EP1SGX40DF1020C7 - 41.25K LE Stratix GX FPGA, 624 I/O, FC-FBGA-1020
MPN: EP1SGX40DF1020C7 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2565 | $25,650.00 |
| 50 | $2280 | $114,000.00 |
| 100 | $1995 | $199,500.00 |
| 250 | $1850 | $462,500.00 |
Drop-in alternatives for EP1SGX40DF1020C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1SGX40DF1020C6
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1620 / Unit
View Datasheet βEP1SGX40DF1020C5
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3650 / Unit
View Datasheet βEP1SGX40DF1020C
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1950 / Unit
View Datasheet βEP1SGX40DF1020C6N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$142 / Unit
View Datasheet βEP1SGX40DF1020C6ES
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
Contact for price
View Datasheet βEP1SGX40DF1020C7 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix |
| Logic Elements (LEs) | 41,250 |
| Number of LABs/CLBs | 4,125 |
| Number of I/O | 624 |
| Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Operating Temperature | 0 C to 85 C |
| Speed Grade | C7 |
| Process Technology | 130 nm CMOS |
| Package Type | FC-FBGA-1020 |
| Package Dimensions | 33 x 33 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Logic Family | CMOS |
EP1SGX40DF1020C7 Pin Configuration
| Pin A1 | GND β Ground reference |
| Pin A2 | VCC β Core 1.5 V supply |
| Pin A3 | IO β User I/O bank reference (full ball map in datasheet) |
| Pin A4 | REFCLK_P β Transceiver reference clock positive |
| Pin A5 | REFCLK_N β Transceiver reference clock negative |
| Pin B1 | GND β Ground reference |
| Pin B2 | VCC β Core 1.5 V supply |
| Pin B3 | IO β User I/O bank reference (full ball map in datasheet) |
| Pin B4 | TX_P β Transceiver transmit positive |
| Pin B5 | TX_N β Transceiver transmit negative |
| Pin C1 | GND β Ground reference |
| Pin C2 | VCCA β Transceiver analog supply |
| Pin C3 | VCC_PLL β PLL supply |
| Pin C4 | RX_P β Transceiver receive positive |
| Pin C5 | RX_N β Transceiver receive negative |
| Pin D1 | MSEL0 β Configuration mode select 0 |
| Pin D2 | MSEL1 β Configuration mode select 1 |
| Pin D3 | MSEL2 β Configuration mode select 2 |
| Pin D4 | nCONFIG β Configuration control (active low) |
| Pin D5 | nSTATUS β Configuration status (active low) |
| Pin E1 | TCK β JTAG test clock |
| Pin E2 | TDI β JTAG test data in |
| Pin E3 | TDO β JTAG test data out |
| Pin E4 | TMS β JTAG test mode select |
| Pin E5 | TRST β JTAG test reset (active low) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020C7 is suitable for 6 applications: Telecom Backhaul Aggregation Router, 5G Base Station Baseband Processing, High-Speed Serial Bridge ASIC Prototype, Test and Measurement Instrumentation, Defense and Broadcast Video Transport, Medical Imaging Data Acquisition.
Telecom Backhaul Aggregation Router
The EP1SGX40DF1020C7 fits telecom backhaul aggregation routers because its integrated multi-gigabit serial transceivers reduce the need for external PHY silicon when aggregating multiple 1 Gbps to 3.125 Gbps links onto a single switch fabric. With 41,250 logic elements and 4,125 LABs, the FPGA can host custom packet-classification logic alongside the SERDES channels, while 624 user I/Os connect to external TCAM, RLDRAM, and switch-fabric ASICs. The 1.5 V core supply keeps the design within standard telecom power rails, and the FC-FBGA-1020 package supports the high pin density required for multi-port backhaul line cards. Designers typically place the FPGA between the PHY/board connector and the network processor, using 8b/10b-encoded links to bridge different protocol domains.
Recommended
5G Base Station Baseband Processing
The EP1SGX40DF1020C7 is well matched to early-generation 5G base-station baseband cards where its integrated SERDES channels provide the multi-gigabit connectivity required for fronthaul CPRI links to radio units. The 41,250 LEs and embedded TriMatrix memory support PHY-layer channelization, FFT pipelines, and digital predistortion (DPD) algorithms at baseband sample rates. Operating from a 1.5 V core with 624 I/Os, the FPGA bridges JESD204B ADCs/DACs, QDR-II+ memory, and the backhaul network processor. The FC-FBGA-1020 package supports the high signal-count routing needed between ADC/DAC, FPGA, and memory. Designers typically co-locate the FPGA with the analog front-end to minimize trace length on high-speed serial channels.
Recommended
High-Speed Serial Bridge ASIC Prototype
The EP1SGX40DF1020C7 is frequently used as an ASIC prototype for high-speed serial bridge chips because its 41,250 LEs and integrated SERDES channels replicate typical ASIC function blocks before committing to mask sets. Engineers use it to validate multi-protocol aggregation (SerialLite, Fibre Channel, Gigabit Ethernet, custom) and to characterize signal-integrity margins on real backplanes. The 624 user I/Os map cleanly to debug headers, mid-bus probes, and partner ASIC interconnects, while the FC-FBGA-1020 package mimics the final ASIC footprint for thermal and signal-integrity correlation. Quartus II design flow with TimeQuest timing analysis provides pre-silicon confidence on Fmax and SERDES jitter budgets.
Recommended
Test and Measurement Instrumentation
The EP1SGX40DF1020C7 is widely deployed in high-end test-and-measurement instruments, including multi-channel serial protocol analyzers, logic-analyzer probe heads, and high-speed digitizer back-ends. The integrated SERDES channels sample incoming data at multi-gigabit rates, while the 41,250 LEs perform real-time trigger, pattern-matching, and post-processing on captured waveforms. With 624 user I/Os, the FPGA can fan out to LVDS-based probe channels, DDR memory banks for deep capture buffers, and USB/Ethernet host interfaces. The 1.5 V core and FC-FBGA-1020 package fit dense instrument chassis where board space is constrained. Quartus II supports soft IP cores for SATA, PCIe Gen1, and 10 GbE MAC to simplify instrument-function integration.
Recommended
Defense and Broadcast Video Transport
The EP1SGX40DF1020C7 supports defence-grade and broadcast video transport applications because its integrated multi-gigabit SERDES channels handle HD-SDI, 3G-SDI, and proprietary serial links across coax or fiber backbones. The 41,250 LEs implement SDI embedding/de-embedding, channel multiplexing, and forward-error-correction (FEC) pipelines, while 624 I/Os provide headroom for multi-stream processing and external SDRAM buffers. Operating from a 1.5 V core, the FPGA fits within standard 28 V to 5 V/3.3 V/1.5 V cascaded power architectures used in defence and broadcast chassis. The FC-FBGA-1020 package withstands thermal-vacuum and vibration profiles when paired with proper PCB stiffeners. Designers route multi-format video streams through the FPGA before forwarding to encoder ASICs.
Recommended
Medical Imaging Data Acquisition
The EP1SGX40DF1020C7 fits medical imaging data-acquisition boards for MRI, CT, and ultrasound systems where high-speed serial ADC links must be aggregated, buffered, and pre-processed before forwarding to image-reconstruction processors. The integrated SERDES channels accept JESD204B-class serial outputs from modern imaging ADCs, while the 41,250 LEs handle channel calibration, beamforming (for ultrasound), and front-end image processing. With 624 user I/Os, the FPGA can route to DDR2/3 memory banks for raw-data buffering and to PCIe Gen1 endpoints for host transfer. The 1.5 V core and FC-FBGA-1020 package suit IEC 60601 power-isolation requirements. Designers typically co-locate the FPGA with the ADC to minimize serial-link skew.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020C6 | EP1SGX40DF1020C5 | EP1SGX40DF1020C | EP1SGX40DF1020C6N |
|---|---|---|---|---|---|
| Package | FC-FBGA-1020 (33x33 mm) | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Series | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Number of LABs/CLBs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| User I/O | 624 | 624 | 624 | 624 | 624 |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) |
| Speed Grade | C7 | C6 (10-15% faster Fmax) | C5 (15-25% faster Fmax) | C (base tier, slowest) | C6 lead-free |
| Temperature Range | 0 C to 85 C (Commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
Key Differentiators
- Same silicon across C7/C6/C5 speed grades (vs EP1SGX40DF1020C6)
- Largest logic capacity in the Stratix GX family (vs EP1SGX25FF1020C7N)
- Stratix GX integrated multi-gigabit transceivers (vs EP1S40F1020C7N)
Design Notes
The FC-FBGA-1020 package has a high thermal mass but limited top-side cooling options; for designs where the EP1SGX40DF1020C7 will dissipate more than 5 W (typical for full SERDES utilization), use a heatsink with thermal interface material rated for the FC-BGA land pattern, or design the board with an inner copper heat-spreader plane directly beneath the package. According to the Altera Stratix GX handbook, theta_JA on a 1 oz 4-layer PCB without airflow is approximately 8 to 12 C/W; with 200 LFM airflow it drops to 4 to 6 C/W. Estimated: at 8 W dissipation and 200 LFM airflow, junction temperature rise is ~40 C above 25 C ambient, so margin to 85 C junction is comfortable.
Routing the FC-FBGA-1020 with 1.0 mm pitch requires microvia (laser-drilled or plasma-etched) technology on at least layers 1 to 2, or via-in-pad construction. Match-length differential pairs for all SERDES channels to within 5 mils per inch of trace to preserve eye-mask margins. According to the Altera Stratix GX PCB design guidelines, place reference-clock sources within 5 cm of the FPGA reference-clock balls and isolate analog (VCCA) and digital (VCC) ground returns with a single bridge near the FPGA. Decouple every VCC and VCCA pin with 0.1 uF plus 10 uF ceramic per the reference schematic.
Power-up sequencing for the EP1SGX40DF1020C7 requires VCC_CORE (1.5 V) before or coincident with VCCA (transceiver analog) and VCC_PLL, never the reverse. Use Altera-recommended hot-swap controllers or supervisor circuits to enforce this order. Reference clock inputs require AC-coupling capacitors close to the FPGA REFCLK balls; according to the Stratix GX datasheet, the input clock amplitude must meet the LVDS or LVPECL specification defined in the High-Speed I/O Specifications chapter.
Do not confuse the EP1SGX40 (Stratix GX with transceivers) with the EP1S40 (base Stratix without transceivers) when sourcing alternate parts: both share the 1020-FBGA footprint, but only the GX variant has integrated SERDES. Likewise, the EP1SGX25 (Stratix II GX) is a different silicon revision with different transceiver counts - designs must re-synthesize. According to the Stratix Family Handbook, JTAG chain order must place the FPGA in TAP position 1 or last to avoid IR-drop-induced configuration failures.
Compliance Information
All compliance flags are unknown because the verified web data does not contain explicit RoHS / REACH / lead-free status for the EP1SGX40DF1020C7. The part is listed as EOL/Active-stock by Rochester Electronics (DigiKey 12603369). AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC.
