K9PRGY8S7M vs K9ADGD8S0A Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci K9PRGY8S7M disebabkan oleh Samsung Electronics dan K9ADGD8S0A disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Samsung Electronics
K9PRGY8S7M K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics

K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics

K9PRGY8S7M ✓ Aktif
Samsung Electronics
K9ADGD8S0A K9ADGD8S0A - 3D V-NAND TCAT Flash Memory Die | Samsung

K9ADGD8S0A - 3D V-NAND TCAT Flash Memory Die | Samsung

K9ADGD8S0A ✗ Akhir Hayat

Pengandingan Spesifikasi

Parametr K9PRGY8S7M K9ADGD8S0A
Merek Samsung Electronics Samsung Electronics
Kategori Memory ICs EEPROM
Status Lingkungan Hidup Aktif Akhir Hidup
Jenis Ingatan NAND Flash —
Manufacturer Samsung Electronics Samsung Electronics
Density [DATA_NEEDED: density] —
Organisasi [DATA_NEEDED: organization] —
Jenis Antaramuka [DATA_NEEDED: interface type] —
Tegangan Pemberi Arus [DATA_NEEDED: supply voltage] [DATA_NEEDED: supply voltage]
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block size] —
Program/Erase Cycles [DATA_NEEDED: P/E cycles] [DATA_NEEDED: endurance]
Access Time [DATA_NEEDED: access time] —
Package Type BGA (surface mount) —
Package Pin/Ball Count [DATA_NEEDED: ball count] —
Jenis Pemasangan Surface Mount —
Suhu Operasi [DATA_NEEDED: operating temperature] [DATA_NEEDED: operating temperature]
Status RoHS [DATA_NEEDED: RoHS status] —
Aras MSL [DATA_NEEDED: MSL level] —
Device Type — 3D V-NAND flash memory bare die
Process Technology — Terabit Cell Array Transistor (TCAT)
Architecture — 3D vertical NAND (V-NAND)
Form Factor — Bare die (unpackaged)
Found In — Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages
Known Application — Samsung 850 Pro 128 GB SSD
Memory Class — Non-volatile NAND flash
Documented By — TechInsights report SAR-1407-802
Capacity — [DATA_NEEDED: die capacity]
Antaramuka — [DATA_NEEDED: interface type]
Kemasan — [DATA_NEEDED: package]

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga