10AS032H2F34E2LG vs 10AS032H3F34I2LG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H2F34E2LG sa pamamagitan ng Intel at 10AS032H3F34I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10AS032H2F34E2LG 10AS032H3F34I2LG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria 10 SX Arria 10 SX SoC FPGA
Device Tier 10AS032 (mid-density) —
Configuration SoC FPGA (HPS + FPGA fabric) —
Logic Elements 320,000 320,000
Processor Subsystem Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum Operating Frequency 1.5 GHz —
Packhaging 1152-ball FC-FBGA (F34), 35 x 35 mm 1152-FBGA, FC (35x35 mm)
Speed Grade 2 2
Temperature Grade E2 (commercial/extended) —
On-chip Memory (M20K blocks) Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] —
DSP Blocks Variable-precision, IEEE 754 single-precision FP support —
Transceivers Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] —
Memory Controller Hard IP DDR4, DDR3, QDRII+, RLDRAM3 —
Process Node 20 nm 20 nm (Arria 10 generation)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS Compliant —
Form of Terminal Ball (BGA) —
Terminal Pitch 1 mm —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Maximum HPS Clock Frequency — 1.5 GHz
Pin/Ball Count — 1152
Terminal Form — Ball
Package Code — BGA
Package Shape — Square
Operating Temperature Grade — Industrial
Temperature Range — -40C to +100C (junction, per industrial grade)
Device Designator — 10AS032H3F34I2LG
Lead-Free / RoHS — Yes (LG suffix)
Packaging Form — Tray (LG suffix)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita