacitor placed as close as physically possible on the inner PCB layers. Use a dedicated linear or DC-DC regulator with output accuracy ≤3% to satisfy Altera's VCCINT tolerance; an LDO such as the TI TPS75533 (with proper 1.5 V tap) is recommended for low-noise designs.
Estimated: at full utilization the EP1S30F780C6 dissipates approximately 3–5 W, and the 780-ball FCBGA exposes only a small fraction for heatsinking. Theta_JA on a standard 4-layer JEDEC test board is approximately 12–15 °C/W, so junction rise over ambient is in the 40–75 °C range. Use the largest practical ground pad under the package and 2 oz copper pours on outer layers to spread heat. If your application runs in a sealed enclosure, derate ambient by at least 10 °C.
The 780-ball FCBGA uses 1 mm pitch, which requires laser-drilled or mechanically drilled microvias on a 1–2–1 or 1–2–2–1 stack-up. Per Altera's package guidelines, escape each ball to an inner layer via-in-pad or dog-bone fanout, and keep the BGA area free of signal traces for at least 2 mm to allow rework. Match differential pair lengths to within 150 mil for LVDS links, and route all high-speed clocks on inner stripline layers adjacent to a continuous reference plane.
Stratix SRAM FPGAs lose configuration on power-down; never assume the device boots into a known state without a configuration PROM or system controller. Use an Altera EPC16 or EPC8 configuration device, and tie nCONFIG, nSTATUS, and CONF_DONE per the Stratix handbook to allow JTAG recovery. Avoid driving I/O banks before VCCIO is stable — the I/Os are not hot-swappable and can back-power the core through ESD clamp diodes.
合规信息
RoHS/REACH/lead-free status for the original EP1S30F780C6 die is not stated in the verified web data; users must confirm via the manufacturer's official declaration. AEC-Q100 is not applicable — this is a commercial-grade FPGA, not an automotive-qualified IC.
