EP2S180F1508C3 vs EP2S180F1020C3 比較

詳細並排比較 EP2S180F1508C3 由 Intel 與 EP2S180F1020C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2S180F1508C3 EP2S180F1020C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Unknown Obsolete
Product Type Field Programmable Gate Array (FPGA) —
Series Stratix II Stratix II
Logic Array Blocks 8,970 LABs —
Gate Count 180,000 gates —
User I/Os 1,170 I/Os —
供應電壓 1.15 V to 1.25 V —
封裝 1508-BBGA, FCBGA 1020-ball FBGA (flip-chip BGA)
Supplier Device Package 1508-FBGA (30x30 mm) —
安裝類型 Surface Mount Surface Mount
Terminal Form Ball —
Number of Terminals 1,508 —
Package Code BGA —
工作溫度 [DATA_NEEDED: operating temperature range] Commercial (0C to +85C)
Logic Elements [DATA_NEEDED: logic element count] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
Transceivers [DATA_NEEDED: transceiver count and speed] —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 status] —
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Logic Array Blocks (LABs) — 8,970
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
Process Node — 90 nm, all-layer copper SRAM
Core Voltage — 1.2 V
Speed Grade — C3
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

資料表與資源

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