EP2S180F1508C3 vs EP2S180F1020C3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1508C3 disebabkan oleh Intel dan EP2S180F1020C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2S180F1508C3 EP2S180F1020C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Unknown Obsolete
Product Type Field Programmable Gate Array (FPGA) —
Series Stratix II Stratix II
Logic Array Blocks 8,970 LABs —
Gate Count 180,000 gates —
User I/Os 1,170 I/Os —
Tegangan Pemberi Arus 1.15 V to 1.25 V —
Kemasan 1508-BBGA, FCBGA 1020-ball FBGA (flip-chip BGA)
Supplier Device Package 1508-FBGA (30x30 mm) —
Jenis Pemasangan Surface Mount Surface Mount
Terminal Form Ball —
Number of Terminals 1,508 —
Package Code BGA —
Suhu Operasi [DATA_NEEDED: operating temperature range] Commercial (0C to +85C)
Logic Elements [DATA_NEEDED: logic element count] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
Transceivers [DATA_NEEDED: transceiver count and speed] —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 status] —
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Logic Array Blocks (LABs) — 8,970
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
Process Node — 90 nm, all-layer copper SRAM
Core Voltage — 1.2 V
Speed Grade — C3
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

Laporan Datasheet & Sumber

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