10AS032H2F34E2LG vs 10AS032H3F34I2LG Perbandingan
Perbandingan bersamaan detil 10AS032H2F34E2LG dari Intel dan 10AS032H3F34I2LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AS032H2F34E2LG | 10AS032H3F34I2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| Paket | 1152-ball FC-FBGA (F34), 35 x 35 mm | 1152-FBGA, FC (35x35 mm) |
| Speed Grade | 2 | 2 |
| Temperature Grade | E2 (commercial/extended) | — |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | — |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | — |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm (Arria 10 generation) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | — | 1.5 GHz |
| Pin/Ball Count | — | 1152 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Operating Temperature Grade | — | Industrial |
| Temperature Range | — | -40C to +100C (junction, per industrial grade) |
| Device Designator | — | 10AS032H3F34I2LG |
| Lead-Free / RoHS | — | Yes (LG suffix) |
| Packaging Form | — | Tray (LG suffix) |