10AS032H2F34E2LG vs 10AS032H3F34I2LG مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ 10AS032H2F34E2LG بواسطة Intel و 10AS032H3F34I2LG بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | 10AS032H2F34E2LG | 10AS032H3F34I2LG |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| العلبة | 1152-ball FC-FBGA (F34), 35 x 35 mm | 1152-FBGA, FC (35x35 mm) |
| Speed Grade | 2 | 2 |
| Temperature Grade | E2 (commercial/extended) | — |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | — |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | — |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm (Arria 10 generation) |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| حالة RoHS | Compliant | — |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | — | 1.5 GHz |
| Pin/Ball Count | — | 1152 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Operating Temperature Grade | — | Industrial |
| Temperature Range | — | -40C to +100C (junction, per industrial grade) |
| Device Designator | — | 10AS032H3F34I2LG |
| Lead-Free / RoHS | — | Yes (LG suffix) |
| Packaging Form | — | Tray (LG suffix) |