EP2A25F672C8N vs EP2A25F672C9N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672C8N disebabkan oleh Intel dan EP2A25F672C9N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672C8N | EP2A25F672C9N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | Approx. 900000 |
| Logic Elements / Cells | 24,320 | 24320 |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | 2.23 ns |
| User I/Os | 492 | — |
| Kemasan | 672-ball FC-FBGA (FineLine BGA) | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | — |
| Suhu Operasi | 0 C to 85 C (commercial) | 0 °C to +85 °C (commercial, C9 grade) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Maximum User I/O | — | 492 |
| Operating Frequency | — | 236 MHz |
| Core Supply Voltage (VCCINT) | — | 1.425 V to 1.575 V (nominal 1.5 V) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| Seated Height (max) | — | 2.100 mm |
| Logic Family | — | CMOS |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Interface | — | Serial / Parallel PROM, JTAG, passive parallel (enhanced) |
| Embedded Memory | — | Enhanced System Blocks (ESBs) for dual-port RAM |
| Design Software | — | Quartus II (v5.1 or later) |