MPXC2011DT1 vs MPXC2012DT1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPXC2011DT1 sa pamamagitan ng NXP Semiconductors at MPXC2012DT1 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP
MPXC2011DT1 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPXC2011DT1 | MPXC2012DT1 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Pressure Sensors | Pressure Sensors |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | — |
| Full-Scale Output | 25 mV typical at 10 V excitation | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation |
| Sensitivity | 2.5 mV/kPa typical | — |
| Excitation Voltage | 3 V DC to 10 V DC (10 V nominal) | 10 V DC typical |
| Type ng Output | Analog Wheatstone bridge (ratiometric) | Wheatstone Bridge (analog mV) |
| Packhaging | 4-SSIP Chip Pak module, side port | — |
| Port Style | Female, 3.25 mm (0.128 in) barbed side port | Side port, single barbed inlet |
| Termination Style | Through-hole PCB, 4 leads | Through-hole PCB (vertical mount) |
| Temperature na Operasyon | 0 °C to +85 °C | [DATA_NEEDED: operating temperature range] |
| Compensation | On-chip temperature compensated and calibrated | — |
| Technology | Piezoresistive silicon strain gauge | — |
| Module Dimensions | 7.6 mm x 12.8 mm nominal | — |
| Uri ng Pagpapasok | Through-hole (PCB mount with side-port tubing) | Through-hole, vertical |
| Tindminan RoHS | [DATA_NEEDED: RoHS status not in web data] | [DATA_NEEDED: RoHS compliance status] |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Over Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Offset (Null) | — | 0 mV nominal at 10 V excitation |
| Bridge Resistance | — | [DATA_NEEDED: input/output bridge resistance] |
| Linearity | — | [DATA_NEEDED: linearity %FS] |
| Pressure Port Size | — | Female, 0.128 in (3.25 mm) side port |
| Packhaging / Kaso | — | 4-SSIP Module (chip-pak, no gel) |
| Gel Protection | — | No (bare die in chip-pak cavity) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Level ng MSL | — | Not applicable (through-hole sensor module) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |