K9DUGY8S0M-BCK0 - Samsung NAND Flash Memory IC | Samsung
料号： K9DUGY8S0M-BCK0 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
K9DUGY8S0M-BCK0 概述
NAND flash memory is a type of non-volatile storage technology that retains data without power. It sits within the memory hierarchy as a block-addressable mass-storage medium: NAND flash belongs to the broader family of memory ICs, which includes volatile DRAM (such as DDR SDRAM) and non-volatile NOR flash, EEPROM, and emerging storage-class memories. Unlike NOR flash, which offers random byte-level access, NAND flash provides high-density sequential page access, making it the workhorse technology behind SSDs, eMMC storage, USB drives, memory cards, and embedded storage subsystems. Raw NAND requires a host-side controller to manage wear leveling, error correction (ECC), and bad-block management.
Samsung Electronics is one of the world's leading NAND flash manufacturers, and the K9 family represents its line of discrete NAND flash ICs used by system designers, module makers, and industrial storage integrators. Ordering codes such as K9DUGY8S0M-BCK0 encode the product family, density class, interface type, and speed/package suffix; in this code, the -BCK0 suffix identifies a specific speed grade and package/temperature option per Samsung's part-numbering scheme.
Typical applications for devices in this class include embedded system storage, industrial data loggers, networking equipment, set-top boxes, and solid-state storage modules where a raw NAND die is managed by an external controller. Designers select raw NAND over managed NAND (eMMC/UFS) when they need full control over the storage stack, lower bill-of-materials cost at scale, or custom error-correction and wear-leveling strategies.
A key design consideration with raw NAND flash is that the host controller must implement block management and ECC appropriate to the NAND generation; interface timing, supply voltages, and package footprint must be verified against the Samsung datasheet for the exact ordering code before layout sign-off.
This page synthesizes the retrieved distributor and inventory listings for the K9DUGY8S0M family, drop-in same-family alternatives from Samsung's K9 series, and practical sourcing guidance not consolidated in a single manufacturer document. Where verified data was unavailable for a parameter, it is explicitly marked rather than estimated, so engineers can distinguish confirmed specifications from items requiring datasheet confirmation.
直接替换替代料： K9DUGY8S0M-BCK0 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： K9DUGY8S0M-BCK0 （相同外形与封装尺寸） ——差异在于 Memory Type, Product Family, RoHS Status, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
K9DUGY8S0M-CCK0
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →K9DUGY8S0M-4000
✅ 直接替换📋 参考替代料（不在目录中）
K9DUGY8S7M
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →K9DUGB8S7M
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →K9DUGY8S0M-CCK0
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →K9DUGY8S0M-BCK0 最大额定值与电气特性
| Manufacturer | Samsung Electronics |
| Product Family | K9 series NAND flash |
| 存储器类型 | NAND Flash |
| 安装类型 | Surface Mount |
K9DUGY8S0M-BCK0 standard 引脚配置指南
K9DUGY8S0M-BCK0（standard 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： K9DUGY8S0M-BCK0.
请参阅 数据手册 以查看完整引脚配置。
典型应用
K9DUGY8S0M-BCK0 适用于 6 应用s: Embedded System Storage, Industrial Data Loggers, Networking and Telecom Equipment, Solid-State Storage Modules, Consumer Electronics Firmware Storage, Automotive-Adjacent and Rugged Industrial Systems.
Embedded System Storage
Raw NAND flash like the Samsung K9DUGY8S0M-BCK0 is the storage medium inside embedded systems where a main SoC or dedicated flash controller manages the NAND directly. Because raw NAND offers the lowest cost per gigabit and full control over the storage stack, it is favored in routers, set-top boxes, industrial PCs, and smart appliances. The host implements ECC and wear leveling tuned to the NAND generation, which allows longer effective life than one-size-fits-all managed storage. A design benefit of this Samsung K9 family part is supply-chain maturity: multiple ordering codes trade actively in distribution, easing second-source qualification within the same footprint. Designers should budget firmware effort for bad-block management and validate timing modes against the datasheet before lock-down.
推荐
Industrial Data Loggers
Industrial data loggers that record sensor streams over years of field operation benefit from the endurance and cost structure of raw NAND flash. A controller-based logger using the K9DUGY8S0M-BCK0 can implement custom wear-leveling algorithms matched to the actual write pattern, spreading erase cycles evenly across blocks and extending usable life beyond what managed storage of the same budget achieves. Temperature-tolerant operation and page-level redundancy schemes can also be tuned by firmware. Because logging write traffic is typically small and frequent, the controller should use page caching to avoid partial-page programming penalties. Designers should verify the -BCK0 suffix's operating temperature range on the Samsung datasheet and select an industrial-grade suffix if the deployment window extends beyond commercial limits.
推荐
Networking and Telecom Equipment
Switches, routers, and telecom line cards use raw NAND for firmware images, configuration, and log storage. The Samsung K9DUGY8S0M-BCK0 fits this role because network processors commonly expose a native NAND flash interface with ONFI or Toggle timing support, letting the K9 family connect directly without glue logic. Firmware-in-flash upgrade schemes also benefit from raw control: the host can implement dual-image layouts with power-fail-safe updates. Signal integrity matters in dense line cards; keep NAND data and control traces short and reference them to solid ground planes per Samsung layout guidance. Verify the interface timing mode of the -BCK0 speed grade against the SoC's supported modes, and provide VCC/VCCQ decoupling close to the package balls.
推荐
Solid-State Storage Modules
SSD and storage-module developers use raw NAND dies such as the K9DUGY8S0M-BCK0 behind a dedicated NAND controller that implements FTL (flash translation layer), strong ECC, and garbage collection. At module scale, the per-gigabit cost advantage of raw NAND over managed eMMC is decisive, and Samsung's K9 family provides a well-documented, widely supported target for controller firmware stacks. Channel and die-level parallelism can be exploited across multiple NAND packages to scale bandwidth. Design considerations include thermal spreading across the module PCB, as NAND write operations dissipate heat concentrated at the packages, and qualifying a second ordering code (such as K9DUGY8S0M-CCK0) in the same footprint to hedge allocation cycles without changing the module PCB.
推荐
Consumer Electronics Firmware Storage
TVs, audio systems, cameras, and smart-home devices store firmware and user data on low-cost raw NAND managed by the product's main SoC. The Samsung K9DUGY8S0M-BCK0 suits this role where the SoC vendor provides a validated NAND driver list including Samsung K9 parts, minimizing bring-up risk. Consumer designs prize bill-of-materials savings, and raw NAND with SoC-integrated ECC typically undercuts eMMC at equal density. Designs should implement power-fail resilience, since consumer products lose power unexpectedly; this is handled in firmware via journaling and redundant image slots rather than in the NAND itself. Verify the package footprint against the SoC vendor's supported ball maps before committing the PCB layout.
推荐
Automotive-Adjacent and Rugged Industrial Systems
Rugged industrial controllers, telematics boxes, and off-highway equipment electronics use raw NAND where a certified controller manages ECC and thermal wear management. In vibration-prone and wide-temperature environments, the soldered NAND package outperforms removable media mechanically, and the Samsung K9 family's mature supply base supports long production programs. Firmware should derate endurance for high-temperature operation, since retention and endurance both degrade as junction temperature rises, and should log bad-block growth as a predictive-maintenance signal. Confirm the -BCK0 suffix temperature rating on the Samsung datasheet; for full automotive qualification, pair the design with AEC-qualified support components rather than assuming the NAND itself carries automotive grade.
推荐
推荐产品汇总
工程参考数据： K9DUGY8S0M-BCK0 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | K9DUGY8S0M-CCK0 | K9DUGY8S0M-4000 | K9DUGY8S7M |
|---|---|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Product Family | K9DUGY8S0M (K9 series) | K9DUGY8S0M (K9 series) | K9DUGY8S0M (K9 series) | K9DUGY8 (K9 series) |
| Speed Grade Suffix | -BCK0 | -CCK0 | -4000 | S7M |
| Distributor Availability | Independent/inventory exchange listings | Listed on XAIPART site MPN catalog | Active distributor/inventory listings (2026) | Listed on XAIPART site MPN catalog |
关键差异点
- Mature Samsung K9 family with multiple sourcing codes （对比 K9DUGY8S0M-CCK0)
- Active independent inventory for the -4000 variant （对比 K9DUGY8S0M-4000)
- Lower storage cost than managed alternatives （对比 eMMC/UFS managed NAND)
设计说明
NAND flash interfaces toggle fast enough that trace length, impedance control, and clean return paths materially affect reliability. Route the NAND data bus and control signals (CLE, ALE, WE, RE) as short as practical, reference them to an unbroken ground plane, and match lengths within the bus where the controller's timing budget is tight. For Toggle DDR or high ONFI modes, follow the Samsung datasheet layout section for ball-map escape routing. Validate the interface at the highest supported timing mode with scope measurements on read/write strobes before releasing the layout.
Provide dedicated decoupling on both VCC and VCCQ (where the package splits core and I/O supplies) directly at the package balls: typically bulk capacitance plus ceramic decoupling placed within a few millimeters of the package. Do not share a long power spur with other switching loads, because program and erase operations draw burst current that can droop the rail and corrupt an in-flight program operation. If the board uses a switching regulator for the NAND rail, verify ripple at the NAND pins against the Samsung datasheet limits during page program bursts.
The most common failure mode with raw Samsung K9 NAND is a controller/NAND mismatch: ECC strength below the die's requirement, incorrect ONFI/Toggle timing mode, or missing bad-block table handling causes silent data corruption that appears only in the field. Always validate the full FTL stack against the exact ordering code (-BCK0) being sourced, not just the family. Additionally, confirm date codes and traceability when buying from independent channels, since open-market NAND carries elevated counterfeit risk; purchase through verified channels such as XAIPART with pre-shipment inspection.
合规信息
Retrieved distributor data for K9DUGY8S0M-BCK0 did not include explicit RoHS/REACH declarations. Samsung's modern discrete NAND is generally lead-free/RoHS-manufactured, but compliance must be confirmed via Samsung's material declaration system before order commitment.
