10AS032H2F34E2LG vs 10AS032H3F34I2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032H2F34E2LG disebabkan oleh Intel dan 10AS032H3F34I2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS032H2F34E2LG | 10AS032H3F34I2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| Kemasan | 1152-ball FC-FBGA (F34), 35 x 35 mm | 1152-FBGA, FC (35x35 mm) |
| Speed Grade | 2 | 2 |
| Temperature Grade | E2 (commercial/extended) | — |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | — |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | — |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm (Arria 10 generation) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | — | 1.5 GHz |
| Pin/Ball Count | — | 1152 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Operating Temperature Grade | — | Industrial |
| Temperature Range | — | -40C to +100C (junction, per industrial grade) |
| Device Designator | — | 10AS032H3F34I2LG |
| Lead-Free / RoHS | — | Yes (LG suffix) |
| Packaging Form | — | Tray (LG suffix) |