EP1SGX25DF1020C6ES - Stratix GX FPGA, 25K LE, FBGA-1020 | Altera
MPN: EP1SGX25DF1020C6ES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $350 | $35,000.00 |
| 500 | $310 | $155,000.00 |
| 1,000 | $285 | $285,000.00 |
Drop-in alternatives for EP1SGX25DF1020C6ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DF1020C6ES Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25660 cells |
| Configurable Logic Blocks (CLBs) | 2566 |
| Maximum User I/Os | 607 |
| Number of LABs/CLBs | 2566 |
| Operating Temperature | 0 C to 85 C |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Package | FBGA-1020, 33 mm × 33 mm, 1.00 mm pitch |
| Mounting Type | Surface Mount |
| Lead-Free | Yes |
| Configuration Interface | JTAG / Passive Serial / Passive Parallel |
| Embedded Transceivers | Yes (multi-gigabit) |
| DSP Blocks | Yes |
EP1SGX25DF1020C6ES fbga-1020, 33 mm × 33 mm, 1.00 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C6ES (fbga-1020, 33 mm × 33 mm, 1.00 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C6ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C6ES is suitable for 6 applications: Telecommunications Backhaul, High-Speed Serial Interface Bridging, ASIC Prototyping and Emulation, Broadcast Video Processing, Test and Measurement Equipment, High-Performance DSP / Radar Pipeline.
Telecommunications Backhaul
The EP1SGX25DF1020C6ES fits telecom backhaul line cards because its 25,660 logic cells and embedded multi-gigabit transceivers deliver the parallel-processing throughput required for packet classification, traffic shaping, and SERDES bridging. Its 1.5 V core and 607 user I/Os expose enough SERDES channels for 4–8 lanes of Gigabit Ethernet or CPRI links to baseband units. Placed on a backhaul blade alongside external PHYs, it can sustain line-rate forwarding while the DSP blocks accelerate hashing and CRC operations. Compared with newer 28 nm Stratix V parts, the 130 nm Stratix GX consumes more power per LE, so engineers must budget thermal headroom carefully.
Recommended
High-Speed Serial Interface Bridging
The EP1SGX25DF1020C6ES targets PCI Express, Serial RapidIO, and XAUI bridge applications where the embedded multi-gigabit transceivers serialize and deserialize high-speed lanes without external PHYs. Its 25,660 logic cells provide sufficient fabric to implement protocol state machines, link-training logic, and application-layer packet processing in a single device. Deployed between a host ASIC and a backplane, it acts as a protocol-translating bridge while the DSP blocks handle lane deskew. This single-chip integration lowers BOM cost versus a two-chip (SERDES + bridge FPGA) solution common in the Stratix GX generation.
Recommended
ASIC Prototyping and Emulation
The EP1SGX25DF1020C6ES is well-matched to ASIC prototyping and pre-silicon validation because its 25,660 logic cells deliver enough capacity to map mid-complexity ASIC RTL while the abundant user I/Os (up to 607) and embedded transceivers expose the full ASIC I/O boundary at speed. Its Quartus II toolchain supports gate-level and RTL synthesis, enabling full-chip bring-up before committing to mask sets. Used in prototype platforms, it shortens verification cycles by allowing software teams to develop against the real ASIC I/O protocol weeks before silicon returns. Multiple EP1SGX25 devices can be tiled on a multi-FPGAb prototyping board for ASICs that exceed a single FPGA's logic capacity.
Recommended
Broadcast Video Processing
The EP1SGX25DF1020C6ES suits broadcast video processing cards (HD-SDI routers, format converters, multiviewers) because its embedded transceivers handle SDI at 270 Mb–1.485 Gb rates and its 25,660 logic cells implement pixel pipelines for de-interlacing, scaling, and color-space conversion. The 607 user I/Os support video DDR2/DDR3 memory interfaces and parallel pixel buses at rates typical of 1080p60. Placed on a video-processing PCIe card, it sustains multiple channels of HD-SDI simultaneously while leaving logic headroom for on-screen display overlay. The FBGA-1020 package's 1.0 mm pitch eases PCB escape for the wide memory bus.
Recommended
Test and Measurement Equipment
The EP1SGX25DF1020C6ES fits high-end oscilloscope, logic analyzer, and protocol-analyzer platforms because the 25,660 logic cells provide parallel channels of state-machine logic for triggering, decoding, and post-processing while the embedded transceivers capture high-speed serial buses. The 1.5 V core and 607 I/Os support deep acquisition memory at the bus speed typical of modern logic-analyzer probes. Deployed in a protocol analyzer, it triggers on multi-lane PCIe or USB 3.0 traffic in real time. The Stratix GX DSP blocks accelerate FFT and eye-diagram computation for serial-bus analysis, replacing external DSP co-processors.
Recommended
High-Performance DSP / Radar Pipeline
The EP1SGX25DF1020C6ES targets radar signal-processing pipelines because its DSP blocks deliver hardware-accelerated multiply-accumulate throughput that is essential for FIR filters, FFTs, and pulse-Doppler processing at radar sample rates. The 25,660 logic cells implement the state machine and control plane, while the dedicated DSP blocks process the data plane. Used in a phased-array radar front-end card, it can run 1024-point FFTs in real time while the embedded transceivers stream ADC data into the device. This single-FPGA DSP density replaces older DSP co-processor + FPGA two-chip solutions common in legacy radar designs.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C6ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C6 | EP1SGX25DF1020C6BN | EP1SGX25DF1020C6B | EP1SGX25DF1020C5 | EP1SGX25DF1020C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-1020, 33×33 mm, 1.0 mm pitch | FBGA-1020, 33×33 mm, 1.0 mm pitch - same | FBGA-1020, 33×33 mm, 1.0 mm pitch - same | FBGA-1020, 33×33 mm, 1.0 mm pitch - same | FBGA-1020, 33×33 mm, 1.0 mm pitch - same | FBGA-1020, 33×33 mm, 1.0 mm pitch - same |
| Logic Cells | 25660 | 25660 | 25660 | 25660 | 25660 | 25660 |
| Speed Grade | C6 (commercial, tier 6) | C6 | C6 | C6 | C5 (slower than C6) | C5 (slower than C6) |
| Temperature Grade | Commercial 0 to 85 C | Commercial 0 to 85 C | Commercial 0 to 85 C | Commercial 0 to 85 C | Commercial 0 to 85 C | Commercial 0 to 85 C |
| Ordering Suffix | ES (engineering sample variant) | no suffix (production) | BN (lead-free PbQ) | B (ball-finish variant) | C5 no N suffix | C5N (lead-free, slower speed) |
| Lead-Free | Yes | Yes | Yes | [DATA_NEEDED: confirm] | Yes | Yes |
| Approx. Unit Price (qty 1) | $425 | ~$410 | ~$420 | ~$415 | ~$395 (slower grade discounts) | ~$400 |
Key Differentiators
- Same-density 25,660 logic cell option without ES suffix (vs EP1SGX25DF1020C6)
- Same-package lower speed-grade option for cost savings (vs EP1SGX25DF1020C5)
- Larger same-family density option for future-proofing (vs EP1SGX40F1020C6)
Design Notes
The EP1SGX25DF1020C6ES FBGA-1020 33×33 mm package with 1.0 mm ball pitch demands a high-layer-count PCB (typically 8 to 12 layers) for BGA escape. Use a dog-bone fanout under inner-row balls and via-in-pad for the center ball grid to maintain signal integrity on high-speed SERDES lanes. Thermal vias under the package center thermal pad are essential for heat extraction into inner copper planes. Estimated: with a 4-layer PCB the maximum SERDES data rate falls roughly 30–40% versus an 8-layer stack-up; use 8+ layers for designs approaching 3.125 Gb/s per lane.
Stratix GX devices require multiple supply rails: 1.5 V core (VCC), 1.5 V transceiver analog (VCCT), 1.2–3.3 V I/O bank supplies (VCCIO), and PLL analog supplies (VCC_PLL). Per the Stratix GX Device Family Data Sheet PowerPlay section, decouple every power pin with a 0.1 uF high-frequency ceramic placed within 100 mil of the pin, plus bulk decoupling on each rail. Power estimation should use the Quartus II PowerPlay tool before PCB layout to size regulators and copper area. Estimated: a fully utilized EP1SGX25 at 25,660 LEs and full SERDES activity can dissipate 8–15 W, requiring active airflow.
Common Stratix GX design pitfalls include: (1) leaving configuration pins (nCONFIG, MSEL[3:0], DATA0) floating instead of tying to known states for the desired configuration mode; (2) missing JTAG TCK pull-down or TMS pull-up which prevents boundary-scan chain initialization; (3) using a JTAG header without the recommended 10 kohm pull on TCK, causing configuration failures in noisy environments; (4) ignoring the I/O bank VCCIO constraints, which damages I/O buffers if VCCIO differs from the driven/received logic level; (6) failing to power-cycle POR after a failed configuration download — Altera recommends a 100 ms delay between CONFIG_DONE deassertion and reconfiguration attempts.
Compliance Information
Lead-free per part ordering code description. RoHS/REACH compliance should be confirmed against specific date code CoC because some early Stratix GX production runs pre-dated full RoHS transition. AEC-Q100 not applicable — this is a commercial-grade FPGA, not an automotive-qualified IC.
