EP2A25F672C8N vs EP2A25F672C9N Perbandingan
Perbandingan bersamaan detil EP2A25F672C8N dari Intel dan EP2A25F672C9N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A25F672C8N | EP2A25F672C9N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | Approx. 900000 |
| Logic Elements / Cells | 24,320 | 24320 |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | 2.23 ns |
| User I/Os | 492 | — |
| Paket | 672-ball FC-FBGA (FineLine BGA) | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | — |
| Suhu Kerja | 0 C to 85 C (commercial) | 0 °C to +85 °C (commercial, C9 grade) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Maximum User I/O | — | 492 |
| Operating Frequency | — | 236 MHz |
| Core Supply Voltage (VCCINT) | — | 1.425 V to 1.575 V (nominal 1.5 V) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| Seated Height (max) | — | 2.100 mm |
| Logic Family | — | CMOS |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Interface | — | Serial / Parallel PROM, JTAG, passive parallel (enhanced) |
| Embedded Memory | — | Enhanced System Blocks (ESBs) for dual-port RAM |
| Design Software | — | Quartus II (v5.1 or later) |