RTAX1000SL-CGS624V - 1M-Gate Rad-Tolerant FPGA | Microchip
料号： RTAX1000SL-CGS624V ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4100 | $41,000.00 |
| 100 | $3800 | $380,000.00 |
| 500 | $3600 | $1,800,000.00 |
| 1,000 | $3400 | $3,400,000.00 |
RTAX1000SL-CGS624V 概述
A radiation-tolerant FPGA is a field-programmable gate array qualified to survive the ionizing-radiation environment of orbital and deep-space missions. Within the power-management hierarchy of onboard avionics, it sits at the top: semiconductor -> programmable logic device (PLD) -> FPGA -> radiation-tolerant FPGA. Unlike SRAM FPGAs, the RTAX-S/SL family uses antifuse programmable interconnect, so the configuration is permanent and the device is live-at-power-up with no external configuration flash, an important reliability benefit for single-string spacecraft architectures.
Key features include a 1,000,000 equivalent system gate density, embedded SRAM blocks with built-in FIFO control logic, segmentable clocks, chip-wide highway routing, and carry logic for arithmetic-intensive datapaths. Based on the commercial Axcelerator architecture, the SL variant adds radiation-hardening refinements targeting total ionizing dose (TID) and single-event effect (SEE) resilience in orbit.
The architecture combines logic modules with dedicated embedded memory, enabling high-throughput payload processing while keeping power consumption low, a dominant constraint in solar- and battery-powered spacecraft. Multiple clock domains supported by segmentable clock resources allow graceful management of timing across instrument, bus, and telemetry interfaces.
Typical applications include satellite on-board data handling, payload data processing, spacecraft telemetry and command interfaces, and radiation-environment instrument control, where the antifuse one-time-programmable fabric resists configuration upsets.
Design consideration: because the antifuse fabric is one-time programmable, prototypes should be implemented on footprint-compatible companion devices using the manufacturer's adaptor-board methodology before committing to flight silicon.
This page synthesizes distributor availability, family cross-references, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： RTAX1000SL-CGS624V ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： RTAX1000SL-CGS624V （相同外形与封装尺寸） ——差异在于 Package, Technology, Family, Equivalent System Gates, Radiation Tolerance.
快速对比工具——选择替代料号进行并排对比：
RTAX1000SL-CGS624E
✅ 直接替换✓ 有现货
$3970 / 个
查看数据手册 →RTAX1000SL-1CGS624V
✅ 直接替换✓ 有现货
$1 / 个
查看数据手册 →RTAX1000SL-1CGS624E
✅ 直接替换✓ 有现货
$3420 / 个
查看数据手册 →RTAX1000SL-1CGS624B
✅ 直接替换✓ 有现货
$3200 / 个
查看数据手册 →RTAX2000S-CGS624V
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →RTAX2000SL-CGS624V
✅ 直接替换✓ 有现货
$6500 / 个
查看数据手册 →RTAX1000SL-CGS624V 最大额定值与电气特性
| System Gates | 1,000,000 |
| Logic Cells | 18144 |
| CLBs | 12096 |
| Technology | Digital CMOS antifuse |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs |
| Programmability | One-Time Programmable (antifuse), live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clock Resources | Segmentable clocks, chip-wide highway routing |
| Carry Logic | Yes (dedicated fast carry chain) |
| 封装 | CGS624 (624-column ceramic grid array) |
| 安装类型 | Surface Mount |
| Application Domain | Space-flight systems |
| Radiation Tolerance | Radiation-tolerant (TID/SEE per manufacturer qualification) |
| Max Family Density | 4,000,000 equivalent system gates |
| Base Commercial Family | Axcelerator |
RTAX1000SL-CGS624V cgs624 (624-column ceramic grid array) 引脚配置指南
RTAX1000SL-CGS624V（cgs624 (624-column ceramic grid array) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： RTAX1000SL-CGS624V.
请参阅 数据手册 以查看完整引脚配置。
典型应用
RTAX1000SL-CGS624V 适用于 6 应用s: Satellite On-Board Data Handling, Payload Data Processing, Spacecraft Telemetry and Command, Radiation Environment Instrument Control, Launch Vehicle Avionics, Deep-Space Probe Electronics.
Satellite On-Board Data Handling
The RTAX1000SL-CGS624V fits satellite on-board data handling (OBDH) because its antifuse fabric is live at power-up with no configuration memory that can be corrupted by single-event upsets, a decisive advantage over SRAM FPGAs in orbit. With 1,000,000 system gates, 12,096 CLBs, and embedded SRAM featuring built-in FIFO control logic, it implements bus controllers, memory managers, and packet routing in a single-chip form factor that reduces board real estate and assembly risk. Segmentable clocks allow separate timing domains for the spacecraft bus interface and payload side. Placed at the heart of the avionics stack, it replaces glue logic, mitigates parts-count concerns, and its low-power CMOS operation directly reduces the power budget burden on solar arrays and batteries.
推荐
Payload Data Processing
For payload data processing in observation and science missions, the RTAX1000SL-CGS624V provides 18,144 logic cells plus dedicated carry logic for high-throughput datapaths such as image compression, filtering, and front-end formatting. The chip-wide highway routing resources sustain wide data buses across the die, while embedded SRAM blocks with built-in FIFO control implement line buffers and elastic FIFOs between acquisition and downlink chains. Because the antifuse configuration cannot suffer configuration upsets, the processing chain maintains integrity during single-event passes through the South Atlantic Anomaly. Radiation-tolerant qualification targets the TID and SEE environment of low-Earth-orbit and beyond, letting payload designers meet data-rate requirements without triple-modular redundancy of the configuration layer.
推荐
Spacecraft Telemetry and Command
Telemetry and command interfaces demand deterministic, always-available logic from the instant of separation. The RTAX1000SL-CGS624V is live at power-up, so command decoders and telemetry formatters begin operating immediately without a configuration load cycle, eliminating a failure window at the most critical mission phase. Its 1,000,000-gate capacity accommodates CCSDS framing, housekeeping aggregation, and redundant-decoder voting logic alongside the interface cores. Embedded SRAM FIFOs decouple the TM/TC serial interfaces from the internal bus. The CGS624 ceramic column grid array provides the mechanical robustness and thermal path required for launch vibration and vacuum operation, and low quiescent power keeps the survival-heater and contingency power budgets small during safe-mode operation.
推荐
Radiation Environment Instrument Control
Science instruments that measure the space radiation environment, such as particle detectors and dosimeters, must themselves survive the flux they observe. The RTAX1000SL-CGS624V provides a radiation-tolerant control backbone with 12,096 CLBs implementing detector readout sequencing, histogramming via dedicated carry logic, and event FIFOs in embedded SRAM. One-time-programmable antifuse interconnect means the instrument's control firmware cannot be upset by the very particles it counts, an architectural advantage over reprogrammable fabrics deployed in high-fluence orbits. Segmentable clocks let slow instrument cycles coexist with fast burst-capture logic. Its low-power CMOS operation suits battery-powered small-satellite and cubesat platforms where detector front-end power dominates and the controller must consume minimally.
推荐
Launch Vehicle Avionics
Launch vehicle flight computers and stage controllers benefit from the RTAX1000SL-CGS624V's live-at-power-up antifuse architecture: there is no boot delay or configuration-read cycle between power application and operation, and the one-time-programmed logic cannot be corrupted by the severe vibration, shock, and radiation transients of ascent. The 1,000,000-gate capacity implements redundant-voting flight logic, sequencing, and safety-critical interlocks, while chip-wide highway routing supports the wide parallel interfaces typical of inertial measurement units and telemetry encoders. The ceramic column grid array package withstands the thermo-mechanical stress of launch environments better than plastic packaging, and low power consumption simplifies battery-distributed power architecture across multiple stages.
推荐
Deep-Space Probe Electronics
Deep-space missions face total ionizing dose accumulation and galactic cosmic-ray flux far beyond LEO levels, making radiation-tolerant silicon mandatory. The RTAX1000SL-CGS624V's antifuse fabric provides upset-immune configuration for mission-critical sequencing, fault management, and instrument multiplexing over multi-year cruises where no repair or reconfiguration is possible. Embedded SRAM with FIFO control buffers science data between acquisition windows and infrequent deep-space communication passes, and the single-chip form factor reduces the harness and board complexity that adds failure modes on missions that cannot be serviced. Low power operation is essential when solar flux falls and radioisotope or small-array power is scarce.
推荐
推荐产品汇总
工程参考数据： RTAX1000SL-CGS624V ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | RTAX1000SL-CGS624E | RTAX1000SL-1CGS624V | RTAX2000S-CGS624V | RTAX2000SL-CGS624V |
|---|---|---|---|---|---|
| Package | CGS624 (624-column ceramic grid array) | CGS624 - same | CGS624 - same | CGS624 - same | CGS624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 2,000,000 | 2,000,000 |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | Standard |
| Technology | CMOS antifuse, one-time programmable | CMOS antifuse | CMOS antifuse | CMOS antifuse | CMOS antifuse |
| Design Migration | N/A (baseline) | None - identical die | None - identical die, different grade | EDIF netlist + pinout conversion required | EDIF netlist + pinout conversion required |
| Application Target | Space-flight systems | Space-flight systems | Space-flight systems (performance-critical) | Space-flight systems (higher density) | Space-flight systems (higher density) |
关键差异点
- Proven 1M-gate density in the CGS624 ceramic footprint （对比 RTAX2000S-CGS624V)
- Faster timing closure option on identical silicon （对比 RTAX1000SL-CGS624E)
- Configuration-upset immunity versus SRAM FPGAs （对比 SRAM-based space FPGAs (general))
- Trade-off: fixed capacity ceiling （对比 RTAX2000SL-CGS624V)
设计说明
The RTAX1000SL-CGS624V is one-time programmable: a programming error permanently consumes a flight device that can cost thousands of dollars and carry long lead time. Follow Microchip's documented prototyping methodology - implement and verify the design on footprint-compatible commercial silicon or a footprint-compatible adaptor board, then use the EDIF netlist and pinout converter to migrate to RTAX-S flight silicon. Never program flight parts without a fully signed-off timing report and bitstream verification flow.
The CGS624 is a ceramic column grid array, not a standard BGA: interconnect columns have different collapse behavior than solder balls, so follow the ceramic-column land pattern and reflow profile recommended in the Microchip RTAX-S/SL datasheet package section. Plan inspection access (X-ray or micro-section coupons) for column solder joints, which are critical in launch-vibration environments. Verify board warpage limits across the large 624-column body to guarantee column co-planarity during reflow.
Estimated: supply decoupling should place low-ESR ceramic capacitors (e.g., 0.1 uF per power pair plus bulk capacitance) at every voltage rail pin group of the 624-column package, since core and I/O rails must remain within tolerance during simultaneous switching of the large I/O ring. Confirm the exact per-rail pin assignments and current ratings in the Microchip RTAX-S/SL datasheet power section before finalizing the power distribution network; do not rely on generic FPGA decoupling guidance for flight hardware.
Select speed grade and lead-finish suffix (V/E/B) at order entry, since suffixes identify different screening flows. Cross-reference the ordering-code definition against the Microchip datasheet ordering-information section and the DLA Standard Microcircuit Cross-Reference entries (e.g., 5962-0422008QUA) when procuring against SMD drawings, to ensure the delivered part matches the program's qualified configuration and traceability requirements.
合规信息
Compliance screening for space-grade ceramic-packaged devices varies by lead-finish suffix (V/E/B). Verify RoHS/REACH status for the specific suffix on the Microchip product page or with the distributor; hermetic ceramic packages may carry exemptions.
