EP3SE260H780C3N vs EP3SE260H780C3 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3SE260H780C3N بواسطة Intel و EP3SE260H780C3 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3SE260H780C3N | EP3SE260H780C3 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Series | Stratix® III E | EP3SE |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Number of LABs/CLBs | 10,200 | — |
| User I/Os | 488 | 488 |
| Number of Pins / Balls | 780 | — |
| العلبة | 780-BBGA, FCBGA (H780) | 780-ball FCBGA (HBGA), flip-chip |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| درجة حرارة التشغيل | 0 °C to +85 °C (C grade, commercial) | Commercial, 0C to +85C |
| Process Technology | 40 nm CMOS | 65 nm CMOS |
| Maximum Core Frequency | [DATA_NEEDED: maximum core frequency MHz] | 500 MHz |
| Supply Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal V] | — |
| Transceivers | [DATA_NEEDED: number of embedded transceivers and max data rate] | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks and precision] | — |
| حالة RoHS | Compliant (lead-free 'N' suffix) | Compliant (per product listings) |
| مستوى حساسية الرطوبة (MSL) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | 3 (168 hours) |
| Configuration Method | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel | — |
| Design Toolchain | Altera Quartus II (legacy); Intel Quartus Prime | — |
| Device Family | — | Stratix III Enhanced (Stratix III E) |
| Logic Elements | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10200 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Operating Voltage (Core) | — | 0.9 V |
| Operating Voltage (Auxiliary) | — | 1.1 V |
| Speed Grade | — | C3 |
| Packaging Type | — | Tray |
| Configuration Memory Support | — | Fast passive parallel, JTAG, Active Serial |