K9PRGY8S7M vs K9ADGD8S0A مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ K9PRGY8S7M بواسطة Samsung Electronics و K9ADGD8S0A بواسطة Samsung Electronics. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Samsung Electronics
K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics
K9PRGY8S7M ✓ نشطSamsung Electronics
K9ADGD8S0A - 3D V-NAND TCAT Flash Memory Die | Samsung
K9ADGD8S0A ✗ انتهى عمره الإنتاجيمقارنة المواصفات
| المعامل | K9PRGY8S7M | K9ADGD8S0A |
|---|---|---|
| العلامة التجارية | Samsung Electronics | Samsung Electronics |
| الفئة | Memory ICs | EEPROM |
| حالة دورة الحياة | نشط | نهاية العمر الإنتاجي |
| نوع الذاكرة | NAND Flash | — |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| Density | [DATA_NEEDED: density] | — |
| التنظيم | [DATA_NEEDED: organization] | — |
| نوع الواجهة | [DATA_NEEDED: interface type] | — |
| جهد التغذية | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: supply voltage] |
| Page Size | [DATA_NEEDED: page size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: block size] | — |
| Program/Erase Cycles | [DATA_NEEDED: P/E cycles] | [DATA_NEEDED: endurance] |
| Access Time | [DATA_NEEDED: access time] | — |
| Package Type | BGA (surface mount) | — |
| Package Pin/Ball Count | [DATA_NEEDED: ball count] | — |
| نوع التركيب | Surface Mount | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature] |
| حالة RoHS | [DATA_NEEDED: RoHS status] | — |
| مستوى MSL | [DATA_NEEDED: MSL level] | — |
| Device Type | — | 3D V-NAND flash memory bare die |
| Process Technology | — | Terabit Cell Array Transistor (TCAT) |
| Architecture | — | 3D vertical NAND (V-NAND) |
| Form Factor | — | Bare die (unpackaged) |
| Found In | — | Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages |
| Known Application | — | Samsung 850 Pro 128 GB SSD |
| Memory Class | — | Non-volatile NAND flash |
| Documented By | — | TechInsights report SAR-1407-802 |
| Capacity | — | [DATA_NEEDED: die capacity] |
| الواجهة | — | [DATA_NEEDED: interface type] |
| العلبة | — | [DATA_NEEDED: package] |