MPXC2011DT1 vs MPXC2012DT1 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPXC2011DT1 بواسطة NXP Semiconductors و MPXC2012DT1 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MPXC2011DT1 | MPXC2012DT1 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Pressure Sensors | Pressure Sensors |
| حالة دورة الحياة | نشط | NRND |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | — |
| Full-Scale Output | 25 mV typical at 10 V excitation | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation |
| Sensitivity | 2.5 mV/kPa typical | — |
| Excitation Voltage | 3 V DC to 10 V DC (10 V nominal) | 10 V DC typical |
| نوع الخرج | Analog Wheatstone bridge (ratiometric) | Wheatstone Bridge (analog mV) |
| العلبة | 4-SSIP Chip Pak module, side port | — |
| Port Style | Female, 3.25 mm (0.128 in) barbed side port | Side port, single barbed inlet |
| Termination Style | Through-hole PCB, 4 leads | Through-hole PCB (vertical mount) |
| درجة حرارة التشغيل | 0 °C to +85 °C | [DATA_NEEDED: operating temperature range] |
| Compensation | On-chip temperature compensated and calibrated | — |
| Technology | Piezoresistive silicon strain gauge | — |
| Module Dimensions | 7.6 mm x 12.8 mm nominal | — |
| نوع التركيب | Through-hole (PCB mount with side-port tubing) | Through-hole, vertical |
| حالة RoHS | [DATA_NEEDED: RoHS status not in web data] | [DATA_NEEDED: RoHS compliance status] |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Over Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Offset (Null) | — | 0 mV nominal at 10 V excitation |
| Bridge Resistance | — | [DATA_NEEDED: input/output bridge resistance] |
| Linearity | — | [DATA_NEEDED: linearity %FS] |
| Pressure Port Size | — | Female, 0.128 in (3.25 mm) side port |
| العلبة / الحالة | — | 4-SSIP Module (chip-pak, no gel) |
| Gel Protection | — | No (bare die in chip-pak cavity) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| مستوى MSL | — | Not applicable (through-hole sensor module) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |