10AS032H2F34E2LG vs 10AS032H3F34I2LG तुलना
विस्तृत दोनों ओर की तुलना 10AS032H2F34E2LG द्वारा Intel और 10AS032H3F34I2LG द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10AS032H2F34E2LG | 10AS032H3F34I2LG |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| पैकेज | 1152-ball FC-FBGA (F34), 35 x 35 mm | 1152-FBGA, FC (35x35 mm) |
| Speed Grade | 2 | 2 |
| Temperature Grade | E2 (commercial/extended) | — |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | — |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | — |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm (Arria 10 generation) |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| RoHS स्थिति | Compliant | — |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | — | 1.5 GHz |
| Pin/Ball Count | — | 1152 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Operating Temperature Grade | — | Industrial |
| Temperature Range | — | -40C to +100C (junction, per industrial grade) |
| Device Designator | — | 10AS032H3F34I2LG |
| Lead-Free / RoHS | — | Yes (LG suffix) |
| Packaging Form | — | Tray (LG suffix) |