K9PRGY8S7M vs K9ADGD8S0A 比較
詳細並排比較 K9PRGY8S7M 由 Samsung Electronics 與 K9ADGD8S0A 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics
K9PRGY8S7M ✓ 啟用中規格比較
| 參數 | K9PRGY8S7M | K9ADGD8S0A |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | EEPROM |
| 生命週期狀態 | 啟用中 | 停產終止 |
| 記憶體類型 | NAND Flash | — |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| Density | [DATA_NEEDED: density] | — |
| 組織 | [DATA_NEEDED: organization] | — |
| 介面類型 | [DATA_NEEDED: interface type] | — |
| 供應電壓 | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: supply voltage] |
| Page Size | [DATA_NEEDED: page size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: block size] | — |
| Program/Erase Cycles | [DATA_NEEDED: P/E cycles] | [DATA_NEEDED: endurance] |
| Access Time | [DATA_NEEDED: access time] | — |
| Package Type | BGA (surface mount) | — |
| Package Pin/Ball Count | [DATA_NEEDED: ball count] | — |
| 安裝類型 | Surface Mount | — |
| 工作溫度 | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature] |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| Device Type | — | 3D V-NAND flash memory bare die |
| Process Technology | — | Terabit Cell Array Transistor (TCAT) |
| Architecture | — | 3D vertical NAND (V-NAND) |
| Form Factor | — | Bare die (unpackaged) |
| Found In | — | Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages |
| Known Application | — | Samsung 850 Pro 128 GB SSD |
| Memory Class | — | Non-volatile NAND flash |
| Documented By | — | TechInsights report SAR-1407-802 |
| Capacity | — | [DATA_NEEDED: die capacity] |
| 介面 | — | [DATA_NEEDED: interface type] |
| 封裝 | — | [DATA_NEEDED: package] |