EP3SE260H780C3N vs EP3SE260H780C3 比較
詳細並排比較 EP3SE260H780C3N 由 Intel 與 EP3SE260H780C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780C3N | EP3SE260H780C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | Stratix® III E | EP3SE |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Number of LABs/CLBs | 10,200 | — |
| User I/Os | 488 | 488 |
| Number of Pins / Balls | 780 | — |
| 封裝 | 780-BBGA, FCBGA (H780) | 780-ball FCBGA (HBGA), flip-chip |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| 工作溫度 | 0 °C to +85 °C (C grade, commercial) | Commercial, 0C to +85C |
| Process Technology | 40 nm CMOS | 65 nm CMOS |
| Maximum Core Frequency | [DATA_NEEDED: maximum core frequency MHz] | 500 MHz |
| Supply Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal V] | — |
| Transceivers | [DATA_NEEDED: number of embedded transceivers and max data rate] | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks and precision] | — |
| RoHS 狀態 | Compliant (lead-free 'N' suffix) | Compliant (per product listings) |
| 濕度敏感等級 (MSL) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | 3 (168 hours) |
| Configuration Method | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel | — |
| Design Toolchain | Altera Quartus II (legacy); Intel Quartus Prime | — |
| Device Family | — | Stratix III Enhanced (Stratix III E) |
| Logic Elements | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10200 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Operating Voltage (Core) | — | 0.9 V |
| Operating Voltage (Auxiliary) | — | 1.1 V |
| Speed Grade | — | C3 |
| Packaging Type | — | Tray |
| Configuration Memory Support | — | Fast passive parallel, JTAG, Active Serial |