EP2S180F1508C3 vs EP2S180F1020C3 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2S180F1508C3 بواسطة Intel و EP2S180F1020C3 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2S180F1508C3 | EP2S180F1020C3 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Unknown | Obsolete |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | Stratix II | Stratix II |
| Logic Array Blocks | 8,970 LABs | — |
| Gate Count | 180,000 gates | — |
| User I/Os | 1,170 I/Os | — |
| جهد التغذية | 1.15 V to 1.25 V | — |
| العلبة | 1508-BBGA, FCBGA | 1020-ball FBGA (flip-chip BGA) |
| Supplier Device Package | 1508-FBGA (30x30 mm) | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Number of Terminals | 1,508 | — |
| Package Code | BGA | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | Commercial (0C to +85C) |
| Logic Elements | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| Transceivers | [DATA_NEEDED: transceiver count and speed] | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 status] | — |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Logic Array Blocks (LABs) | — | 8,970 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C3 |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |