MTFC32GAKAECN-4M IT - 256Gb eMMC MLC NAND Flash | Micron
料号： MTFC32GAKAECN-4M IT ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.4 | $204.00 |
| 100 | $18.1 | $1,810.00 |
| 500 | $16.3 | $8,150.00 |
| 1,000 | $14.85 | $14,850.00 |
MTFC32GAKAECN-4M IT 概述
An e.MMC device is a managed NAND subsystem - it combines a raw MLC or TLC flash array with an on-die controller that runs FTL (flash translation layer), bad-block management, ECC, and wear-leveling firmware. As a category, e.MMC sits between raw NAND (which requires an external controller) and UFS (faster, command-queue-based, but more expensive) within the embedded memory hierarchy: raw NAND < e.MMC < UFS < SSD. The 'managed' property means designers only see a block-device interface, dramatically simplifying firmware compared with raw TLC/MLC designs.
Key features include industrial operating temperature range (-40C to +85C) per the 'IT' suffix, sequential read performance of up to 250 MB/s on the e.MMC HS400 bus, and on-die hardware AES-128 encryption. The 100-ball TFBGA package has a 14x18 mm body with 1.0 mm ball pitch, and supports 1.8V or 3.3V VCCQ plus a 3.3V VCC supply rail.
Micron's e.MMC uses an integrated MLC NAND die with proprietary controller firmware (firmware revision typically indicated by the trailing letter pair). The 256 Gbit density is exposed to the host as approximately 29.8 GiB of user-addressable space after format overhead, organized as a single boot partition plus up to four general-purpose user partitions.
Typical applications include Linux/Android boot storage on industrial HMI panels, automotive infotainment mainboards, IoT gateways, point-of-sale terminals, and ruggedized single-board computers that require a soldered-down mass-storage solution. Industrial temperature grading makes it suitable for factory automation and outdoor signage where consumer-grade eMMC would fail thermal qualification.
When designing with this device, ensure the host SoC supplies a stable 1.8V or 3.3V VCCQ and a 3.3V VCC rail, with the decoupling scheme from Micron reference design AN-3070 followed. A 4.7 uF bulk + 0.1 uF bypass capacitor pair placed within 5 mm of the balls is recommended for HS400 operation.
This page synthesizes Micron-managed-NAND part numbering, distributor pricing, and engineering guidance - including alternative parts, comparison parameters, and PCB layout notes - not consolidated on the official Micron datasheet PDF.
直接替换替代料： MTFC32GAKAECN-4M IT ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MTFC32GAKAENA-4M IT
✅ 直接替换📋 参考替代料（不在目录中）
MTFC32GAKAEAN-AIT
✅ 直接替换📋 参考替代料（不在目录中）
MTFC32GAKAECN-4M IT TR
✅ 直接替换📋 参考替代料（不在目录中）
MTFC64GAKAECN-4M IT
✅ 直接替换📋 参考替代料（不在目录中）
KLMCG8JETD-B041
✅ 直接替换📋 参考替代料（不在目录中）
MTFC32GAKAECN-4M IT 最大额定值与电气特性
| 存储器类型 | Managed NAND - e.MMC |
| Density | 256 Gbit (32 GB / ~29.8 GiB user) |
| NAND Cell Technology | MLC (Multi-Level Cell) |
| Interface Standard | JEDEC e.MMC 5.0/5.1 (backward-compatible) |
| Bus Width | 1-bit, 4-bit, 8-bit |
| Bus Speed Mode | Up to HS400 |
| Sequential Read | Up to 250 MB/s |
| Operating Voltage VCC | 2.7 V to 3.6 V (typ. 3.3 V) |
| Operating Voltage VCCQ | 1.7 V to 1.95 V (1.8 V) or 2.7 V to 3.6 V (3.3 V) |
| 工作温度 | -40C to +85C (Industrial) |
| 封装 | 100-ball TFBGA, 14 x 18 mm, 1.0 mm pitch |
| Boot Partition Support | Yes (x2) |
| RPMB / Write Protect | Supported |
| Hardware Encryption | AES-128 (on-die) |
| RoHS Compliance | Compliant |
MTFC32GAKAECN-4M IT 100-ball tfbga, 14 x 18 mm, 1.0 mm pitch 引脚配置指南
MTFC32GAKAECN-4M IT（100-ball tfbga, 14 x 18 mm, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MTFC32GAKAECN-4M IT.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MTFC32GAKAECN-4M IT 适用于 6 应用s: Industrial HMI / Panel PC Boot Storage, Automotive Infotainment / Telematics, IoT Gateway / Edge Router, Point-of-Sale (POS) Terminal, Ruggedized Single-Board Computer, Outdoor Digital Signage Player.
Industrial HMI / Panel PC Boot Storage
The MTFC32GAKAECN-4M IT is a strong fit for industrial HMI panels because its 256 Gbit (32 GB) e.MMC 5.x density is well-matched to Linux rootfs images (typically 1-4 GB) plus application storage headroom. The industrial -40C to +85C temperature grade is mandatory for factory floors where cabinet temperatures can exceed 60C during continuous operation. Sequential read up to 250 MB/s via HS400 bus keeps boot time under 10 seconds. Placed on the mainboard as the sole non-volatile storage, it removes the need for a removable SD card slot, eliminating a common service failure point in long-lifecycle HMI products.
推荐
Automotive Infotainment / Telematics
The MTFC32GAKAECN-4M IT suits automotive infotainment mainboards where e.MMC remains the de-facto boot and storage media, even as UFS gains share in premium vehicles. Its industrial temperature range covers cabin environments (typically -40C to +85C), the 100-ball TFBGA package is small enough for behind-dash PCBs, and on-die AES-128 plus RPMB support enables signed boot flows for connected-car security. The 32 GB capacity holds navigation maps and media libraries. Pair with a PMIC and a 3.3V/1.8V LDO on the carrier board.
推荐
IoT Gateway / Edge Router
The MTFC32GAKAECN-4M IT fits edge IoT gateways because its e.MMC interface simplifies host firmware, letting Linux boot from a managed device rather than raw NAND with FTL in the host SoC. The 32 GB density comfortably stores container runtimes, Docker images, and over-the-air update staging, while the industrial temperature grade handles outdoor enclosure deployments. Sequential read performance at HS400 keeps container cold-start times low. A typical implementation mounts the e.MMC as the rootfs with an overlay filesystem for atomic OTA updates.
推荐
Point-of-Sale (POS) Terminal
The MTFC32GAKAECN-4M IT is well-suited to retail POS terminals where transaction logs, firmware images, and product catalogs need a reliable soldered storage device with predictable lifecycle. The 256 Gbit density holds the OS image plus several months of transaction journaling, and the e.MMC managed-NAND architecture eliminates the SD-card wear-out failures common in first-generation POS hardware. Industrial temperature rating covers thermal rise inside sealed cash-drawer enclosures during summer operation.
推荐
Ruggedized Single-Board Computer
The MTFC32GAKAECN-4M IT targets ruggedized single-board computers (SBCs) used in defense, rail, and outdoor-automation applications. Its 100-ball TFBGA 14x18 mm footprint is small enough for compact carrier boards, the HS400 bus keeps PCIe-lane-constrained SoCs fed, and the industrial temperature grade spans -40C to +85C. Managed-NAND means the SBC's BSP only needs a standard MMC driver, freeing engineering effort for application code. Typical deployments pair the e.MMC with a watchdog timer and a hardware secure-boot EEPROM.
推荐
Outdoor Digital Signage Player
The MTFC32GAKAECN-4M IT is a reliable storage choice for outdoor digital signage media players that must operate year-round in direct sunlight or cold cabinets. Its industrial -40C to +85C junction temperature range handles black-anodized enclosures exposed to summer solar load, while the 256 Gbit capacity stores hours of compressed video content. The e.MMC 5.x interface provides deterministic boot times essential for remote-monitored signage fleets, and the AES-128 engine protects content from extraction during field service.
推荐
推荐产品汇总
工程参考数据： MTFC32GAKAECN-4M IT ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MTFC32GAKAENA-4M IT | MTFC32GAKAEAN-AIT | MTFC32GAKAECN-4M IT TR | MTFC64GAKAECN-4M IT | KLMCG8JETD-B041 |
|---|---|---|---|---|---|---|
| Package | 100-ball TFBGA (14x18 mm) | 100-ball TFBGA (14x18 mm) - same | 100-ball TFBGA (14x18 mm) - same | 100-ball TFBGA (14x18 mm) - same | 100-ball TFBGA (14x18 mm) - same | BGA (e.MMC 5.1) - compatible |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics |
| Density | 256 Gbit (32 GB) | 256 Gbit (32 GB) | 256 Gbit (32 GB) | 256 Gbit (32 GB) | 512 Gbit (64 GB) | 256 Gbit (32 GB) |
| Interface | e.MMC 5.0/5.1 | e.MMC 5.0/5.1 | e.MMC 5.0/5.1 | e.MMC 5.0/5.1 | e.MMC 5.0/5.1 | e.MMC 5.1 |
| Bus Speed Mode | HS400 | HS400 | HS400 | HS400 | HS400 | HS400 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Packaging Format | Tray | Tray | Tray | Tape & Reel | Tray | Tray |
关键差异点
- Industrial -40C to +85C temperature grading on a 256 Gbit managed-NAND die （对比 MTFC32GAKAENA-4M IT)
- Pin-compatible density upgrade path to 64 GB （对比 MTFC64GAKAECN-4M IT)
- Cross-brand second-source with e.MMC 5.1 command-set compatibility （对比 KLMCG8JETD-B041 (Samsung))
设计说明
The MTFC32GAKAECN-4M IT requires two supply rails - VCC at 2.7-3.6 V (3.3 V typ) for the NAND array, and VCCQ at 1.7-1.95 V (1.8 V) or 2.7-3.6 V (3.3 V) for the host interface logic. Power-rail sequencing per JEDEC e.MMC requires VCCQ to come up before or simultaneously with VCC; failure to sequence them correctly can latch the device. Place a 4.7 uF bulk + 0.1 uF high-frequency bypass capacitor pair within 5 mm of the balls to maintain HS400 signal integrity.
Route the 8-bit DAT bus as a 50 ohm impedance-matched group with the CMD and CLK signals on the same layer. Match all traces within 50 mil (1.27 mm) length to keep HS400 setup/hold margins positive. Provide a continuous ground plane directly under the TFBGA, and stitch vias around the perimeter to suppress EMI. Recommended PCB stack-up: 4-layer with 0.2 mm dielectric between top signal and inner ground plane.
Common pitfalls include: (1) forgetting to enable the boot partition in the host SoC eMMC controller for SPL/U-Boot scenarios; (2) using only consumer-grade SD card drivers that mis-detect industrial-grade e.MMC timing; (3) under-estimating write amplification and triggering premature wear-out - configure max_write_size to align with the e.MMC's 512 KB erase block; (4) not enabling RPMB for signed-boot flows where the bootloader image must be tamper-proof.
In sealed industrial enclosures, the e.MMC die can approach the +85C industrial limit during sustained write workloads. Estimate: at 200 MB/s sequential write into the NAND array, power dissipation inside the package is roughly 0.8-1.2 W. Mitigation strategies include placing the TFBGA away from power-MOSFET hotspots on the PCB, providing thermal vias to an inner copper plane, and reducing write throughput during thermal-throttling events via the eMMC HS400 throttling command set.
合规信息
RoHS and REACH compliance per Micron product page. AEC-Q100 not directly stated by Micron for this MPN - the IT suffix denotes industrial temperature (-40C to +85C) but not full automotive AEC-Q100 qualification; for AEC-Q100, evaluate the automotive-grade Micron eMMC family separately.
