EP2A25F672C8N vs EP2A25F672C9N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2A25F672C8N بواسطة Intel و EP2A25F672C9N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2A25F672C8N | EP2A25F672C9N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | Obsolete |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | Approx. 900000 |
| Logic Elements / Cells | 24,320 | 24320 |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | 2.23 ns |
| User I/Os | 492 | — |
| العلبة | 672-ball FC-FBGA (FineLine BGA) | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | — |
| درجة حرارة التشغيل | 0 C to 85 C (commercial) | 0 °C to +85 °C (commercial, C9 grade) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| حالة RoHS | Compliant | Compliant (per distributor listings) |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Maximum User I/O | — | 492 |
| Operating Frequency | — | 236 MHz |
| Core Supply Voltage (VCCINT) | — | 1.425 V to 1.575 V (nominal 1.5 V) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| Seated Height (max) | — | 2.100 mm |
| Logic Family | — | CMOS |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Interface | — | Serial / Parallel PROM, JTAG, passive parallel (enhanced) |
| Embedded Memory | — | Enhanced System Blocks (ESBs) for dual-port RAM |
| Design Software | — | Quartus II (v5.1 or later) |